DE3826046A1 - Verfahren zur herstellung von metallischen schichten - Google Patents

Verfahren zur herstellung von metallischen schichten

Info

Publication number
DE3826046A1
DE3826046A1 DE3826046A DE3826046A DE3826046A1 DE 3826046 A1 DE3826046 A1 DE 3826046A1 DE 3826046 A DE3826046 A DE 3826046A DE 3826046 A DE3826046 A DE 3826046A DE 3826046 A1 DE3826046 A1 DE 3826046A1
Authority
DE
Germany
Prior art keywords
laser
production
metallic layers
structured
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE3826046A
Other languages
German (de)
English (en)
Other versions
DE3826046C2 (US06524379-20030225-C00019.png
Inventor
Michael Dipl Phys Dr Stuke
Hilmar Dipl Phys Dr Esrom
Georg Dipl Chem Dr Wahl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Max Planck Gesellschaft zur Foerderung der Wissenschaften eV
ABB AG Germany
ABB AB
Original Assignee
Max Planck Gesellschaft zur Foerderung der Wissenschaften eV
Asea Brown Boveri AG Germany
Asea Brown Boveri AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Max Planck Gesellschaft zur Foerderung der Wissenschaften eV, Asea Brown Boveri AG Germany, Asea Brown Boveri AB filed Critical Max Planck Gesellschaft zur Foerderung der Wissenschaften eV
Priority to DE3826046A priority Critical patent/DE3826046A1/de
Priority to US07/233,241 priority patent/US4900581A/en
Priority to JP63203314A priority patent/JPH01100279A/ja
Publication of DE3826046A1 publication Critical patent/DE3826046A1/de
Application granted granted Critical
Publication of DE3826046C2 publication Critical patent/DE3826046C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
    • C23C18/143—Radiation by light, e.g. photolysis or pyrolysis
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
DE3826046A 1987-08-17 1988-07-30 Verfahren zur herstellung von metallischen schichten Granted DE3826046A1 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE3826046A DE3826046A1 (de) 1987-08-17 1988-07-30 Verfahren zur herstellung von metallischen schichten
US07/233,241 US4900581A (en) 1987-08-17 1988-08-17 Method for producing metal films
JP63203314A JPH01100279A (ja) 1987-08-17 1988-08-17 金属層の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3727422 1987-08-17
DE3826046A DE3826046A1 (de) 1987-08-17 1988-07-30 Verfahren zur herstellung von metallischen schichten

Publications (2)

Publication Number Publication Date
DE3826046A1 true DE3826046A1 (de) 1989-03-02
DE3826046C2 DE3826046C2 (US06524379-20030225-C00019.png) 1990-12-06

Family

ID=25858741

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3826046A Granted DE3826046A1 (de) 1987-08-17 1988-07-30 Verfahren zur herstellung von metallischen schichten

Country Status (3)

Country Link
US (1) US4900581A (US06524379-20030225-C00019.png)
JP (1) JPH01100279A (US06524379-20030225-C00019.png)
DE (1) DE3826046A1 (US06524379-20030225-C00019.png)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3922233A1 (de) * 1989-07-06 1991-01-17 Guenter Link Verfahren zur abscheidung von metallen aus metallorganischen verbindungen mittels photonenstrahlung
DE3936479A1 (de) * 1989-11-02 1991-05-08 Guenter Link Verfahren zur erzeugung von schutzschichten auf materialoberflaechen mittels laserstrahlung
DE4008482A1 (de) * 1990-03-16 1991-09-19 Asea Brown Boveri Galvanisierungsverfahren
EP0483782A2 (de) * 1990-11-02 1992-05-06 Heraeus Noblelight GmbH Verfahren zur Herstellung metallischer Schichten auf Substraten
DE4210400C1 (en) * 1992-03-30 1993-01-07 Siemens Ag, 8000 Muenchen, De Local copper@ deposition from organo:metallic film on substrate - by forming film from mixt. of copper acetate and copper formate in specified ratio and depositing film by laser irradiation
DE4444567A1 (de) * 1994-12-02 1996-06-05 Siemens Ag Verfahren zum Herstellen einer Leiterplatte mit einer Kernplatte aus Aluminium oder Aluminiumlegierung
DE19518512A1 (de) * 1995-03-06 1996-09-12 Fraunhofer Ges Forschung Palladiumhaltiges Precursormaterial und Verfahren zur Herstellung von metallischen Mikrostrukturen auf dielektrischen Substraten mit einem palladiumhaltigen Precursormaterial
DE19723734A1 (de) * 1997-06-06 1998-12-10 Gerhard Prof Dr Naundorf Leiterbahnstrukturen auf einem nichtleitenden Trägermaterial, insbesondere feine Leiterbahnstrukturen, und Verfahren zu ihrer Herstellung
EP0979029A2 (de) * 1998-08-04 2000-02-09 Wolfgang Anger Verfahren zur Erzeugung von Leiterplatten

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US4960613A (en) * 1988-10-04 1990-10-02 General Electric Company Laser interconnect process
KR100190423B1 (ko) * 1989-06-06 1999-06-01 기타지마 요시도시 에멀젼마스크 등의결함 수정방법 및 장치
US5225251A (en) * 1989-12-22 1993-07-06 Asea Brown Boveri Aktiengesellschaft Method for forming layers by UV radiation of aluminum nitride
JP2740764B2 (ja) * 1990-11-19 1998-04-15 工業技術院長 高分子成形品表面の選択的無電解めっき方法
US5153023A (en) * 1990-12-03 1992-10-06 Xerox Corporation Process for catalysis of electroless metal plating on plastic
GB9207054D0 (en) * 1992-03-31 1992-05-13 Gillette Co Methods of manufacturing perforated foils
US5322986A (en) * 1992-04-06 1994-06-21 Eastman Kodak Company Methods for preparing polymer stripe waveguides and polymer stripe waveguides prepared thereby
US5459098A (en) * 1992-10-19 1995-10-17 Marietta Energy Systems, Inc. Maskless laser writing of microscopic metallic interconnects
US5643356A (en) 1993-08-05 1997-07-01 Kimberly-Clark Corporation Ink for ink jet printers
US6017661A (en) 1994-11-09 2000-01-25 Kimberly-Clark Corporation Temporary marking using photoerasable colorants
US5773182A (en) 1993-08-05 1998-06-30 Kimberly-Clark Worldwide, Inc. Method of light stabilizing a colorant
US5681380A (en) 1995-06-05 1997-10-28 Kimberly-Clark Worldwide, Inc. Ink for ink jet printers
US6211383B1 (en) 1993-08-05 2001-04-03 Kimberly-Clark Worldwide, Inc. Nohr-McDonald elimination reaction
CA2120838A1 (en) 1993-08-05 1995-02-06 Ronald Sinclair Nohr Solid colored composition mutable by ultraviolet radiation
US6017471A (en) 1993-08-05 2000-01-25 Kimberly-Clark Worldwide, Inc. Colorants and colorant modifiers
US5865471A (en) 1993-08-05 1999-02-02 Kimberly-Clark Worldwide, Inc. Photo-erasable data processing forms
US5645964A (en) 1993-08-05 1997-07-08 Kimberly-Clark Corporation Digital information recording media and method of using same
US5721287A (en) 1993-08-05 1998-02-24 Kimberly-Clark Worldwide, Inc. Method of mutating a colorant by irradiation
US5733693A (en) 1993-08-05 1998-03-31 Kimberly-Clark Worldwide, Inc. Method for improving the readability of data processing forms
US5703341A (en) * 1993-11-23 1997-12-30 Lockheed Martin Energy Systems, Inc. Method for adhesion of metal films to ceramics
US5739175A (en) 1995-06-05 1998-04-14 Kimberly-Clark Worldwide, Inc. Photoreactor composition containing an arylketoalkene wavelength-specific sensitizer
US5685754A (en) 1994-06-30 1997-11-11 Kimberly-Clark Corporation Method of generating a reactive species and polymer coating applications therefor
US6242057B1 (en) 1994-06-30 2001-06-05 Kimberly-Clark Worldwide, Inc. Photoreactor composition and applications therefor
US6071979A (en) 1994-06-30 2000-06-06 Kimberly-Clark Worldwide, Inc. Photoreactor composition method of generating a reactive species and applications therefor
JP2882572B2 (ja) * 1994-08-31 1999-04-12 インターナショナル・ビジネス・マシーンズ・コーポレイション 金属薄膜をレーザで平坦化する方法
US5626670A (en) * 1994-10-03 1997-05-06 American Research Corporation Of Virginia Method for producing low thermal budget ferroelectric thin films for integrated device structures using laser-crystallization of spin-on sol-gel films
US6008268A (en) 1994-10-21 1999-12-28 Kimberly-Clark Worldwide, Inc. Photoreactor composition, method of generating a reactive species, and applications therefor
US5747550A (en) 1995-06-05 1998-05-05 Kimberly-Clark Worldwide, Inc. Method of generating a reactive species and polymerizing an unsaturated polymerizable material
US5786132A (en) 1995-06-05 1998-07-28 Kimberly-Clark Corporation Pre-dyes, mutable dye compositions, and methods of developing a color
RU2170943C2 (ru) 1995-06-05 2001-07-20 Кимберли-Кларк Уорлдвайд, Инк. Новые прекрасители
US5811199A (en) 1995-06-05 1998-09-22 Kimberly-Clark Worldwide, Inc. Adhesive compositions containing a photoreactor composition
US5798015A (en) 1995-06-05 1998-08-25 Kimberly-Clark Worldwide, Inc. Method of laminating a structure with adhesive containing a photoreactor composition
US5849411A (en) 1995-06-05 1998-12-15 Kimberly-Clark Worldwide, Inc. Polymer film, nonwoven web and fibers containing a photoreactor composition
JP2000506550A (ja) 1995-06-28 2000-05-30 キンバリー クラーク ワールドワイド インコーポレイテッド 新規な着色剤および着色剤用改質剤
CA2210480A1 (en) 1995-11-28 1997-06-05 Kimberly-Clark Worldwide, Inc. Improved colorant stabilizers
US5855655A (en) 1996-03-29 1999-01-05 Kimberly-Clark Worldwide, Inc. Colorant stabilizers
US6099628A (en) 1996-03-29 2000-08-08 Kimberly-Clark Worldwide, Inc. Colorant stabilizers
US5782963A (en) 1996-03-29 1998-07-21 Kimberly-Clark Worldwide, Inc. Colorant stabilizers
US5891229A (en) 1996-03-29 1999-04-06 Kimberly-Clark Worldwide, Inc. Colorant stabilizers
US5894038A (en) * 1997-02-28 1999-04-13 The Whitaker Corporation Direct deposition of palladium
US6524379B2 (en) 1997-08-15 2003-02-25 Kimberly-Clark Worldwide, Inc. Colorants, colorant stabilizers, ink compositions, and improved methods of making the same
BR9906513A (pt) 1998-06-03 2001-10-30 Kimberly Clark Co Fotoiniciadores novos e aplicações para osmesmos
EP1062285A2 (en) 1998-06-03 2000-12-27 Kimberly-Clark Worldwide, Inc. Neonanoplasts and microemulsion technology for inks and ink jet printing
IE980461A1 (en) * 1998-06-15 2000-05-03 Univ Cork Method for selective activation and metallisation of materials
US6228157B1 (en) 1998-07-20 2001-05-08 Ronald S. Nohr Ink jet ink compositions
DE69930948T2 (de) 1998-09-28 2006-09-07 Kimberly-Clark Worldwide, Inc., Neenah Chelate mit chinoiden gruppen als photoinitiatoren
ATE238393T1 (de) 1999-01-19 2003-05-15 Kimberly Clark Co Farbstoffe, farbstoffstabilisatoren, tintenzusammensetzungen und verfahren zu deren herstellung
US6331056B1 (en) 1999-02-25 2001-12-18 Kimberly-Clark Worldwide, Inc. Printing apparatus and applications therefor
US6294698B1 (en) 1999-04-16 2001-09-25 Kimberly-Clark Worldwide, Inc. Photoinitiators and applications therefor
US6368395B1 (en) 1999-05-24 2002-04-09 Kimberly-Clark Worldwide, Inc. Subphthalocyanine colorants, ink compositions, and method of making the same
US6171712B1 (en) 2000-03-15 2001-01-09 Ford Global Technologies, Inc. Palladium and palladium/copper thin flat membranes
IL138530A0 (en) * 2000-09-18 2003-02-12 T L M Advanced Laser Technolog Method for the formation of a pattern on an insulating substrate
US7800024B2 (en) * 2004-09-27 2010-09-21 Duguay Michel A Lithic wireless warming table and portable heaters
TWI613177B (zh) * 2011-11-16 2018-02-01 製陶技術股份有限公司 製造一基材的方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3318978A1 (de) * 1983-05-25 1984-11-29 Werner Dr. Vaduz Tabarelli Einrichtung zum projektionskopieren von masken auf ein werkstueck
DE3347038A1 (de) * 1983-12-24 1985-06-27 Fr. Kammerer GmbH, 7530 Pforzheim Verfahren zum beschichten von traegern mit metallen
US4574095A (en) * 1984-11-19 1986-03-04 International Business Machines Corporation Selective deposition of copper
EP0143951B1 (de) * 1983-10-18 1989-02-08 Licentia Patent-Verwaltungs-GmbH Verfahren zur chemischen Metallisierung

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DE3407089A1 (de) * 1984-02-27 1985-08-29 Siemens Ag Verfahren und vorrichtung zur lichtinduzierten, fotolytischen abscheidung
JPS61119676A (ja) * 1984-11-15 1986-06-06 Ulvac Corp シ−トプラズマとレ−ザ光を利用した成膜装置
JPS61187237A (ja) * 1985-02-14 1986-08-20 Toshiba Corp パタ−ン形成方法
JPS61276233A (ja) * 1985-05-30 1986-12-06 Nec Corp パタ−ン形成方法
US4786358A (en) * 1986-08-08 1988-11-22 Semiconductor Energy Laboratory Co., Ltd. Method for forming a pattern of a film on a substrate with a laser beam

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3318978A1 (de) * 1983-05-25 1984-11-29 Werner Dr. Vaduz Tabarelli Einrichtung zum projektionskopieren von masken auf ein werkstueck
EP0143951B1 (de) * 1983-10-18 1989-02-08 Licentia Patent-Verwaltungs-GmbH Verfahren zur chemischen Metallisierung
DE3347038A1 (de) * 1983-12-24 1985-06-27 Fr. Kammerer GmbH, 7530 Pforzheim Verfahren zum beschichten von traegern mit metallen
US4574095A (en) * 1984-11-19 1986-03-04 International Business Machines Corporation Selective deposition of copper

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
J. appl. Physics 61 (4), 1987, S. 1628 - 1632 *
Prospekt: Lambda Physik, Göttingen, 1986 *

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3922233A1 (de) * 1989-07-06 1991-01-17 Guenter Link Verfahren zur abscheidung von metallen aus metallorganischen verbindungen mittels photonenstrahlung
DE3936479A1 (de) * 1989-11-02 1991-05-08 Guenter Link Verfahren zur erzeugung von schutzschichten auf materialoberflaechen mittels laserstrahlung
DE4008482A1 (de) * 1990-03-16 1991-09-19 Asea Brown Boveri Galvanisierungsverfahren
EP0483782A2 (de) * 1990-11-02 1992-05-06 Heraeus Noblelight GmbH Verfahren zur Herstellung metallischer Schichten auf Substraten
EP0483782A3 (en) * 1990-11-02 1993-12-01 Heraeus Noblelight Gmbh Metallising process
DE4210400C1 (en) * 1992-03-30 1993-01-07 Siemens Ag, 8000 Muenchen, De Local copper@ deposition from organo:metallic film on substrate - by forming film from mixt. of copper acetate and copper formate in specified ratio and depositing film by laser irradiation
DE4444567A1 (de) * 1994-12-02 1996-06-05 Siemens Ag Verfahren zum Herstellen einer Leiterplatte mit einer Kernplatte aus Aluminium oder Aluminiumlegierung
DE19518512A1 (de) * 1995-03-06 1996-09-12 Fraunhofer Ges Forschung Palladiumhaltiges Precursormaterial und Verfahren zur Herstellung von metallischen Mikrostrukturen auf dielektrischen Substraten mit einem palladiumhaltigen Precursormaterial
DE19518512C2 (de) * 1995-03-06 2001-11-29 Fraunhofer Ges Forschung Palladiumhaltiges Precursormaterial und Verfahren zur Herstellung von metallischen Mikrostrukturen auf dielektrischen Substraten mit einem palladiumhaltigen Precursormaterial
DE19723734A1 (de) * 1997-06-06 1998-12-10 Gerhard Prof Dr Naundorf Leiterbahnstrukturen auf einem nichtleitenden Trägermaterial, insbesondere feine Leiterbahnstrukturen, und Verfahren zu ihrer Herstellung
DE19723734C2 (de) * 1997-06-06 2002-02-07 Gerhard Naundorf Leiterbahnstrukturen auf einem nichtleitenden Trägermaterial und Verfahren zu ihrer Herstellung
EP0979029A2 (de) * 1998-08-04 2000-02-09 Wolfgang Anger Verfahren zur Erzeugung von Leiterplatten
EP0979029A3 (de) * 1998-08-04 2001-08-29 Wolfgang Anger Verfahren zur Erzeugung von Leiterplatten

Also Published As

Publication number Publication date
US4900581A (en) 1990-02-13
DE3826046C2 (US06524379-20030225-C00019.png) 1990-12-06
JPH01100279A (ja) 1989-04-18

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
D2 Grant after examination
8363 Opposition against the patent
8331 Complete revocation