DE3883809D1 - Direkt-Temperaturkontrolle eines Wafers. - Google Patents

Direkt-Temperaturkontrolle eines Wafers.

Info

Publication number
DE3883809D1
DE3883809D1 DE88102173T DE3883809T DE3883809D1 DE 3883809 D1 DE3883809 D1 DE 3883809D1 DE 88102173 T DE88102173 T DE 88102173T DE 3883809 T DE3883809 T DE 3883809T DE 3883809 D1 DE3883809 D1 DE 3883809D1
Authority
DE
Germany
Prior art keywords
wafer
temperature control
direct temperature
direct
control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE88102173T
Other languages
English (en)
Other versions
DE3883809T2 (de
Inventor
J B Price
Richard S Rosler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Balzers AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Balzers AG filed Critical Balzers AG
Publication of DE3883809D1 publication Critical patent/DE3883809D1/de
Application granted granted Critical
Publication of DE3883809T2 publication Critical patent/DE3883809T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G01K1/143—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations for measuring surface temperatures

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Vapour Deposition (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE88102173T 1987-03-02 1988-02-15 Direkt-Temperaturkontrolle eines Wafers. Expired - Fee Related DE3883809T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/020,278 US4788416A (en) 1987-03-02 1987-03-02 Direct wafer temperature control

Publications (2)

Publication Number Publication Date
DE3883809D1 true DE3883809D1 (de) 1993-10-14
DE3883809T2 DE3883809T2 (de) 1994-04-14

Family

ID=21797716

Family Applications (1)

Application Number Title Priority Date Filing Date
DE88102173T Expired - Fee Related DE3883809T2 (de) 1987-03-02 1988-02-15 Direkt-Temperaturkontrolle eines Wafers.

Country Status (4)

Country Link
US (1) US4788416A (de)
EP (1) EP0280952B1 (de)
JP (1) JP2563440B2 (de)
DE (1) DE3883809T2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5136978A (en) * 1989-10-30 1992-08-11 The United States Of America As Represented By The Secretary Of The Air Force Heat pipe susceptor for epitaxy
DE69111493T2 (de) * 1990-03-12 1996-03-21 Ngk Insulators Ltd Wafer-Heizgeräte für Apparate, zur Halbleiterherstellung Heizanlage mit diesen Heizgeräten und Herstellung von Heizgeräten.
US5016332A (en) * 1990-04-13 1991-05-21 Branson International Plasma Corporation Plasma reactor and process with wafer temperature control
US5536918A (en) * 1991-08-16 1996-07-16 Tokyo Electron Sagami Kabushiki Kaisha Heat treatment apparatus utilizing flat heating elements for treating semiconductor wafers
JP2984060B2 (ja) * 1994-09-01 1999-11-29 センサレー・コーポレーション 測温基板
US6084215A (en) * 1997-11-05 2000-07-04 Tokyo Electron Limited Semiconductor wafer holder with spring-mounted temperature measurement apparatus disposed therein
CA2574116A1 (en) * 2004-07-23 2006-01-26 Intellectual Property Bank Corp. Stage for holding silicon wafer substrate and method for measuring temperature of silicon wafer substrate
JP4998333B2 (ja) * 2008-03-08 2012-08-15 東京エレクトロン株式会社 温度測定装置、載置台構造及び熱処理装置
JP2014033148A (ja) * 2012-08-06 2014-02-20 Ulvac Japan Ltd 光照射装置
JP6513285B2 (ja) * 2016-03-28 2019-05-15 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置及び半導体装置の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3051813A (en) * 1960-08-24 1962-08-28 Gen Electric Temperature control systems
US3754118A (en) * 1971-02-12 1973-08-21 A Booker Flexible immersion heater
DE2414888C2 (de) * 1974-03-27 1983-08-25 Siemens AG, 1000 Berlin und 8000 München Einrichtung zur Temperaturmessung
US4632056A (en) * 1985-08-05 1986-12-30 Stitz Robert W CVD temperature control

Also Published As

Publication number Publication date
EP0280952A3 (en) 1990-03-21
US4788416A (en) 1988-11-29
DE3883809T2 (de) 1994-04-14
JPS63227013A (ja) 1988-09-21
EP0280952B1 (de) 1993-09-08
EP0280952A2 (de) 1988-09-07
JP2563440B2 (ja) 1996-12-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: MATERIALS RESEARCH CORP., ORANGEBURG, N.Y., US

8339 Ceased/non-payment of the annual fee
8327 Change in the person/name/address of the patent owner

Owner name: TOKYO ELECTRON LTD., TOKIO/TOKYO, JP

8328 Change in the person/name/address of the agent

Free format text: EISENFUEHR, SPEISER & PARTNER, 28195 BREMEN