DE3876376D1 - CARBON CONNECTOR FOR COOLED INTEGRATED CIRCUIT SUBMERSIBLE IN LIQUID. - Google Patents
CARBON CONNECTOR FOR COOLED INTEGRATED CIRCUIT SUBMERSIBLE IN LIQUID.Info
- Publication number
- DE3876376D1 DE3876376D1 DE8888904311T DE3876376T DE3876376D1 DE 3876376 D1 DE3876376 D1 DE 3876376D1 DE 8888904311 T DE8888904311 T DE 8888904311T DE 3876376 T DE3876376 T DE 3876376T DE 3876376 D1 DE3876376 D1 DE 3876376D1
- Authority
- DE
- Germany
- Prior art keywords
- submersible
- liquid
- integrated circuit
- cooled integrated
- carbon connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
- H01L23/445—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air the fluid being a liquefied gas, e.g. in a cryogenic vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Casings For Electric Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/046,764 US4800422A (en) | 1987-05-07 | 1987-05-07 | Frostless interface supercooled VLSI system |
PCT/US1988/001290 WO1988009055A1 (en) | 1987-05-07 | 1988-04-22 | Carbon connectors to liquid-immersion cooled integrated circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3876376D1 true DE3876376D1 (en) | 1993-01-14 |
DE3876376T2 DE3876376T2 (en) | 1993-06-24 |
Family
ID=21945265
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8888904311T Expired - Fee Related DE3876376T2 (en) | 1987-05-07 | 1988-04-22 | CARBON CONNECTOR FOR COOLED INTEGRATED CIRCUIT SUBMERSIBLE IN LIQUID. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4800422A (en) |
EP (1) | EP0314738B1 (en) |
JP (1) | JP2772654B2 (en) |
DE (1) | DE3876376T2 (en) |
WO (1) | WO1988009055A1 (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2607490B2 (en) * | 1986-12-09 | 1997-05-07 | キヤノン株式会社 | Image quality control method for image forming apparatus |
US4950181A (en) * | 1988-07-28 | 1990-08-21 | Ncr Corporation | Refrigerated plug-in module |
US5132873A (en) * | 1988-09-30 | 1992-07-21 | Microelectronics And Computer Technology Corporation | Diaphragm sealing apparatus |
US4854419A (en) * | 1988-12-19 | 1989-08-08 | Lyras Louis G | Particulate containment control method and platform device |
US4970868A (en) * | 1989-06-23 | 1990-11-20 | International Business Machines Corporation | Apparatus for temperature control of electronic devices |
JP3176083B2 (en) * | 1991-05-20 | 2001-06-11 | キヤノン株式会社 | Image processing apparatus and method |
DE69221947T2 (en) * | 1991-06-14 | 1998-03-05 | Canon Kk | Imaging device |
DE4320803C2 (en) * | 1993-06-23 | 2001-06-28 | Inst Luft & Kaeltetechnik Ggmbh | Location-independent sensor cooling system |
US5463872A (en) * | 1994-09-08 | 1995-11-07 | International Business Machines Corporation | High performance thermal interface for low temperature electronic modules |
US6192701B1 (en) | 1999-08-23 | 2001-02-27 | International Business Machines Corporation | Sealed multi-chip module cooling system |
DE10032050A1 (en) * | 2000-07-05 | 2002-01-17 | Porextherm Daemmstoffe Gmbh | Cooling device for computers |
SG105459A1 (en) * | 2000-07-24 | 2004-08-27 | Micron Technology Inc | Mems heat pumps for integrated circuit heat dissipation |
KR101516525B1 (en) * | 2014-04-14 | 2015-05-04 | 희성금속 주식회사 | Wire cooling vat |
JP7235959B2 (en) * | 2019-02-05 | 2023-03-09 | 富士通株式会社 | Liquid immersion cooling device |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1035905A (en) * | 1961-12-06 | 1966-07-13 | Plessey Co Ltd | Improvements in cooling systems |
US3328642A (en) * | 1964-06-08 | 1967-06-27 | Sylvania Electric Prod | Temperature control means utilizing a heat reservoir containing meltable material |
US3475660A (en) * | 1967-12-01 | 1969-10-28 | Int Rectifier Corp | Hollow cylindrical semiconductor device |
US3780356A (en) * | 1969-02-27 | 1973-12-18 | Laing Nikolaus | Cooling device for semiconductor components |
JPS50112432A (en) * | 1974-02-16 | 1975-09-03 | ||
US4279127A (en) * | 1979-03-02 | 1981-07-21 | Air Products And Chemicals, Inc. | Removable refrigerator for maintaining liquefied gas inventory |
US4395728A (en) * | 1979-08-24 | 1983-07-26 | Li Chou H | Temperature controlled apparatus |
JPS5650548A (en) * | 1979-10-02 | 1981-05-07 | Nec Corp | Manufacture of semiconductor device |
JPS5713615A (en) * | 1980-06-27 | 1982-01-23 | Maeden Kk | Foil yarn wire with conductive core yarn |
JPS57176014U (en) * | 1981-05-01 | 1982-11-06 | ||
JPS57190372A (en) * | 1981-05-19 | 1982-11-22 | Fujitsu Ltd | Cooling type photoelectric converter |
US4516404A (en) * | 1984-03-30 | 1985-05-14 | General Electric Company | Foam filled insert for horizontal cryostat penetrations |
-
1987
- 1987-05-07 US US07/046,764 patent/US4800422A/en not_active Expired - Lifetime
-
1988
- 1988-04-22 JP JP63504133A patent/JP2772654B2/en not_active Expired - Lifetime
- 1988-04-22 EP EP88904311A patent/EP0314738B1/en not_active Expired
- 1988-04-22 DE DE8888904311T patent/DE3876376T2/en not_active Expired - Fee Related
- 1988-04-22 WO PCT/US1988/001290 patent/WO1988009055A1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP0314738A1 (en) | 1989-05-10 |
JP2772654B2 (en) | 1998-07-02 |
US4800422A (en) | 1989-01-24 |
WO1988009055A1 (en) | 1988-11-17 |
EP0314738B1 (en) | 1992-12-02 |
JPH01503426A (en) | 1989-11-16 |
DE3876376T2 (en) | 1993-06-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: AT&T GLOBAL INFORMATION SOLUTIONS INTERNATIONAL IN |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: NCR INTERNATIONAL, INC. (N.D.GES.D.STAATES DELAWAR |
|
8320 | Willingness to grant licences declared (paragraph 23) | ||
8328 | Change in the person/name/address of the agent |
Free format text: V. BEZOLD & SOZIEN, 80799 MUENCHEN |
|
8339 | Ceased/non-payment of the annual fee |