DE3854365D1 - Verfahren zur Benetzung von Reiskörnern. - Google Patents

Verfahren zur Benetzung von Reiskörnern.

Info

Publication number
DE3854365D1
DE3854365D1 DE3854365T DE3854365T DE3854365D1 DE 3854365 D1 DE3854365 D1 DE 3854365D1 DE 3854365 T DE3854365 T DE 3854365T DE 3854365 T DE3854365 T DE 3854365T DE 3854365 D1 DE3854365 D1 DE 3854365D1
Authority
DE
Germany
Prior art keywords
rice grains
wetting
wetting rice
grains
rice
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE3854365T
Other languages
English (en)
Other versions
DE3854365T2 (de
Inventor
Toshihiko Satake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Satake Engineering Co Ltd
Original Assignee
Satake Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=15425355&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE3854365(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Satake Engineering Co Ltd filed Critical Satake Engineering Co Ltd
Publication of DE3854365D1 publication Critical patent/DE3854365D1/de
Application granted granted Critical
Publication of DE3854365T2 publication Critical patent/DE3854365T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
    • B02B—PREPARING GRAIN FOR MILLING; REFINING GRANULAR FRUIT TO COMMERCIAL PRODUCTS BY WORKING THE SURFACE
    • B02B1/00—Preparing grain for milling or like processes
    • B02B1/08—Conditioning grain with respect to temperature or water content
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
    • B02B—PREPARING GRAIN FOR MILLING; REFINING GRANULAR FRUIT TO COMMERCIAL PRODUCTS BY WORKING THE SURFACE
    • B02B1/00—Preparing grain for milling or like processes
    • B02B1/04—Wet treatment, e.g. washing, wetting, softening
    • B02B1/06—Devices with rotary parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
    • B02B—PREPARING GRAIN FOR MILLING; REFINING GRANULAR FRUIT TO COMMERCIAL PRODUCTS BY WORKING THE SURFACE
    • B02B1/00—Preparing grain for milling or like processes
    • B02B1/04—Wet treatment, e.g. washing, wetting, softening
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/266—Bombardment with radiation with high-energy radiation producing ion implantation using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/28008—Making conductor-insulator-semiconductor electrodes
    • H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
    • H01L21/28035—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232—Field-effect technology
    • H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/8238—Complementary field-effect transistors, e.g. CMOS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
    • H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
    • H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
    • H01L27/0928—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors comprising both N- and P- wells in the substrate, e.g. twin-tub

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Adjustment And Processing Of Grains (AREA)
  • Cereal-Derived Products (AREA)
DE3854365T 1987-06-12 1988-06-10 Verfahren zur Benetzung von Reiskörnern. Expired - Lifetime DE3854365T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62147223A JPH0783834B2 (ja) 1987-06-12 1987-06-12 米粒の加湿方法及びその装置

Publications (2)

Publication Number Publication Date
DE3854365D1 true DE3854365D1 (de) 1995-10-05
DE3854365T2 DE3854365T2 (de) 1996-02-08

Family

ID=15425355

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3854365T Expired - Lifetime DE3854365T2 (de) 1987-06-12 1988-06-10 Verfahren zur Benetzung von Reiskörnern.

Country Status (9)

Country Link
US (1) US5002788A (de)
EP (1) EP0294838B1 (de)
JP (1) JPH0783834B2 (de)
KR (1) KR920001529B1 (de)
AU (1) AU591047B2 (de)
DE (1) DE3854365T2 (de)
MX (1) MX172179B (de)
MY (1) MY102833A (de)
PH (1) PH25487A (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0651119B2 (ja) * 1986-03-04 1994-07-06 株式会社佐竹製作所 米粒加圧加湿装置
US5476677A (en) * 1990-12-28 1995-12-19 Tadashi Inoue Cereals treated under high pressure and method of preparing the same
JP3506441B2 (ja) * 1991-08-29 2004-03-15 株式会社サタケ 精麦製粉装置
US5133982A (en) * 1991-09-25 1992-07-28 Panhandle Fluid Process, Inc. Method and apparatus for conditioning a grain flow
AU664073B2 (en) * 1992-02-19 1995-11-02 Yukio Ishida Highly water absorbing rice, method of manufacturing same and utilization thereof
JP3435988B2 (ja) * 1996-02-09 2003-08-11 株式会社サタケ 精麦製粉方法
JP4172002B2 (ja) 1999-08-24 2008-10-29 株式会社サタケ 循環式穀物乾燥機
US6602531B2 (en) * 2001-07-12 2003-08-05 Kazuo Naka Method for pre-processing of dried food
JP4409879B2 (ja) * 2003-08-04 2010-02-03 株式会社ファンケル γ−アミノ酪酸を富化させる方法及びその方法により得られる穀物
JP2008043881A (ja) * 2006-08-17 2008-02-28 Kubota Kucho Kk 農産品の保湿方法および装置
DE102010061318B3 (de) * 2010-12-17 2012-04-05 Vibronet Gräf Gmbh & Co. Kg Vorrichtung zum Benetzen von Körnerfrüchten mit einer Flüssigkeit sowie Verfahren zum Benetzen von Körnerfrüchten mit einer Flüssigkeit
CN109419312B (zh) * 2017-09-05 2021-10-12 佛山市顺德区美的电热电器制造有限公司 电烹饪器及用于电烹饪器的再加热方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2592407A (en) * 1948-09-09 1952-04-08 Daniel S Fernandes Method of processing rice for preserving the vitamin contents thereof
DE2503383C2 (de) * 1974-02-08 1982-12-23 Gebrüder Bühler AG, 9240 Uzwil Verfahren zum Netzen ganzer Körnerfrüchte, insbesondere für Getreidekörner, und Netzvorrichtung zur Durchführung dieses Verfahrens
US4055673A (en) * 1974-02-08 1977-10-25 Gebrueder Buehler Ag Method of moistening whole grains
JPS55124549A (en) * 1979-03-19 1980-09-25 Satake Eng Co Ltd Riceecleaning device
JPS6017498B2 (ja) * 1979-08-10 1985-05-02 株式会社 サタケ 精白米加湿方法
US4338344A (en) * 1980-01-18 1982-07-06 General Foods Corporation Process for producing a quick-cooking rice
ES8608293A1 (es) * 1984-06-29 1986-06-16 Gen Foods Corp Un procedimiento para preparar arroz blanco de consumo
JPS61283357A (ja) * 1985-02-08 1986-12-13 株式会社　サタケ 米粒加湿方法および米粒加湿装置
JPS61209056A (ja) * 1985-03-11 1986-09-17 株式会社　サタケ 米粒高速安全加湿方法および装置
JPH0651119B2 (ja) * 1986-03-04 1994-07-06 株式会社佐竹製作所 米粒加圧加湿装置

Also Published As

Publication number Publication date
KR890000154A (ko) 1989-03-13
EP0294838B1 (de) 1995-08-30
JPS63310644A (ja) 1988-12-19
AU591047B2 (en) 1989-11-23
MX172179B (es) 1993-12-06
EP0294838A3 (en) 1989-10-04
MY102833A (en) 1992-11-30
PH25487A (en) 1991-07-24
AU1746688A (en) 1989-01-19
KR920001529B1 (ko) 1992-02-18
US5002788A (en) 1991-03-26
JPH0783834B2 (ja) 1995-09-13
EP0294838A2 (de) 1988-12-14
DE3854365T2 (de) 1996-02-08

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Legal Events

Date Code Title Description
8363 Opposition against the patent
8365 Fully valid after opposition proceedings