DE3784130D1 - Kuehlung von objekten, zum beispiel halbleiteranordnungen. - Google Patents
Kuehlung von objekten, zum beispiel halbleiteranordnungen.Info
- Publication number
- DE3784130D1 DE3784130D1 DE8787115294T DE3784130T DE3784130D1 DE 3784130 D1 DE3784130 D1 DE 3784130D1 DE 8787115294 T DE8787115294 T DE 8787115294T DE 3784130 T DE3784130 T DE 3784130T DE 3784130 D1 DE3784130 D1 DE 3784130D1
- Authority
- DE
- Germany
- Prior art keywords
- example semiconductor
- semiconductor arrangements
- cooling objects
- arrangements
- objects
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
- H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61248801A JPH0770650B2 (ja) | 1986-10-20 | 1986-10-20 | 半導体装置の冷却方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3784130D1 true DE3784130D1 (de) | 1993-03-25 |
DE3784130T2 DE3784130T2 (de) | 1993-06-03 |
Family
ID=17183603
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8787115294T Expired - Fee Related DE3784130T2 (de) | 1986-10-20 | 1987-10-19 | Kuehlung von objekten, zum beispiel halbleiteranordnungen. |
Country Status (4)
Country | Link |
---|---|
US (2) | US5012858A (de) |
EP (1) | EP0264892B1 (de) |
JP (1) | JPH0770650B2 (de) |
DE (1) | DE3784130T2 (de) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5225157A (en) * | 1989-07-19 | 1993-07-06 | Microelectronics And Computer Technology Corporation | Amalgam composition for room temperature bonding |
US5173256A (en) * | 1989-08-03 | 1992-12-22 | International Business Machines Corporation | Liquid metal matrix thermal paste |
US5198189A (en) * | 1989-08-03 | 1993-03-30 | International Business Machines Corporation | Liquid metal matrix thermal paste |
DE4019091A1 (de) * | 1990-06-15 | 1991-12-19 | Battelle Institut E V | Waermeableitungseinrichtung fuer halbleiterbauelemente und verfahren zu deren herstellung |
DE69117891T2 (de) * | 1990-11-20 | 1996-07-25 | Sumitomo Electric Industries | Verfahren zum Montieren von Halbleiterelementen |
US5146981A (en) * | 1991-11-14 | 1992-09-15 | Digital Equipment Corporation | Substrate to heatsink interface apparatus and method |
WO1993016883A1 (en) * | 1992-02-26 | 1993-09-02 | Seiko Epson Corporation | Additional electronic device and electronic system |
EP0563668A2 (de) * | 1992-04-01 | 1993-10-06 | Siemens Nixdorf Informationssysteme Aktiengesellschaft | Einrichtung zum Kühlen von zu Flachbaugruppen zusammengefassten gehäuselosen integrierten Bausteinen |
US8213431B2 (en) * | 2008-01-18 | 2012-07-03 | The Boeing Company | System and method for enabling wireless real time applications over a wide area network in high signal intermittence environments |
EP0608418B1 (de) | 1992-05-20 | 1998-11-04 | Seiko Epson Corporation | Kassette für eine elektronische vorrichtung |
US5445308A (en) * | 1993-03-29 | 1995-08-29 | Nelson; Richard D. | Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal |
US5328087A (en) * | 1993-03-29 | 1994-07-12 | Microelectronics And Computer Technology Corporation | Thermally and electrically conductive adhesive material and method of bonding with same |
US5399200A (en) * | 1994-03-10 | 1995-03-21 | Stauffer; Craig M. | Module in an integrated delivery system for chemical vapors from liquid sources |
US6065529A (en) * | 1997-01-10 | 2000-05-23 | Trw Inc. | Embedded heat pipe structure |
US6108208A (en) * | 1997-12-08 | 2000-08-22 | Unisys Corporation | Testing assembly having a pressed joint with a single layer of thermal conductor which is reused to sequentially test multiple circuit modules |
KR100310099B1 (ko) * | 1998-08-20 | 2001-12-17 | 윤종용 | 반도체집적회로장치용방열장치및그것을구비하는휴대용컴퓨터 |
US6084775A (en) * | 1998-12-09 | 2000-07-04 | International Business Machines Corporation | Heatsink and package structures with fusible release layer |
US6085831A (en) * | 1999-03-03 | 2000-07-11 | International Business Machines Corporation | Direct chip-cooling through liquid vaporization heat exchange |
US6075702A (en) * | 1999-05-26 | 2000-06-13 | Hewlett-Packard Company | Heat transfer device for a retention assembly |
US6372997B1 (en) | 2000-02-25 | 2002-04-16 | Thermagon, Inc. | Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink |
US6339120B1 (en) | 2000-04-05 | 2002-01-15 | The Bergquist Company | Method of preparing thermally conductive compounds by liquid metal bridged particle clusters |
US6984685B2 (en) * | 2000-04-05 | 2006-01-10 | The Bergquist Company | Thermal interface pad utilizing low melting metal with retention matrix |
US6797758B2 (en) * | 2000-04-05 | 2004-09-28 | The Bergquist Company | Morphing fillers and thermal interface materials |
JP4241623B2 (ja) | 2003-02-24 | 2009-03-18 | 富士通株式会社 | 半導体装置および半導体装置の製造方法 |
JP4337648B2 (ja) * | 2004-06-24 | 2009-09-30 | 株式会社ニコン | Euv光源、euv露光装置、及び半導体デバイスの製造方法 |
JP4714434B2 (ja) * | 2004-07-20 | 2011-06-29 | 古河スカイ株式会社 | ヒートパイプヒートシンク |
US20080099476A1 (en) * | 2006-10-31 | 2008-05-01 | Fung Duncan C | Foldable ovenware container and method of production |
JP6209376B2 (ja) * | 2013-07-08 | 2017-10-04 | 株式会社日本マイクロニクス | 電気的接続装置 |
CN116536547B (zh) * | 2023-07-06 | 2023-10-27 | 有研工程技术研究院有限公司 | 一种橡皮泥状金属材料及其制备方法和应用 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3852803A (en) * | 1973-06-18 | 1974-12-03 | Gen Electric | Heat sink cooled power semiconductor device assembly having liquid metal interface |
EP0017472A1 (de) * | 1979-04-06 | 1980-10-15 | Lintott Engineering Limited | Vakuumapparatur mit einer Vorrichtung zur Wärmeübertragung und Verfahren zur Herstellung von Halbleiterkomponenten unter Anwendung dieser Apparatus |
US4313492A (en) * | 1979-12-20 | 1982-02-02 | International Business Machines Corporation | Micro helix thermo capsule |
US4446916A (en) * | 1981-08-13 | 1984-05-08 | Hayes Claude Q C | Heat-absorbing heat sink |
JPS58196041A (ja) * | 1982-05-12 | 1983-11-15 | Hitachi Ltd | 熱伝達接続装置 |
JPS58199546A (ja) * | 1982-05-17 | 1983-11-19 | Hitachi Ltd | 半導体冷却装置 |
JPS60160149A (ja) * | 1984-01-26 | 1985-08-21 | Fujitsu Ltd | 集積回路装置の冷却方式 |
US4639829A (en) * | 1984-06-29 | 1987-01-27 | International Business Machines Corporation | Thermal conduction disc-chip cooling enhancement means |
US4649990A (en) * | 1985-05-06 | 1987-03-17 | Hitachi, Ltd. | Heat-conducting cooling module |
US4879632A (en) * | 1985-10-04 | 1989-11-07 | Fujitsu Limited | Cooling system for an electronic circuit device |
-
1986
- 1986-10-20 JP JP61248801A patent/JPH0770650B2/ja not_active Expired - Fee Related
-
1987
- 1987-10-19 DE DE8787115294T patent/DE3784130T2/de not_active Expired - Fee Related
- 1987-10-19 EP EP87115294A patent/EP0264892B1/de not_active Expired - Lifetime
-
1989
- 1989-04-10 US US07/334,770 patent/US5012858A/en not_active Expired - Lifetime
- 1989-05-08 US US07/348,370 patent/US5024264A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5012858A (en) | 1991-05-07 |
EP0264892A2 (de) | 1988-04-27 |
EP0264892A3 (en) | 1988-07-27 |
EP0264892B1 (de) | 1993-02-10 |
JPS63102345A (ja) | 1988-05-07 |
JPH0770650B2 (ja) | 1995-07-31 |
DE3784130T2 (de) | 1993-06-03 |
US5024264A (en) | 1991-06-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3784130D1 (de) | Kuehlung von objekten, zum beispiel halbleiteranordnungen. | |
DE3786861D1 (de) | Halbleiteranordnung mit gehaeuse mit kuehlungsmitteln. | |
DE3788503D1 (de) | Markieren von artikeln. | |
FI873584A0 (fi) | Mjuk, sockerfri, poroes soetsaks- resp. bakverkssammansaettning. | |
FI884892A (fi) | Tippbar slaepvagn foer motorfordon, speciellt personbilar. | |
DE3783669D1 (de) | Alpha-aryl-alpha-phenethyl-1h-1,2,4-triazol-1-propan-nitrile. | |
FI872594A (fi) | Cementprodukter, vilka innehaoller ytbehandlade oorganiska partiklar. | |
FI875619A (fi) | 6-benzoxazinyl- och 6-benzotiazonyl-2,3,4,5-tetrahydropyridazin-3-oner. | |
FI881322A (fi) | Haestsko, skaerskilt foer travhaestar. | |
FI872267A0 (fi) | Stabila, vattenhaltiga suspensionskoncentratkompositioner. | |
DE3783507D1 (de) | Zusammengesetztes halbleiterbauelement. | |
DE3767815D1 (de) | Sortiermaschine. | |
DE3787137D1 (de) | Halbleiteranordnung. | |
DE3787848D1 (de) | Halbleiterdiode. | |
FI874864A0 (fi) | Oformade, eldfasta massor. | |
IT8622279A0 (it) | Procedimento per il lavaggio di oggetti, in particolare biancheria. | |
FI872598A0 (fi) | N-1h-tetrazol-5-yl-2-tiofen-, n-1h -tetrazol-5-yl-2-pyrrol- och n-1h-tetrazol-5-yl-2-furankarboxamider. | |
DE3767619D1 (de) | Sortiermaschine. | |
DE3784777D1 (de) | Halbleiteranordnung. | |
DE3786951D1 (de) | Leistungshalbleiteranordnung. | |
FI865279A0 (fi) | Profilbelagd foensterkonstruktion, i synnerhet foer bandfoenster. | |
DE3776223D1 (de) | Sortiermaschine. | |
DE3769740D1 (de) | Befestigung von artikeln. | |
FI862337A0 (fi) | Spaenningsanordning foer en pappersmaskins vaevnader saosom viror, filtar, torkningsvaevnader, speciellt filtarna i presspartiet. | |
FI875128A0 (fi) | Kabelmuff, isynnerhet en intagningskabelmuff foer partraods intagningskabel. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |