DE3913066A1 - Verfahren zur herstellung eines hermetisch dichten gehaeuses sowie nach diesem verfahren hergestelltes gehaeuse - Google Patents

Verfahren zur herstellung eines hermetisch dichten gehaeuses sowie nach diesem verfahren hergestelltes gehaeuse

Info

Publication number
DE3913066A1
DE3913066A1 DE3913066A DE3913066A DE3913066A1 DE 3913066 A1 DE3913066 A1 DE 3913066A1 DE 3913066 A DE3913066 A DE 3913066A DE 3913066 A DE3913066 A DE 3913066A DE 3913066 A1 DE3913066 A1 DE 3913066A1
Authority
DE
Germany
Prior art keywords
base plate
conductor tracks
cover cap
housing
cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE3913066A
Other languages
German (de)
English (en)
Other versions
DE3913066C2 (ja
Inventor
Horst Obermeier
Gerhard Brockmann
Edmund Freitag
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schoppe and Faeser GmbH
Original Assignee
Schoppe and Faeser GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schoppe and Faeser GmbH filed Critical Schoppe and Faeser GmbH
Priority to DE3913066A priority Critical patent/DE3913066A1/de
Publication of DE3913066A1 publication Critical patent/DE3913066A1/de
Application granted granted Critical
Publication of DE3913066C2 publication Critical patent/DE3913066C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H05K5/0095—Housing specially adapted for small components hermetically-sealed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/045—Hierarchy auxiliary PCB, i.e. more than two levels of hierarchy for daughter PCBs are important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)
DE3913066A 1989-04-21 1989-04-21 Verfahren zur herstellung eines hermetisch dichten gehaeuses sowie nach diesem verfahren hergestelltes gehaeuse Granted DE3913066A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE3913066A DE3913066A1 (de) 1989-04-21 1989-04-21 Verfahren zur herstellung eines hermetisch dichten gehaeuses sowie nach diesem verfahren hergestelltes gehaeuse

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3913066A DE3913066A1 (de) 1989-04-21 1989-04-21 Verfahren zur herstellung eines hermetisch dichten gehaeuses sowie nach diesem verfahren hergestelltes gehaeuse

Publications (2)

Publication Number Publication Date
DE3913066A1 true DE3913066A1 (de) 1990-11-08
DE3913066C2 DE3913066C2 (ja) 1992-09-03

Family

ID=6379103

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3913066A Granted DE3913066A1 (de) 1989-04-21 1989-04-21 Verfahren zur herstellung eines hermetisch dichten gehaeuses sowie nach diesem verfahren hergestelltes gehaeuse

Country Status (1)

Country Link
DE (1) DE3913066A1 (ja)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4102265A1 (de) * 1991-01-26 1992-07-30 Telefunken Electronic Gmbh Gehaeuse kfz-elektronik
WO1998049878A1 (en) * 1997-04-25 1998-11-05 Koninklijke Philips Electronics N.V. Method of manufacturing enveloped electric, electronic or electromechanical components of small dimensions
WO2001097348A1 (en) * 2000-06-16 2001-12-20 Saes Getters S.P.A. Water getter devices for laser amplifiers and process for the manufacture thereof
EP1261043A2 (en) * 2001-05-23 2002-11-27 SAES GETTERS S.p.A. Precursory system of water-absorbing devices for electroluminescent screens, production process and method of use thereof
WO2003103069A2 (en) * 2002-06-03 2003-12-11 Saes Getters S.P.A. Assembly comprising at least one support with deposit of getter material for use in electroluminescent organic screens
WO2008046401A1 (de) * 2006-10-20 2008-04-24 Conti Temic Microelectronic Gmbh Steuergerät für ein kraftfahrzeug
DE102008017553A1 (de) * 2008-04-07 2009-10-08 Siemens Aktiengesellschaft Elektronisches System
DE102005008750B4 (de) * 2004-03-24 2012-02-09 Hewlett-Packard Development Company, L.P. Struktur zum Enthalten von Trocknungsmitteln, Verfahren zum Herstellen und Verwendung der Struktur
DE102011056742A1 (de) 2011-05-09 2012-11-15 Conti Temic Microelectronic Gmbh Steuergerät mit einer Getterschicht zum Einsatz in einem Kraftfahrzeug
US10345165B2 (en) 2016-09-08 2019-07-09 Covidien Lp Force sensor for surgical devices
US10588231B2 (en) 2017-05-18 2020-03-10 Covidien Lp Hermetically sealed printed circuit boards
US10667408B2 (en) 2017-05-18 2020-05-26 Covidien Lp Fully encapsulated electronics and printed circuit boards
US10973142B2 (en) 2017-05-18 2021-04-06 Covidien Lp Hermetically sealed printed circuit boards

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD135026A1 (de) * 1978-03-16 1979-04-04 Herbert Bartuch Verfahren zum hermetischen verschluss von bauelementegehaeusen der elektronik
DE3442132C2 (ja) * 1984-11-17 1988-06-23 Messerschmitt-Boelkow-Blohm Gmbh, 8012 Ottobrunn, De

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD135026A1 (de) * 1978-03-16 1979-04-04 Herbert Bartuch Verfahren zum hermetischen verschluss von bauelementegehaeusen der elektronik
DE3442132C2 (ja) * 1984-11-17 1988-06-23 Messerschmitt-Boelkow-Blohm Gmbh, 8012 Ottobrunn, De

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"Dickschicht-Technik für dünne Budgets", IEE productronic 1983 Nr. 5, S. 8-10 *

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4102265A1 (de) * 1991-01-26 1992-07-30 Telefunken Electronic Gmbh Gehaeuse kfz-elektronik
WO1998049878A1 (en) * 1997-04-25 1998-11-05 Koninklijke Philips Electronics N.V. Method of manufacturing enveloped electric, electronic or electromechanical components of small dimensions
WO2001097348A1 (en) * 2000-06-16 2001-12-20 Saes Getters S.P.A. Water getter devices for laser amplifiers and process for the manufacture thereof
US6842473B2 (en) 2000-06-16 2005-01-11 Saes Getters S.P.A. Water getter devices for laser amplifiers and process for the manufacture thereof
CN1301577C (zh) * 2000-06-16 2007-02-21 工程吸气公司 激光放大器的吸水装置和制造这种装置的方法
EP1261043A2 (en) * 2001-05-23 2002-11-27 SAES GETTERS S.p.A. Precursory system of water-absorbing devices for electroluminescent screens, production process and method of use thereof
EP1261043A3 (en) * 2001-05-23 2004-01-02 SAES GETTERS S.p.A. Precursory system of water-absorbing devices for electroluminescent screens, production process and method of use thereof
WO2003103069A2 (en) * 2002-06-03 2003-12-11 Saes Getters S.P.A. Assembly comprising at least one support with deposit of getter material for use in electroluminescent organic screens
WO2003103069A3 (en) * 2002-06-03 2004-01-29 Getters Spa Assembly comprising at least one support with deposit of getter material for use in electroluminescent organic screens
DE102005008750B4 (de) * 2004-03-24 2012-02-09 Hewlett-Packard Development Company, L.P. Struktur zum Enthalten von Trocknungsmitteln, Verfahren zum Herstellen und Verwendung der Struktur
US8059407B2 (en) 2006-10-20 2011-11-15 Conti Temic Microelectronic Gmbh Control device for a motor vehicle
WO2008046401A1 (de) * 2006-10-20 2008-04-24 Conti Temic Microelectronic Gmbh Steuergerät für ein kraftfahrzeug
DE102008017553B4 (de) * 2008-04-07 2012-12-13 Siemens Aktiengesellschaft Elektronisches System
DE102008017553A1 (de) * 2008-04-07 2009-10-08 Siemens Aktiengesellschaft Elektronisches System
US9497875B2 (en) 2011-05-09 2016-11-15 Conti Temic Microelectronic Gmbh Control device with a getter layer for use in a motor vehicle
WO2012152271A1 (de) 2011-05-09 2012-11-15 Conti Temic Microelectronic Gmbh Steuergerät mit einer getterschicht zum einsatz in einem kraftfahrzeug
DE102011056742A1 (de) 2011-05-09 2012-11-15 Conti Temic Microelectronic Gmbh Steuergerät mit einer Getterschicht zum Einsatz in einem Kraftfahrzeug
DE102011056742B4 (de) 2011-05-09 2019-07-18 Conti Temic Microelectronic Gmbh Steuergerät mit einer Getterschicht in einem Kraftfahrzeug
US10345165B2 (en) 2016-09-08 2019-07-09 Covidien Lp Force sensor for surgical devices
US10648875B2 (en) 2016-09-08 2020-05-12 Covidien Lp Force sensor for surgical devices
US10588231B2 (en) 2017-05-18 2020-03-10 Covidien Lp Hermetically sealed printed circuit boards
US10667408B2 (en) 2017-05-18 2020-05-26 Covidien Lp Fully encapsulated electronics and printed circuit boards
US10973142B2 (en) 2017-05-18 2021-04-06 Covidien Lp Hermetically sealed printed circuit boards
US11304324B2 (en) 2017-05-18 2022-04-12 Covidien Lp Hermetically sealed printed circuit boards

Also Published As

Publication number Publication date
DE3913066C2 (ja) 1992-09-03

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OP8 Request for examination as to paragraph 44 patent law
8120 Willingness to grant licenses paragraph 23
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee