DE3810929A1 - Verfahren und vorrichtung zum feststellen eines fehlenden drahtes - Google Patents

Verfahren und vorrichtung zum feststellen eines fehlenden drahtes

Info

Publication number
DE3810929A1
DE3810929A1 DE3810929A DE3810929A DE3810929A1 DE 3810929 A1 DE3810929 A1 DE 3810929A1 DE 3810929 A DE3810929 A DE 3810929A DE 3810929 A DE3810929 A DE 3810929A DE 3810929 A1 DE3810929 A1 DE 3810929A1
Authority
DE
Germany
Prior art keywords
wire
tool
bonder
force
transducer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE3810929A
Other languages
German (de)
English (en)
Other versions
DE3810929C2 (enExample
Inventor
Robert Zimmerman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of DE3810929A1 publication Critical patent/DE3810929A1/de
Application granted granted Critical
Publication of DE3810929C2 publication Critical patent/DE3810929C2/de
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
DE3810929A 1987-04-08 1988-03-30 Verfahren und vorrichtung zum feststellen eines fehlenden drahtes Granted DE3810929A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/035,849 US4786860A (en) 1987-04-08 1987-04-08 Missing wire detector

Publications (2)

Publication Number Publication Date
DE3810929A1 true DE3810929A1 (de) 1988-10-27
DE3810929C2 DE3810929C2 (enExample) 1992-12-03

Family

ID=21885161

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3810929A Granted DE3810929A1 (de) 1987-04-08 1988-03-30 Verfahren und vorrichtung zum feststellen eines fehlenden drahtes

Country Status (3)

Country Link
US (1) US4786860A (enExample)
JP (1) JPS63268582A (enExample)
DE (1) DE3810929A1 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0686454A1 (en) * 1994-06-08 1995-12-13 Texas Instruments Incorporated Capillary and method of bonding
US5754329A (en) * 1992-12-22 1998-05-19 Monsanto Company Electrochromic display laminates
US5876634A (en) * 1995-12-26 1999-03-02 Monsanto Company Electrochromic tin oxide
US5876633A (en) * 1995-12-26 1999-03-02 Monsanto Company Electrochromic metal oxides
DE10315639A1 (de) * 2003-04-04 2004-11-04 Hesse & Knipps Gmbh Verfahren und Vorrichtung zur Prüfung einer Drahtbondverbindung

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4887470A (en) * 1988-08-12 1989-12-19 Honeywell Inc. Wire bond force calibration meter
US5591920A (en) * 1995-11-17 1997-01-07 Kulicke And Soffa Investments, Inc. Diagnostic wire bond pull tester
US5894981A (en) * 1996-11-27 1999-04-20 Orthodyne Electronics Corporation Integrated pull tester with an ultrasonic wire bonder
US5906706A (en) * 1997-06-12 1999-05-25 F & K Delvotec Bondtechnik Gmbh Wire guide for a bonding machine
US6189765B1 (en) 1998-04-14 2001-02-20 Hyundai Electronics Industries Co., Ltd. Apparatus and method for detecting double wire bonding
US6039234A (en) * 1998-06-16 2000-03-21 Kulicke & Soffa Investments, Inc. Missing wire detector
JP4469503B2 (ja) * 1998-09-01 2010-05-26 パナソニック株式会社 バンプ接合判定装置及び方法、並びに半導体部品製造装置及び方法
US6514016B1 (en) 1999-10-29 2003-02-04 International Engine Intellectual Property Company, L.L.C. Stuck tool detector and related method
ATE338603T1 (de) 2001-11-07 2006-09-15 F & K Delvotec Bondtech Gmbh Prüfverfahren für bondverbindungen und drahtbonder
US7896218B2 (en) * 2007-06-28 2011-03-01 Western Digital Technologies, Inc. Apparatus and method for conductive metal ball bonding with electrostatic discharge detection
JP5963929B1 (ja) * 2015-09-04 2016-08-03 株式会社日立パワーソリューションズ 超音波検査装置、超音波検査システム、及び超音波検査方法
CN209880543U (zh) * 2019-06-28 2019-12-31 成都精蓉创科技有限公司 锥形微电子微连接深腔焊劈刀

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4213556A (en) * 1978-10-02 1980-07-22 General Motors Corporation Method and apparatus to detect automatic wire bonder failure
DE3233629A1 (de) * 1981-09-10 1983-03-17 Raytheon Co., 02173 Lexington, Mass. Verfahren und einrichtung zur herstellung von verbindungen mittels ultraschall
US4600138A (en) * 1984-07-25 1986-07-15 Hughes Aircraft Company Bonding tool and clamp assembly and wire handling method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2633019A (en) * 1947-09-20 1953-03-31 Glenn L Martin Co Strain gauge pulse system
US3784079A (en) * 1972-04-03 1974-01-08 Motorola Inc Ultrasonic bond control apparatus
US3818334A (en) * 1973-04-11 1974-06-18 J Rosenberg Determining cutting tool force by measuring electrical resistance of a bearing
JPS5114983A (enExample) * 1974-07-30 1976-02-05 Mitsubishi Heavy Ind Ltd
US4068371A (en) * 1976-07-12 1978-01-17 Miller Charles F Method for completing wire bonds
US4341574A (en) * 1980-08-25 1982-07-27 Texas Instruments Incorporated Ultrasonic bond energy monitor
US4597522A (en) * 1983-12-26 1986-07-01 Kabushiki Kaisha Toshiba Wire bonding method and device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4213556A (en) * 1978-10-02 1980-07-22 General Motors Corporation Method and apparatus to detect automatic wire bonder failure
DE3233629A1 (de) * 1981-09-10 1983-03-17 Raytheon Co., 02173 Lexington, Mass. Verfahren und einrichtung zur herstellung von verbindungen mittels ultraschall
US4600138A (en) * 1984-07-25 1986-07-15 Hughes Aircraft Company Bonding tool and clamp assembly and wire handling method

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Abstract zur JP-PS 57-166042 (A) *
Abstract zur JP-PS 57-60848 (A) *
Abstract zur JP-PS 59-229833 (A) *

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5754329A (en) * 1992-12-22 1998-05-19 Monsanto Company Electrochromic display laminates
EP0686454A1 (en) * 1994-06-08 1995-12-13 Texas Instruments Incorporated Capillary and method of bonding
US5876634A (en) * 1995-12-26 1999-03-02 Monsanto Company Electrochromic tin oxide
US5876633A (en) * 1995-12-26 1999-03-02 Monsanto Company Electrochromic metal oxides
US6084701A (en) * 1995-12-26 2000-07-04 Monsanto Company Electrochromic tin oxide
DE10315639A1 (de) * 2003-04-04 2004-11-04 Hesse & Knipps Gmbh Verfahren und Vorrichtung zur Prüfung einer Drahtbondverbindung
US7134591B2 (en) 2003-04-04 2006-11-14 Hesse & Knipps Gmbh Method of and apparatus for testing a wire bond connection

Also Published As

Publication number Publication date
DE3810929C2 (enExample) 1992-12-03
JPH0342998B2 (enExample) 1991-06-28
JPS63268582A (ja) 1988-11-07
US4786860A (en) 1988-11-22

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee