DE3876376D1 - Kohlenstoff-verbinder fuer in fluessigkeit eingetauchte gekuehlte integrierte schaltung. - Google Patents

Kohlenstoff-verbinder fuer in fluessigkeit eingetauchte gekuehlte integrierte schaltung.

Info

Publication number
DE3876376D1
DE3876376D1 DE8888904311T DE3876376T DE3876376D1 DE 3876376 D1 DE3876376 D1 DE 3876376D1 DE 8888904311 T DE8888904311 T DE 8888904311T DE 3876376 T DE3876376 T DE 3876376T DE 3876376 D1 DE3876376 D1 DE 3876376D1
Authority
DE
Germany
Prior art keywords
submersible
liquid
integrated circuit
cooled integrated
carbon connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8888904311T
Other languages
English (en)
Other versions
DE3876376T2 (de
Inventor
Howard Milby
Jimmy Sanwo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NCR International Inc
Original Assignee
NCR International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NCR International Inc filed Critical NCR International Inc
Application granted granted Critical
Publication of DE3876376D1 publication Critical patent/DE3876376D1/de
Publication of DE3876376T2 publication Critical patent/DE3876376T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H01L23/445—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air the fluid being a liquefied gas, e.g. in a cryogenic vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)
DE8888904311T 1987-05-07 1988-04-22 Kohlenstoff-verbinder fuer in fluessigkeit eingetauchte gekuehlte integrierte schaltung. Expired - Fee Related DE3876376T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/046,764 US4800422A (en) 1987-05-07 1987-05-07 Frostless interface supercooled VLSI system
PCT/US1988/001290 WO1988009055A1 (en) 1987-05-07 1988-04-22 Carbon connectors to liquid-immersion cooled integrated circuit

Publications (2)

Publication Number Publication Date
DE3876376D1 true DE3876376D1 (de) 1993-01-14
DE3876376T2 DE3876376T2 (de) 1993-06-24

Family

ID=21945265

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8888904311T Expired - Fee Related DE3876376T2 (de) 1987-05-07 1988-04-22 Kohlenstoff-verbinder fuer in fluessigkeit eingetauchte gekuehlte integrierte schaltung.

Country Status (5)

Country Link
US (1) US4800422A (de)
EP (1) EP0314738B1 (de)
JP (1) JP2772654B2 (de)
DE (1) DE3876376T2 (de)
WO (1) WO1988009055A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2607490B2 (ja) * 1986-12-09 1997-05-07 キヤノン株式会社 画像形成装置の画質制御方法
US4950181A (en) * 1988-07-28 1990-08-21 Ncr Corporation Refrigerated plug-in module
US5132873A (en) * 1988-09-30 1992-07-21 Microelectronics And Computer Technology Corporation Diaphragm sealing apparatus
US4854419A (en) * 1988-12-19 1989-08-08 Lyras Louis G Particulate containment control method and platform device
US4970868A (en) * 1989-06-23 1990-11-20 International Business Machines Corporation Apparatus for temperature control of electronic devices
JP3176083B2 (ja) * 1991-05-20 2001-06-11 キヤノン株式会社 画像処理装置及びその方法
DE69221947T2 (de) * 1991-06-14 1998-03-05 Canon Kk Bilderzeugungsgerät
DE4320803C2 (de) * 1993-06-23 2001-06-28 Inst Luft & Kaeltetechnik Ggmbh Lageunabhängiges Sensor-Kühlsystem
US5463872A (en) * 1994-09-08 1995-11-07 International Business Machines Corporation High performance thermal interface for low temperature electronic modules
US6192701B1 (en) 1999-08-23 2001-02-27 International Business Machines Corporation Sealed multi-chip module cooling system
DE10032050A1 (de) * 2000-07-05 2002-01-17 Porextherm Daemmstoffe Gmbh Kühlvorrichtung für Computer
SG105459A1 (en) * 2000-07-24 2004-08-27 Micron Technology Inc Mems heat pumps for integrated circuit heat dissipation
KR101516525B1 (ko) * 2014-04-14 2015-05-04 희성금속 주식회사 와이어 냉각조
JP7235959B2 (ja) * 2019-02-05 2023-03-09 富士通株式会社 液浸冷却装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1035905A (en) * 1961-12-06 1966-07-13 Plessey Co Ltd Improvements in cooling systems
US3328642A (en) * 1964-06-08 1967-06-27 Sylvania Electric Prod Temperature control means utilizing a heat reservoir containing meltable material
US3475660A (en) * 1967-12-01 1969-10-28 Int Rectifier Corp Hollow cylindrical semiconductor device
US3780356A (en) * 1969-02-27 1973-12-18 Laing Nikolaus Cooling device for semiconductor components
JPS50112432A (de) * 1974-02-16 1975-09-03
US4279127A (en) * 1979-03-02 1981-07-21 Air Products And Chemicals, Inc. Removable refrigerator for maintaining liquefied gas inventory
US4395728A (en) * 1979-08-24 1983-07-26 Li Chou H Temperature controlled apparatus
JPS5650548A (en) * 1979-10-02 1981-05-07 Nec Corp Manufacture of semiconductor device
JPS5713615A (en) * 1980-06-27 1982-01-23 Maeden Kk Foil yarn wire with conductive core yarn
JPS57176014U (de) * 1981-05-01 1982-11-06
JPS57190372A (en) * 1981-05-19 1982-11-22 Fujitsu Ltd Cooling type photoelectric converter
US4516404A (en) * 1984-03-30 1985-05-14 General Electric Company Foam filled insert for horizontal cryostat penetrations

Also Published As

Publication number Publication date
DE3876376T2 (de) 1993-06-24
EP0314738B1 (de) 1992-12-02
EP0314738A1 (de) 1989-05-10
US4800422A (en) 1989-01-24
JP2772654B2 (ja) 1998-07-02
WO1988009055A1 (en) 1988-11-17
JPH01503426A (ja) 1989-11-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: AT&T GLOBAL INFORMATION SOLUTIONS INTERNATIONAL IN

8327 Change in the person/name/address of the patent owner

Owner name: NCR INTERNATIONAL, INC. (N.D.GES.D.STAATES DELAWAR

8320 Willingness to grant licences declared (paragraph 23)
8328 Change in the person/name/address of the agent

Free format text: V. BEZOLD & SOZIEN, 80799 MUENCHEN

8339 Ceased/non-payment of the annual fee