DE69203635T2 - Deckel für elektrische Bauelementenpackung. - Google Patents

Deckel für elektrische Bauelementenpackung.

Info

Publication number
DE69203635T2
DE69203635T2 DE69203635T DE69203635T DE69203635T2 DE 69203635 T2 DE69203635 T2 DE 69203635T2 DE 69203635 T DE69203635 T DE 69203635T DE 69203635 T DE69203635 T DE 69203635T DE 69203635 T2 DE69203635 T2 DE 69203635T2
Authority
DE
Germany
Prior art keywords
lid
electrical component
component packaging
packaging
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69203635T
Other languages
English (en)
Other versions
DE69203635D1 (de
Inventor
Robert Joseph Satriano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harris Corp
Original Assignee
Harris Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harris Corp filed Critical Harris Corp
Publication of DE69203635D1 publication Critical patent/DE69203635D1/de
Application granted granted Critical
Publication of DE69203635T2 publication Critical patent/DE69203635T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
DE69203635T 1991-03-21 1992-03-19 Deckel für elektrische Bauelementenpackung. Expired - Fee Related DE69203635T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/672,997 US5097319A (en) 1991-03-21 1991-03-21 Cover with through terminals for a hermetically sealed electronic package

Publications (2)

Publication Number Publication Date
DE69203635D1 DE69203635D1 (de) 1995-08-31
DE69203635T2 true DE69203635T2 (de) 1996-03-21

Family

ID=24700899

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69203635T Expired - Fee Related DE69203635T2 (de) 1991-03-21 1992-03-19 Deckel für elektrische Bauelementenpackung.

Country Status (4)

Country Link
US (1) US5097319A (de)
EP (1) EP0505193B1 (de)
JP (1) JPH05102333A (de)
DE (1) DE69203635T2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5808357A (en) 1992-06-02 1998-09-15 Fujitsu Limited Semiconductor device having resin encapsulated package structure
FR2791811B1 (fr) 1999-03-31 2002-06-14 Sofradir Composant electrique ou electronique encapsule de maniere etanche
US6873044B2 (en) * 2000-09-11 2005-03-29 Xytrans, Inc. Microwave monolithic integrated circuit package
RU2606212C1 (ru) * 2015-07-28 2017-01-10 Акционерное общество "Научно-производственное объединение измерительной техники" Герметичная колодка прецизионного высокотемпературного виброустойчивого прибора

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2439589A (en) * 1943-09-14 1948-04-13 Carl H Sundell Socket connection for radio tubes
US3831066A (en) * 1970-06-08 1974-08-20 Gen Electric Hermetically sealed semiconductor device with corrosion inhibited ferrous metal portions
US3771107A (en) * 1971-12-10 1973-11-06 Ibm Conductive metal powder connector
US3775645A (en) * 1972-08-08 1973-11-27 T Mccarthy Header assembly
US4249034A (en) * 1978-11-27 1981-02-03 General Electric Company Semiconductor package having strengthening and sealing upper chamber
FR2528627B1 (fr) * 1982-06-15 1985-06-07 Silicium Semiconducteur Ssc Boitier pour diode de puissance
US4903120A (en) * 1985-11-22 1990-02-20 Texas Instruments Incorporated Chip carrier with interconnects on lid
US4775917A (en) * 1985-12-03 1988-10-04 Wells Manufacturing Company Thermal compensated circuit board interconnect apparatus and method of forming the same
DE3610288A1 (de) * 1986-03-26 1987-10-01 Bbc Brown Boveri & Cie Leistungshalbleitermodul
US4771159A (en) * 1987-05-27 1988-09-13 Gte Government Systems Corporation Method of soldering leadless component carriers or the like
US4731130A (en) * 1987-05-27 1988-03-15 Gte Government Systems Corporation Soldering composition
US4818821A (en) * 1988-03-30 1989-04-04 Motorola Inc. Brazed leaded package

Also Published As

Publication number Publication date
US5097319A (en) 1992-03-17
DE69203635D1 (de) 1995-08-31
EP0505193B1 (de) 1995-07-26
EP0505193A1 (de) 1992-09-23
JPH05102333A (ja) 1993-04-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee