DE3853246D1 - Vorrichtung zur Kontrolle des Lageverhältnisses zwischen einer Photomaske und einem Plättchen. - Google Patents

Vorrichtung zur Kontrolle des Lageverhältnisses zwischen einer Photomaske und einem Plättchen.

Info

Publication number
DE3853246D1
DE3853246D1 DE3853246T DE3853246T DE3853246D1 DE 3853246 D1 DE3853246 D1 DE 3853246D1 DE 3853246 T DE3853246 T DE 3853246T DE 3853246 T DE3853246 T DE 3853246T DE 3853246 D1 DE3853246 D1 DE 3853246D1
Authority
DE
Germany
Prior art keywords
photomask
checking
plate
positional relationship
positional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3853246T
Other languages
English (en)
Other versions
DE3853246T2 (de
Inventor
Takeo Sato
Shinichiro Aoki
Katsumasa Yamaguchi
Tadashi Kaneko
Noboru Nomura
Keisuke Koga
Kazuhiro Yamashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP62241232A external-priority patent/JPS6482623A/ja
Priority claimed from JP62241230A external-priority patent/JPS6482622A/ja
Priority claimed from JP62241234A external-priority patent/JPH0666243B2/ja
Priority claimed from JP62241235A external-priority patent/JPS6482625A/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE3853246D1 publication Critical patent/DE3853246D1/de
Publication of DE3853246T2 publication Critical patent/DE3853246T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7065—Production of alignment light, e.g. light source, control of coherence, polarization, pulse length, wavelength
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049—Technique, e.g. interferometric
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE3853246T 1987-09-25 1988-09-23 Vorrichtung zur Kontrolle des Lageverhältnisses zwischen einer Photomaske und einem Plättchen. Expired - Fee Related DE3853246T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP62241232A JPS6482623A (en) 1987-09-25 1987-09-25 Device for alignment
JP62241230A JPS6482622A (en) 1987-09-25 1987-09-25 Device for alignment
JP62241234A JPH0666243B2 (ja) 1987-09-25 1987-09-25 位置合わせ装置
JP62241235A JPS6482625A (en) 1987-09-25 1987-09-25 Device for alignment

Publications (2)

Publication Number Publication Date
DE3853246D1 true DE3853246D1 (de) 1995-04-13
DE3853246T2 DE3853246T2 (de) 1995-06-29

Family

ID=27477832

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3853246T Expired - Fee Related DE3853246T2 (de) 1987-09-25 1988-09-23 Vorrichtung zur Kontrolle des Lageverhältnisses zwischen einer Photomaske und einem Plättchen.

Country Status (3)

Country Link
US (1) US4870289A (de)
EP (1) EP0309281B1 (de)
DE (1) DE3853246T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111197959A (zh) * 2018-11-20 2020-05-26 上海微电子装备（集团）股份有限公司 一种光栅测量系统及光刻机

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2626076B2 (ja) * 1988-09-09 1997-07-02 キヤノン株式会社 位置検出装置
EP0358514B1 (de) * 1988-09-09 2000-12-13 Canon Kabushiki Kaisha Vorrichtung und Gerät zur Positionsdetektion
JPH02192114A (ja) * 1989-01-20 1990-07-27 Canon Inc 位置合わせ装置
US5171999A (en) * 1989-02-28 1992-12-15 Nikon Corporation Adjustable beam and interference fringe position
US5489986A (en) * 1989-02-28 1996-02-06 Nikon Corporation Position detecting apparatus
JPH02297005A (ja) * 1989-05-12 1990-12-07 Matsushita Electric Ind Co Ltd 位置合わせ装置
DE69012644T2 (de) * 1989-05-17 1995-04-06 Canon Kk Vorrichtung zur Ermittlung einer Position.
JP3077149B2 (ja) * 1990-01-22 2000-08-14 株式会社ニコン 測定装置、測定方法、及び露光装置、露光方法、及び回路パターンチップ
JP2756331B2 (ja) * 1990-01-23 1998-05-25 キヤノン株式会社 間隔測定装置
EP0455443B1 (de) * 1990-05-01 1997-11-12 Canon Kabushiki Kaisha Verfahren und Apparat zur Detektion von Lageabweichungen
US5231467A (en) * 1990-09-20 1993-07-27 Matsushita Electric Industrial Co., Ltd. Reflective alignment position signal producing apparatus
JP3187093B2 (ja) * 1991-09-27 2001-07-11 キヤノン株式会社 位置ずれ測定装置
CA2078732A1 (en) * 1991-09-27 1993-03-28 Koichi Sentoku Displacement measuring device and displacement measuring method
US5757505A (en) * 1996-02-16 1998-05-26 Nikon Corporation Exposure apparatus
US6126382A (en) * 1997-11-26 2000-10-03 Novellus Systems, Inc. Apparatus for aligning substrate to chuck in processing chamber
JP3019095B1 (ja) * 1998-12-22 2000-03-13 日本電気株式会社 有機薄膜ｅｌデバイスの製造方法
US6433878B1 (en) * 2001-01-29 2002-08-13 Timbre Technology, Inc. Method and apparatus for the determination of mask rules using scatterometry
DE10217678A1 (de) * 2002-04-19 2003-11-06 Fraunhofer Ges Forschung Laser-Materialbearbeitung mit hybriden Prozessen
DE10319268A1 (de) * 2003-04-25 2004-12-02 Carl Zeiss Sms Gmbh Diffraktiver Strahlteiler für Abbildungssysteme
JP4878108B2 (ja) * 2004-07-14 2012-02-15 キヤノン株式会社 露光装置、デバイス製造方法、および測定装置
KR100578140B1 (ko) * 2004-10-07 2006-05-10 삼성전자주식회사 변위 측정을 위한 간섭계 시스템 및 이를 이용한 노광 장치
US7480062B2 (en) * 2007-05-25 2009-01-20 Tokyo Electron Limited Automated process control using parameters determined from a photomask covered by a pellicle
KR102640173B1 (ko) * 2016-06-14 2024-02-26 삼성전자주식회사 회절 기반 오버레이 마크 및 오버레이 계측방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3541338A (en) * 1967-01-12 1970-11-17 Ibm Positioning system
US3867038A (en) * 1972-11-27 1975-02-18 Baird Atomic Inc Optical alignment system
JPH0619280B2 (ja) * 1983-09-24 1994-03-16 名古屋大学長 光学式自動位置決め装置
US4631416A (en) * 1983-12-19 1986-12-23 Hewlett-Packard Company Wafer/mask alignment system using diffraction gratings
US4596467A (en) * 1984-03-16 1986-06-24 Hughes Aircraft Company Dissimilar superimposed grating precision alignment and gap measurement systems
JPS62172203A (ja) * 1986-01-27 1987-07-29 Agency Of Ind Science & Technol 相対変位測定方法
US4780616A (en) * 1986-09-25 1988-10-25 Nippon Kogaku K. K. Projection optical apparatus for mask to substrate alignment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111197959A (zh) * 2018-11-20 2020-05-26 上海微电子装备（集团）股份有限公司 一种光栅测量系统及光刻机
CN111197959B (zh) * 2018-11-20 2021-09-17 上海微电子装备（集团）股份有限公司 一种光栅测量系统及光刻机

Also Published As

Publication number Publication date
EP0309281A2 (de) 1989-03-29
DE3853246T2 (de) 1995-06-29
US4870289A (en) 1989-09-26
EP0309281A3 (en) 1990-06-20
EP0309281B1 (de) 1995-03-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee