DE3802066C2 - - Google Patents
Info
- Publication number
- DE3802066C2 DE3802066C2 DE3802066A DE3802066A DE3802066C2 DE 3802066 C2 DE3802066 C2 DE 3802066C2 DE 3802066 A DE3802066 A DE 3802066A DE 3802066 A DE3802066 A DE 3802066A DE 3802066 C2 DE3802066 C2 DE 3802066C2
- Authority
- DE
- Germany
- Prior art keywords
- insulating film
- semiconductor device
- connection structure
- connecting line
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62055904A JP2584986B2 (ja) | 1987-03-10 | 1987-03-10 | 半導体装置の配線構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3802066A1 DE3802066A1 (de) | 1988-09-22 |
DE3802066C2 true DE3802066C2 (es) | 1992-07-23 |
Family
ID=13012102
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3802066A Granted DE3802066A1 (de) | 1987-03-10 | 1988-01-25 | Halbleitereinrichtung mit gegenseitigen verbindungsschichten von t-foermigem querschnitt |
Country Status (3)
Country | Link |
---|---|
US (1) | US4905068A (es) |
JP (1) | JP2584986B2 (es) |
DE (1) | DE3802066A1 (es) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5196233A (en) * | 1989-01-18 | 1993-03-23 | Sgs-Thomson Microelectronics, Inc. | Method for fabricating semiconductor circuits |
US5216280A (en) * | 1989-12-02 | 1993-06-01 | Kabushiki Kaisha Toshiba | Semiconductor integrated circuit device having pads at periphery of semiconductor chip |
US5077595A (en) * | 1990-01-25 | 1991-12-31 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
JPH05152293A (ja) * | 1991-04-30 | 1993-06-18 | Sgs Thomson Microelectron Inc | 段差付き壁相互接続体及びゲートの製造方法 |
US5504375A (en) * | 1992-03-02 | 1996-04-02 | International Business Machines Corporation | Asymmetric studs and connecting lines to minimize stress |
US5486493A (en) * | 1994-02-25 | 1996-01-23 | Jeng; Shin-Puu | Planarized multi-level interconnect scheme with embedded low-dielectric constant insulators |
US5670815A (en) * | 1994-07-05 | 1997-09-23 | Motorola, Inc. | Layout for noise reduction on a reference voltage |
US5691566A (en) * | 1996-03-25 | 1997-11-25 | Hughes Electronics | Tapered three-wire line vertical connections |
US5854515A (en) * | 1996-07-23 | 1998-12-29 | Advanced Micro Devices, Inc. | Integrated circuit having conductors of enhanced cross-sectional area |
US5847462A (en) * | 1996-11-14 | 1998-12-08 | Advanced Micro Devices, Inc. | Integrated circuit having conductors of enhanced cross-sectional area with etch stop barrier layer |
JPH1174480A (ja) * | 1997-08-29 | 1999-03-16 | Oki Electric Ind Co Ltd | 半導体メモリ及びその製造方法 |
EP0978875A1 (en) * | 1998-08-07 | 2000-02-09 | STMicroelectronics S.r.l. | Integrated circuit comprising conductive lines with "negative" profile and related method of fabrication |
KR100338775B1 (ko) * | 2000-06-20 | 2002-05-31 | 윤종용 | Dram을 포함하는 반도체 소자의 콘택 구조체 및 그형성방법 |
US7227768B2 (en) * | 2005-07-01 | 2007-06-05 | Spansion Llc | Power interconnect structure for balanced bitline capacitance in a memory array |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4488166A (en) * | 1980-12-09 | 1984-12-11 | Fairchild Camera & Instrument Corp. | Multilayer metal silicide interconnections for integrated circuits |
FR2507979B1 (fr) * | 1981-06-17 | 1986-07-11 | Manutis | Dispositif elevateur d'une plate-forme monte sur un vehicule automobile |
JPS58100434A (ja) * | 1981-12-10 | 1983-06-15 | Matsushita Electronics Corp | リフトオフ用スペ−サ−の形成方法 |
US4617193A (en) * | 1983-06-16 | 1986-10-14 | Digital Equipment Corporation | Planar interconnect for integrated circuits |
JPS60780A (ja) * | 1983-06-17 | 1985-01-05 | Nec Corp | 電界効果トランジスタの製造方法 |
JPS60206164A (ja) * | 1984-03-30 | 1985-10-17 | Toshiba Corp | 半導体メモリ装置 |
JPS60229374A (ja) * | 1984-04-27 | 1985-11-14 | Toshiba Corp | 半導体装置およびその製造方法 |
JPH0628290B2 (ja) * | 1985-10-09 | 1994-04-13 | 三菱電機株式会社 | 回路用ヒューズを備えた半導体装置 |
JPS6290950A (ja) * | 1985-10-16 | 1987-04-25 | Mitsubishi Electric Corp | 半導体装置 |
-
1987
- 1987-03-10 JP JP62055904A patent/JP2584986B2/ja not_active Expired - Lifetime
-
1988
- 1988-01-13 US US07/143,400 patent/US4905068A/en not_active Expired - Lifetime
- 1988-01-25 DE DE3802066A patent/DE3802066A1/de active Granted
Also Published As
Publication number | Publication date |
---|---|
US4905068A (en) | 1990-02-27 |
JPS63221642A (ja) | 1988-09-14 |
DE3802066A1 (de) | 1988-09-22 |
JP2584986B2 (ja) | 1997-02-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: PRUFER & PARTNER GBR, 81545 MUENCHEN |
|
8339 | Ceased/non-payment of the annual fee |