DE3913066A1 - Hermetically sealed housing for electronic circuits - has edge sealed by soldered layer that bonds cover to surface of circuit board with screen printed coating - Google Patents

Hermetically sealed housing for electronic circuits - has edge sealed by soldered layer that bonds cover to surface of circuit board with screen printed coating

Info

Publication number
DE3913066A1
DE3913066A1 DE3913066A DE3913066A DE3913066A1 DE 3913066 A1 DE3913066 A1 DE 3913066A1 DE 3913066 A DE3913066 A DE 3913066A DE 3913066 A DE3913066 A DE 3913066A DE 3913066 A1 DE3913066 A1 DE 3913066A1
Authority
DE
Germany
Prior art keywords
base plate
conductor tracks
cover cap
housing
cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE3913066A
Other languages
German (de)
Other versions
DE3913066C2 (en
Inventor
Horst Obermeier
Gerhard Brockmann
Edmund Freitag
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schoppe and Faeser GmbH
Original Assignee
Schoppe and Faeser GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schoppe and Faeser GmbH filed Critical Schoppe and Faeser GmbH
Priority to DE3913066A priority Critical patent/DE3913066A1/en
Publication of DE3913066A1 publication Critical patent/DE3913066A1/en
Application granted granted Critical
Publication of DE3913066C2 publication Critical patent/DE3913066C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H05K5/0095—Housing specially adapted for small components hermetically-sealed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/045—Hierarchy auxiliary PCB, i.e. more than two levels of hierarchy for daughter PCBs are important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

An electronic hybrid circuit is formed of components (13-16) mounted on a circuit board (12). External connectors to the circuit components is made by bridging wires (6a,2a) to terminals in the form of tracks (2,6) on a carrier plate (1). The circuit is enclosed with a hermentally sealed space created by a cover plate (17) that is sealed around the edges. The edge of the plate is bonded by a layer of soft solder (19) that forms two metal surface coatings (11,18) that are formed by screen printing. ADVANTAGE - Seals housing using process that avoids damage to comp-onents.

Description

Die Erfindung bezieht sich auf ein Verfahren zur Herstellung eines hermetisch dichten Gehäuses für Elektronikkomponenten ge­ mäß dem Oberbegriff des Anspruchs 1 sowie auf ein nach diesem Verfahren hergestelltes Gehäuse.The invention relates to a method of manufacture of a hermetically sealed housing for electronic components according to the preamble of claim 1 and to one according to this Process manufactured housing.

Der grundsätzliche Aufbau eines derartigen Gehäuses ist aus der deutschen Patentschrift 34 42 132, die die Verwendung eines speziellen Gettermaterials in Gehäusen zur Aufnahme von Elementen der Mikroelektronik betrifft, bekannt. Auf einer Grundplatte, die vorzugsweise aus Al2O3 besteht, haftet ein mikroelektronischer Baustein. Der Baustein ist über Bonddrähte mit auf der Grund­ platte angeordneten Leiterbahnen, die aus dem Inneren des Ge­ häuses herausführen, elektrisch verbunden. Mit der Grundplatte ist eine Abdeckkappe durch Lötstellen oder Schweißnähte verbun­ den. Der an sich vorhandene leere Innenraum ist mit Getterma­ terial wenigstens teilweise gefüllt. Das Gettermaterial dient dazu, korrodierende Gase und störende Feuchtigkeit unschädlich zu machen. Beim Verbinden der Grundplatte mit der Abdeckkappe durch Schweißen oder durch Glaslot besteht die Gefahr, daß die Elektronikkomponenten durch die für die Verbindung erforderlichen hohen Temperaturen beschädigt werden.The basic structure of such a housing is known from German Patent 34 42 132, which relates to the use of a special getter material in housings for receiving elements of microelectronics. A microelectronic component adheres to a base plate, which preferably consists of Al 2 O 3 . The module is electrically connected via bond wires with conductor tracks arranged on the base plate, which lead out of the interior of the housing. A cover cap is connected to the base plate by soldering points or welds. The existing empty interior is at least partially filled with Getterma material. The getter material serves to render corrosive gases and disruptive moisture harmless. When the base plate is connected to the cover cap by welding or by glass solder, there is a risk that the electronic components will be damaged by the high temperatures required for the connection.

Der Erfindung liegt die Aufgabe zugrunde, ein Verfahren zur Her­ stellung eines hermetisch dichten Gehäuses für Elektronikkompo­ nenten anzugeben, das eine Verbindung von Grundplatte und Abdeck­ kappe bei Temperaturen erlaubt, die so niedrig sind, daß die Elektronikelemente beim Verbinden von Grundplatte und Abdeck­ kappe nicht gefährdet sind, und ein nach diesem Verfahren herge­ stelltes Gehäuse zu schaffen.The invention has for its object a method for Her position of a hermetically sealed housing for electronic compo Specify the connection between the base plate and cover cap allowed at temperatures so low that the Electronic elements when connecting base plate and cover cap are not at risk, and a by this procedure to create a housing.

Diese Aufgabe wird hinsichtlich des Verfahrens durch den An­ spruch 1 gelöst und durch die Ansprüche 2 und 3 ausgestaltet. Hinsichtlich des Gehäuses wird die Aufgabe durch den Anspruch 4 gelöst und durch die Ansprüche 5 bis 7 weitergebildet. Durch die Erfindung ist einerseits eine kostengünstige Massenproduktion von hermetisch dichten Gehäusen möglich. Andererseits lassen sich Kleinserien von hermetisch dichten Gehäusen herstellen, bei denen die aus dem Inneren der Gehäuse herausführenden Leiterbahnen in unterschiedlicher Weise angeordnet werden können, ohne daß je­ weils erneut hohe Werkzeugkosten anfallen. Elektrische Schir­ mungen sind durch Verwendung von flächigen Elektroden auf der Grundplatte und - sofern die Abdeckkappe aus einem nichtleitenden Werkstoff besteht - auf der Abdeckkappe leicht möglich.This task is performed by the An solved solution 1 and designed by claims 2 and 3. With regard to the housing, the object is achieved by claim 4 solved and developed by claims 5 to 7. Through the On the one hand, invention is an inexpensive mass production of hermetically sealed housings possible. On the other hand, Manufacture small series of hermetically sealed housings where the conductor tracks leading out of the interior of the housing can be arranged in different ways without ever because there are high tool costs again. Electric umbrella measurements are by using flat electrodes on the Base plate and - if the cover cap from a non-conductive Material exists - easily possible on the cover cap.

Die Erfindung wird im folgenden anhand eines in den Zeichnungen dargestellten Ausführungsbeispiels näher erläutert. Es zeigenThe invention is described below with reference to one in the drawings illustrated embodiment explained in more detail. Show it

Fig. 1 einen Schnitt durch ein Gehäuse, das nach dem erfindungs­ gemäßen Verfahren hergestellt ist, Fig. 1 shows a section through a housing which is prepared by the process according to Inventive,

Fig. 2 einen weiteren Schnitt durch das in der Fig. 1 geschnit­ ten dargestellte Gehäuse und Fig. 2 shows a further section through the housing shown in FIG

Fig. 3 eine Seitenansicht des in den Fig. 1 und 2 geschnitten dargestellten Gehäuses. Fig. 3 is a side view of the housing shown in section in Figs. 1 and 2.

Gleiche Bauteile sind mit den gleichen Bezugszeichen versehen. The same components are provided with the same reference numerals.  

Die Fig. 1 und 2 zeigen zwei verschiedene Schnitte durch ein nach dem erfindungsgemäßen Verfahren hergestelltes Gehäuse, dessen Seitenansicht die Fig. 3 zeigt. Die Fig. 1 zeigt einen Schnitt entlang der in der Fig. 2 dargestellten Linie A - B, und die Fig. 2 einen Schnitt entlang der in der Fig. 1 darge­ stellten Linie C - D. Auf einer Grundplatte 1, die aus einem isolierenden Material, wie z. B. Keramik, besteht, sind Leiter­ bahnen 2 bis 9 aus bondfähigem Metall aufgebracht. Auf die mit den Leiterbahnen 2 bis 9 versehene Grundplatte 1 ist eine um­ laufende Schicht 10 aus elektrisch isolierendem Material aufge­ bracht. Die Dicke der Schicht 10 ist mindestens doppelt so groß wie diejenige der Leiterbahnen 2 bis 9. Auf die umlaufende iso­ lierende Schicht 10 ist eine lötfähige Metallisierung 11 aufge­ bracht. Eine Leiterplatte 12, die hier nur schematisch darge­ stellte Elektronikkomponenten 13 bis 16 trägt, ist auf der Grund­ platte 1 befestigt. Bei den Elektronikkomponenten handelt es sich z. B. um Halbleiterelemente, Dünnfilmschaltungen oder integrierte Schaltkreise. Die elektrischen Anschlüsse der Elektronikkomponen­ ten 13 bis 16 sind über in der Fig. 1 aus Gründen der Übersicht­ lichkeit nicht dargestellte Leiterbahnen auf der Leiterplatte 12 an deren Rand geführt und dort durch Bonddrähte 2 a bis 9 a inner­ halb des Gehäuses mit den Leiterbahnen 2 bis 9 auf der Grund­ platte 1 verbunden. Figs. 1 and 2 show two different sections through a product manufactured by the inventive process housing whose side view showing the FIG. 3. Fig. 1 shows a section along the line A - B shown in FIG. 2, and Fig. 2 shows a section along the line C - D shown in Fig. 1. On a base plate 1 , which is made of an insulating material, such as. B. ceramic, there are tracks 2 to 9 applied from bondable metal. On the provided with the conductor tracks 2 to 9 base plate 1 is brought up to a running layer 10 made of electrically insulating material. The thickness of the layer 10 is at least twice as large as that of the conductor tracks 2 to 9 . On the circumferential insulating layer 10 , a solderable metallization 11 is brought up. A circuit board 12 , which here only schematically Darge presented electronic components 13 to 16 carries, is attached to the base plate 1 . The electronic components are e.g. B. semiconductor elements, thin film circuits or integrated circuits. The electrical connections of the electronic components th 13 to 16 are guided in FIG. 1 for the sake of clarity, not shown conductor tracks on the circuit board 12 on the edge thereof and there by bonding wires 2 a to 9 a inside half of the housing with the conductor tracks 2 to 9 connected to the base plate 1 .

In den Fig. 2 und 3 ist zusätzlich zu der Grundplatte 1 auch die Abdeckkappe 17 dargestellt. In diesem Ausführungsbeispiel besteht die Abdeckkappe 17 wie die Grundplatte 1 aus einem iso­ lierenden Material. Die Abdeckkappe 17 ist in ihrem Randbereich mit einer lötfähigen Metallisierung 18 versehen. Die Abdeckkappe 17 ist durch eine Weichlötung mit der Grundplatte 1 verbunden. Die die Verbindung herstellende Weichlotschicht ist mit dem Be­ zugszeichen 19 versehen. In FIGS. 2 and 3, the cap 17 is shown in addition to the base plate 1. In this embodiment, the cap 17 as the base plate 1 is made of an insulating material. The cover cap 17 is provided with a solderable metallization 18 in its edge region. The cover cap 17 is connected to the base plate 1 by soft soldering. The soft solder layer producing the connection is provided with the reference number 19 .

Wie die Fig. 2 zeigt, weist die Abdeckkappe 17 eine Ausnehmung auf, die mit Gettermaterial 20 gefüllt ist. Das Gettermaterial 20 ist durch eine Folie 21 fixiert, die aus einem feuchtigkeitsun­ durchlässigen Material besteht und das Gettermaterial gegen eine vorzeitige Feuchtigkeitsaufnahme schützt.As FIG. 2 shows, the cover cap 17 has a recess which is filled with getter material 20 . The getter material 20 is fixed by a film 21 , which consists of a moisture-permeable material and protects the getter material against premature moisture absorption.

Im folgenden werden die Verfahrensschritte für die Herstellung eines Gehäuses nach dem erfindungsgemäßen Verfahren beschrieben.The following are the manufacturing process steps described a housing according to the inventive method.

Auf die Grundplatte 1 werden zunächst die Leiterbahnen 2 bis 9 aus bondfähigem Metall aufgebracht. Danach werden die isolierende Schicht 10 und darüber die Metallisierungsschicht 11 aufgebracht. Das Aufbringen der isolierenden Schicht 10 und der Metallisie­ rungsschicht 11 erfolgt in vorteilhafter Weise nach dem Sieb­ druckverfahren. Die Abdeckkappe 17 wird mit der aus lötfähigem Metall bestehenden Schicht 18 versehen. In die Aussparung der Abdeckkappe 17 wird Gettermaterial 20 eingefüllt und die Aus­ sparung mit der Folie 21 verschlossen. Die mit den Elektronik­ komponenten 13 bis 16 versehene Leiterplatte 12 wird auf der Grundplatte 1 mechanisch befestigt. Daran anschließend erfolgt die elektrische Verbindung zwischen den Leiterbahnen 2 bis 9 und den zugeordneten Anschlußflächen auf der Leiterplatte 12 durch Herstellung der Bondverbindungen 2 a bis 9 a. Die Verbindung der Grundplatte 1 mit der Abdeckkappe 17 zu einem hermetisch dichten Gehäuse erfolgt jetzt durch Weichlöten. Vor dem Auflöten der Ab­ deckkappe 17 auf die Grundplatte 1 wird die Folie 21 perforiert. Diese Maßnahme hat den Vorteil, daß die vorbereiteten Abdeck­ kappen gelagert werden können, ohne daß das Gettermaterial 20 beginnt, vorzeitig Feuchtigkeit aus der Umgebung aufzunehmen.The conductor tracks 2 to 9 made of bondable metal are first applied to the base plate 1 . The insulating layer 10 and then the metallization layer 11 are then applied. The application of the insulating layer 10 and the metallization layer 11 is advantageously carried out by the screen printing method. The cover cap 17 is provided with the layer 18 consisting of solderable metal. Getter material 20 is poured into the recess in the cover cap 17 and the cutout is sealed with the film 21 . The provided with the electronic components 13 to 16 circuit board 12 is mechanically attached to the base plate 1 . This is followed by the electrical connection between the conductor tracks 2 to 9 and the associated connection areas on the printed circuit board 12 by producing the bond connections 2 a to 9 a . The connection of the base plate 1 with the cap 17 to a hermetically sealed housing is now carried out by soft soldering. Before soldering the top cap 17 onto the base plate 1 , the film 21 is perforated. This measure has the advantage that the prepared cover caps can be stored without the getter material 20 beginning to absorb moisture from the environment prematurely.

Die Leiterbahnen 2 bis 9, die isolierende Schicht 10 und die Metallisierungsschichten 11 und 18 werden in vorteilhafter Weise im Siebdruckverfahren aufgebracht. The conductor tracks 2 to 9 , the insulating layer 10 and the metallization layers 11 and 18 are advantageously applied in a screen printing process.

Für die Abdeckkappe 17 wird ein Material verwendet, dessen thermisches Ausdehnungsverhalten demjenigen des für die Grund­ platte 1 verwendeten Materials angepaßt ist. Die Abdeckkappe 17 kann sowohl aus Metall als auch aus einem isolierenden Material bestehen.For the cap 17 , a material is used whose thermal expansion behavior is adapted to that of the material used for the base plate 1 . The cover cap 17 can consist of both metal and an insulating material.

Durch die Metallisierungsschicht 11 auf der Grundplatte 1 und die Metallisierungsschicht 18 auf der Abdeckkappe 17 (sofern die Abdeckkappe 17 nicht bereits aus einem lötfähigen Material be­ steht) ist es möglich, die beiden Gehäusehälften durch eine Weichlötung bei einer Temperatur zu verbinden, die so niedrig ist, daß die Elektronikelemente 13 bis 16 in thermischer Hinsicht während des Verbindungsvorganges nicht gefährdet sind.Through the metallization layer 11 on the base plate 1 and the metallization layer 18 on the cover cap 17 (unless the cover cap 17 is already made of a solderable material), it is possible to connect the two housing halves by soft soldering at a temperature which is so low that the electronic elements 13 to 16 are not thermally endangered during the connection process.

Claims (7)

1. Verfahren zur Herstellung eines hermetisch dichten Gehäuses für Elektronikkomponenten, das aus einer die Elektronikkomponen­ ten tragenden isolierenden Grundplatte und einer mit dieser durch Löten verbundenen Abdeckkappe besteht und Leiterbahnen aufweist, die aus dem Inneren des Gehäuses herausführen und als elektrische Anschlüsse dienen, dadurch gekennzeichnet,
  • - daß auf die Grundplatte (1) Leiterbahnen (2 bis 9) aus bond­ fähigem Metall aufgebracht werden,
  • - daß im Auflagebereich der Abdeckkappe (17) auf die mit den Leiterbahnen (2 bis 9) versehene Grundplatte (1) eine umlau­ fende Schicht (10) aus elektrisch isolierendem Material aufge­ bracht wird, deren Dicke mindestens doppelt so groß wie die­ jenige der Leiterbahnen (2 bis 9) ist,
  • - daß auf die umlaufende isolierende Schicht (10) auf der Grund­ platte (1) eine lötfähige Metallisierung (11) aufgebracht wird,
  • - daß eine die Elektronikkomponenten tragende Leiterplatte (12) auf der Grundplatte (1) befestigt wird,
  • - daß die elektrischen Anschlußflächen der Leiterplatte (12) durch Bonddrähte (2 a bis 9 a) mit den Leiterbahnen (2 bis 9) der Grundplatte (1) verbunden werden und
  • - daß die aus einem lötfähigen Metall bestehende oder in ihrem Randbereich mit einer lötfähigen Metallisierung (18) versehene Abdeckkappe (17) mit der Grundplatte (1) durch eine Weich­ lötung verbunden wird.
1. A method for producing a hermetically sealed housing for electronic components, which consists of an insulating base plate carrying the electronic components and a cover cap connected to it by soldering and has conductor tracks which lead out of the interior of the housing and serve as electrical connections, characterized in that
  • - That conductor tracks ( 2 to 9 ) made of bondable metal are applied to the base plate ( 1 ),
  • - That in the support area of the cap ( 17 ) on the with the conductor tracks ( 2 to 9 ) provided base plate ( 1 ) a umlau fende layer ( 10 ) of electrically insulating material is brought up, the thickness of which is at least twice as large as that of the conductor tracks ( 2 to 9 ),
  • - That on the circumferential insulating layer ( 10 ) on the base plate ( 1 ) a solderable metallization ( 11 ) is applied,
  • - That a circuit board ( 12 ) carrying the electronic components is attached to the base plate ( 1 ),
  • - That the electrical connection surfaces of the circuit board ( 12 ) are connected by bonding wires ( 2 a to 9 a ) with the conductor tracks ( 2 to 9 ) of the base plate ( 1 ) and
  • - That the existing of a solderable metal or in its edge area with a solderable metallization ( 18 ) provided cap ( 17 ) with the base plate ( 1 ) is connected by soft soldering.
2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die Leiterbahnen (2 bis 9), die isolierende Schicht (10) und die Metallisierungsschichten (11, 18) im Siebdruckverfahren aufge­ bracht werden. 2. The method according to claim 1, characterized in that the conductor tracks ( 2 to 9 ), the insulating layer ( 10 ) and the metallization layers ( 11 , 18 ) are brought up in the screen printing process. 3. Verfahren nach Anspruch 1 oder Anspruch 2, dadurch gekenn­ zeichnet, daß im Innenraum der Abdeckkappe (17) Gettermaterial (20) durch eine Folie (21) feuchtigkeitsgeschützt fixiert wird und daß die Folie (21) erst unmittelbar vor dem Auflöten der Abdeckkappe (17) auf die Grundplatte (1) perforiert wird.3. The method according to claim 1 or claim 2, characterized in that in the interior of the cover cap ( 17 ) getter material ( 20 ) is fixed in a moisture-proof manner by a film ( 21 ) and that the film ( 21 ) only immediately before the cover cap is soldered on ( 17 ) is perforated on the base plate ( 1 ). 4. Hermetisch dichtes Gehäuse für Elektronikkomponenten mit einer die Elektronikkomponenten tragenden isolierenden Grundplatte und mit einer mit dieser durch eine Lötverbindung verbundenen Abdeck­ kappe, wobei die Grundplatte mit Leiterbahnen versehen ist, die aus dem Inneren des Gehäuses herausführen und als elektrische Anschlüsse dienen, das nach Anspruch 1 hergestellt ist, dadurch gekennzeichnet,
  • - daß im Auflagebereich der Abdeckkappe (17) auf die mit den Leiterbahnen (2 bis 9) versehene Grundplatte (1) eine umlau­ fende Schicht (10) aus elektrisch isolierendem Material auf­ gebracht ist, deren Dicke mindestens doppelt so groß wie die­ jenige der Leiterbahnen (2 bis 9) ist,
  • - daß die umlaufende isolierende Schicht (10) auf der Grund­ platte (1) mit einer lötfähigen Metallisierung (11) versehen ist,
  • - daß die Grundplatte im Bereich der lötfähigen Metallisierung mit einer Abdeckkappe (17) aus lötfähigem Metall oder mit einer Abdeckkappe aus nichtleitendem Werkstoff, deren Auflagebereich mit einer lötfähigen Metallisierung (18) versehen ist, durch Weichlötung verbunden ist.
4. Hermetically sealed housing for electronic components with an insulating base plate carrying the electronic components and with a cover cap connected to it by a soldered connection, the base plate being provided with conductor tracks which lead out of the interior of the housing and serve as electrical connections 1 is produced, characterized in
  • - That in the contact area of the cap ( 17 ) on the with the conductor tracks ( 2 to 9 ) provided base plate ( 1 ) umlau fende layer ( 10 ) of electrically insulating material is brought on, the thickness of which is at least twice as large as that of the conductor tracks ( 2 to 9 ),
  • - That the circumferential insulating layer ( 10 ) on the base plate ( 1 ) with a solderable metallization ( 11 ) is provided,
  • - That the base plate in the area of the solderable metallization with a cover cap ( 17 ) made of solderable metal or with a cover cap made of non-conductive material, whose support area is provided with a solderable metallization ( 18 ), is connected by soft soldering.
5. Gehäuse nach Anspruch 4, dadurch gekennzeichnet, daß die Leiterbahnen (2 bis 9), die isolierende Schicht (10) und die Metallisierungsschichten (11, 18) im Siebdruck hergestellt sind. 5. Housing according to claim 4, characterized in that the conductor tracks ( 2 to 9 ), the insulating layer ( 10 ) and the metallization layers ( 11 , 18 ) are made by screen printing. 6. Gehäuse nach Anspruch 4 oder Anspruch 5, dadurch gekenn­ zeichnet, daß die Abdeckkappe (17) in ihrem Innenraum eine Aus­ sparung aufweist, in der Gettermaterial (20) durch eine Folie (21) feuchtigkeitsgeschützt fixiert ist, wobei die Folie (21) unmittelbar vor dem Verlöten von Grundplatte (1) und Abdeckkappe (17) perforiert wird.6. Housing according to claim 4 or claim 5, characterized in that the cover cap ( 17 ) in its interior has a saving, in the getter material ( 20 ) is fixed in a moisture-proof manner by a film ( 21 ), the film ( 21 ) is perforated immediately before soldering the base plate ( 1 ) and cover cap ( 17 ). 7. Gehäuse nach einem der Ansprüche 4 bis 6, dadurch gekenn­ zeichnet, daß das Ausdehnungsverhalten des für die Abdeckkappe (17) verwendeten Materials dem Ausdehnungsverhalten des für die Grundplatte (1) verwendeten Materials angepaßt ist.7. Housing according to one of claims 4 to 6, characterized in that the expansion behavior of the material used for the cover cap ( 17 ) is adapted to the expansion behavior of the material used for the base plate ( 1 ).
DE3913066A 1989-04-21 1989-04-21 Hermetically sealed housing for electronic circuits - has edge sealed by soldered layer that bonds cover to surface of circuit board with screen printed coating Granted DE3913066A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE3913066A DE3913066A1 (en) 1989-04-21 1989-04-21 Hermetically sealed housing for electronic circuits - has edge sealed by soldered layer that bonds cover to surface of circuit board with screen printed coating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3913066A DE3913066A1 (en) 1989-04-21 1989-04-21 Hermetically sealed housing for electronic circuits - has edge sealed by soldered layer that bonds cover to surface of circuit board with screen printed coating

Publications (2)

Publication Number Publication Date
DE3913066A1 true DE3913066A1 (en) 1990-11-08
DE3913066C2 DE3913066C2 (en) 1992-09-03

Family

ID=6379103

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3913066A Granted DE3913066A1 (en) 1989-04-21 1989-04-21 Hermetically sealed housing for electronic circuits - has edge sealed by soldered layer that bonds cover to surface of circuit board with screen printed coating

Country Status (1)

Country Link
DE (1) DE3913066A1 (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4102265A1 (en) * 1991-01-26 1992-07-30 Telefunken Electronic Gmbh HOUSING VEHICLE ELECTRONICS
WO1998049878A1 (en) * 1997-04-25 1998-11-05 Koninklijke Philips Electronics N.V. Method of manufacturing enveloped electric, electronic or electromechanical components of small dimensions
WO2001097348A1 (en) * 2000-06-16 2001-12-20 Saes Getters S.P.A. Water getter devices for laser amplifiers and process for the manufacture thereof
EP1261043A2 (en) * 2001-05-23 2002-11-27 SAES GETTERS S.p.A. Precursory system of water-absorbing devices for electroluminescent screens, production process and method of use thereof
WO2003103069A2 (en) * 2002-06-03 2003-12-11 Saes Getters S.P.A. Assembly comprising at least one support with deposit of getter material for use in electroluminescent organic screens
WO2008046401A1 (en) * 2006-10-20 2008-04-24 Conti Temic Microelectronic Gmbh Control unit for a motor vehicle
DE102008017553A1 (en) * 2008-04-07 2009-10-08 Siemens Aktiengesellschaft Electronic system for use in transportation medium e.g. motor vehicle, has space formed between housing and electronic component and filled with binding material to absorb water or aqueous fluid resulting from condensation in housing
DE102005008750B4 (en) * 2004-03-24 2012-02-09 Hewlett-Packard Development Company, L.P. Structure for containing desiccants, process for making and using the structure
WO2012152271A1 (en) 2011-05-09 2012-11-15 Conti Temic Microelectronic Gmbh Control device with a getter layer for use in a motor vehicle
US10345165B2 (en) 2016-09-08 2019-07-09 Covidien Lp Force sensor for surgical devices
US10588231B2 (en) 2017-05-18 2020-03-10 Covidien Lp Hermetically sealed printed circuit boards
US10667408B2 (en) 2017-05-18 2020-05-26 Covidien Lp Fully encapsulated electronics and printed circuit boards
US10973142B2 (en) 2017-05-18 2021-04-06 Covidien Lp Hermetically sealed printed circuit boards

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD135026A1 (en) * 1978-03-16 1979-04-04 Herbert Bartuch METHOD FOR THE HERMETIC CLOSURE OF COMPONENTS OF ELECTRONIC ELEMENTS
DE3442132C2 (en) * 1984-11-17 1988-06-23 Messerschmitt-Boelkow-Blohm Gmbh, 8012 Ottobrunn, De

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD135026A1 (en) * 1978-03-16 1979-04-04 Herbert Bartuch METHOD FOR THE HERMETIC CLOSURE OF COMPONENTS OF ELECTRONIC ELEMENTS
DE3442132C2 (en) * 1984-11-17 1988-06-23 Messerschmitt-Boelkow-Blohm Gmbh, 8012 Ottobrunn, De

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"Dickschicht-Technik für dünne Budgets", IEE productronic 1983 Nr. 5, S. 8-10 *

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4102265A1 (en) * 1991-01-26 1992-07-30 Telefunken Electronic Gmbh HOUSING VEHICLE ELECTRONICS
WO1998049878A1 (en) * 1997-04-25 1998-11-05 Koninklijke Philips Electronics N.V. Method of manufacturing enveloped electric, electronic or electromechanical components of small dimensions
WO2001097348A1 (en) * 2000-06-16 2001-12-20 Saes Getters S.P.A. Water getter devices for laser amplifiers and process for the manufacture thereof
US6842473B2 (en) 2000-06-16 2005-01-11 Saes Getters S.P.A. Water getter devices for laser amplifiers and process for the manufacture thereof
CN1301577C (en) * 2000-06-16 2007-02-21 工程吸气公司 Water getter devices for laser amplifiers and process for manufacture thereof
EP1261043A2 (en) * 2001-05-23 2002-11-27 SAES GETTERS S.p.A. Precursory system of water-absorbing devices for electroluminescent screens, production process and method of use thereof
EP1261043A3 (en) * 2001-05-23 2004-01-02 SAES GETTERS S.p.A. Precursory system of water-absorbing devices for electroluminescent screens, production process and method of use thereof
WO2003103069A2 (en) * 2002-06-03 2003-12-11 Saes Getters S.P.A. Assembly comprising at least one support with deposit of getter material for use in electroluminescent organic screens
WO2003103069A3 (en) * 2002-06-03 2004-01-29 Getters Spa Assembly comprising at least one support with deposit of getter material for use in electroluminescent organic screens
DE102005008750B4 (en) * 2004-03-24 2012-02-09 Hewlett-Packard Development Company, L.P. Structure for containing desiccants, process for making and using the structure
US8059407B2 (en) 2006-10-20 2011-11-15 Conti Temic Microelectronic Gmbh Control device for a motor vehicle
WO2008046401A1 (en) * 2006-10-20 2008-04-24 Conti Temic Microelectronic Gmbh Control unit for a motor vehicle
DE102008017553B4 (en) * 2008-04-07 2012-12-13 Siemens Aktiengesellschaft Electronic system
DE102008017553A1 (en) * 2008-04-07 2009-10-08 Siemens Aktiengesellschaft Electronic system for use in transportation medium e.g. motor vehicle, has space formed between housing and electronic component and filled with binding material to absorb water or aqueous fluid resulting from condensation in housing
US9497875B2 (en) 2011-05-09 2016-11-15 Conti Temic Microelectronic Gmbh Control device with a getter layer for use in a motor vehicle
DE102011056742A1 (en) 2011-05-09 2012-11-15 Conti Temic Microelectronic Gmbh Control unit with a getter layer for use in a motor vehicle
WO2012152271A1 (en) 2011-05-09 2012-11-15 Conti Temic Microelectronic Gmbh Control device with a getter layer for use in a motor vehicle
DE102011056742B4 (en) 2011-05-09 2019-07-18 Conti Temic Microelectronic Gmbh Control unit with a getter layer in a motor vehicle
US10345165B2 (en) 2016-09-08 2019-07-09 Covidien Lp Force sensor for surgical devices
US10648875B2 (en) 2016-09-08 2020-05-12 Covidien Lp Force sensor for surgical devices
US10588231B2 (en) 2017-05-18 2020-03-10 Covidien Lp Hermetically sealed printed circuit boards
US10667408B2 (en) 2017-05-18 2020-05-26 Covidien Lp Fully encapsulated electronics and printed circuit boards
US10973142B2 (en) 2017-05-18 2021-04-06 Covidien Lp Hermetically sealed printed circuit boards
US11304324B2 (en) 2017-05-18 2022-04-12 Covidien Lp Hermetically sealed printed circuit boards

Also Published As

Publication number Publication date
DE3913066C2 (en) 1992-09-03

Similar Documents

Publication Publication Date Title
DE3134557C2 (en)
DE69210183T2 (en) PACKING STRUCTURE FOR SEMICONDUCTOR ARRANGEMENT AND METHOD FOR THE PRODUCTION THEREOF
DE3733304A1 (en) DEVICE AND METHOD FOR SEALING A HERMETICALLY SEALED CERAMIC HOUSING WITH A CERAMIC LID
DE1640457C2 (en)
EP2038624B1 (en) Electric component comprising a sensor element and method for encapsulating a sensor element
DE3913066C2 (en)
DE19640466A1 (en) Metallic carrier part for electronic components or circuit carriers and method for producing the same
DE2132939A1 (en) Process for making thick film hybrid circuits
DE1489781A1 (en) Process for producing an electronic component and component produced according to this process
DE2724641C2 (en) Process for applying soldering to gold layers
DE3835767A1 (en) COOLING DEVICE FOR SEMICONDUCTOR MODULE
DE2639979B2 (en) Semiconductor module
DE3243689C2 (en)
DE3432449C2 (en)
WO2004073013A2 (en) Electronic component comprising a semiconductor chip and method for producing said component
EP0785563B1 (en) Method for fixing a first part of metal or ceramic to a second part of metal or ceramic
DE4300516C2 (en) Power semiconductor module
DE2824426C2 (en) Housing for encapsulating electrical and / or electronic components
DE3018846A1 (en) ELECTRONIC COMPONENT IN CHIP FORM AND METHOD FOR PRODUCING THE SAME
EP0484756A2 (en) SMD-type resistor arrangement
DE3040867A1 (en) SEMICONDUCTOR ADDITION AND METHOD FOR THEIR PRODUCTION
DE2028821B2 (en) HOUSING FOR A SEMICONDUCTOR COMPONENT
DE102015208529B3 (en) Electronic component and method for its manufacture
DE19749987B4 (en) Housing for semiconductor devices, in particular for power semiconductor components
DE69203635T2 (en) Lid for electrical component packaging.

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8120 Willingness to grant licenses paragraph 23
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee