DE3819785C2 - - Google Patents
Info
- Publication number
- DE3819785C2 DE3819785C2 DE19883819785 DE3819785A DE3819785C2 DE 3819785 C2 DE3819785 C2 DE 3819785C2 DE 19883819785 DE19883819785 DE 19883819785 DE 3819785 A DE3819785 A DE 3819785A DE 3819785 C2 DE3819785 C2 DE 3819785C2
- Authority
- DE
- Germany
- Prior art keywords
- layers
- holes
- fitting holes
- core
- cords
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010410 layer Substances 0.000 claims description 58
- 239000012792 core layer Substances 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 26
- 239000004020 conductor Substances 0.000 claims description 19
- 238000007731 hot pressing Methods 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 238000000576 coating method Methods 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000013013 elastic material Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000036316 preload Effects 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/08—Impregnating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
- B32B38/1833—Positioning, e.g. registration or centering
- B32B38/1841—Positioning, e.g. registration or centering during laying up
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19883819785 DE3819785A1 (de) | 1988-06-10 | 1988-06-10 | Verfahren zum herstellen von mehrlagigen, gedruckten leiterplatten |
| EP89109045A EP0345508A3 (de) | 1988-06-10 | 1989-05-19 | Verfahren zum Herstellen von mehrlagigen, gedruckten Leiterplatten |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19883819785 DE3819785A1 (de) | 1988-06-10 | 1988-06-10 | Verfahren zum herstellen von mehrlagigen, gedruckten leiterplatten |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3819785A1 DE3819785A1 (de) | 1989-12-14 |
| DE3819785C2 true DE3819785C2 (en, 2012) | 1990-03-29 |
Family
ID=6356280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19883819785 Granted DE3819785A1 (de) | 1988-06-10 | 1988-06-10 | Verfahren zum herstellen von mehrlagigen, gedruckten leiterplatten |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP0345508A3 (en, 2012) |
| DE (1) | DE3819785A1 (en, 2012) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT401131B (de) * | 1992-05-15 | 1996-06-25 | Schrack Telecom | Mehrlagen-leiterplatte |
| CN114746252B (zh) * | 2019-11-21 | 2024-04-26 | 美多绿汽车皮革株式会社 | 层叠成形体及其制造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1640934A1 (de) * | 1967-05-11 | 1970-12-10 | Licentia Gmbh | Mehrschichtleiterplatte |
| DE3423181A1 (de) * | 1984-06-22 | 1986-01-02 | Dielektra GmbH, 5000 Köln | Verfahren zur herstellung von vorlaminaten fuer mehrlagenleiterplatten |
| DE3518919A1 (de) * | 1985-05-25 | 1986-11-27 | Ferrozell-Gesellschaft Sachs & Co Mbh, 8900 Augsburg | Verfahren zum herstellen von mehrlagigen gedruckten leiterplatten in einzel-, zuschnitt- (nutzen) oder tafelformat |
-
1988
- 1988-06-10 DE DE19883819785 patent/DE3819785A1/de active Granted
-
1989
- 1989-05-19 EP EP89109045A patent/EP0345508A3/de not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| EP0345508A3 (de) | 1990-04-18 |
| EP0345508A2 (de) | 1989-12-13 |
| DE3819785A1 (de) | 1989-12-14 |
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| DE3819785C2 (en, 2012) | ||
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| DE3518919C2 (en, 2012) | ||
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| DE3144570C1 (de) | Verfahren zum Prägen einer Stütznase | |
| DE3423181A1 (de) | Verfahren zur herstellung von vorlaminaten fuer mehrlagenleiterplatten | |
| DE19742268C1 (de) | Verfahren zur Ermittlung des Lageversatzes von mehrlagigen Verbundstrukturen | |
| DE3631426C2 (en, 2012) | ||
| EP1710605A1 (de) | Optische Leiterplatte und Verfahren zu ihrer Herstellung |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8327 | Change in the person/name/address of the patent owner |
Owner name: FERROZELL GMBH, 8900 AUGSBURG, DE |
|
| 8339 | Ceased/non-payment of the annual fee |