DE3781295D1 - Ladungsverschiebeanordnung. - Google Patents
Ladungsverschiebeanordnung.Info
- Publication number
- DE3781295D1 DE3781295D1 DE8787200370T DE3781295T DE3781295D1 DE 3781295 D1 DE3781295 D1 DE 3781295D1 DE 8787200370 T DE8787200370 T DE 8787200370T DE 3781295 T DE3781295 T DE 3781295T DE 3781295 D1 DE3781295 D1 DE 3781295D1
- Authority
- DE
- Germany
- Prior art keywords
- load shifting
- shifting arrangement
- arrangement
- load
- shifting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/107—Substrate region of field-effect devices
- H01L29/1091—Substrate region of field-effect devices of charge coupled devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/762—Charge transfer devices
- H01L29/765—Charge-coupled devices
- H01L29/768—Charge-coupled devices with field effect produced by an insulated gate
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Electromagnetism (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL8600786A NL8600786A (nl) | 1986-03-27 | 1986-03-27 | Ladingsgekoppelde inrichting. |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3781295D1 true DE3781295D1 (de) | 1992-10-01 |
DE3781295T2 DE3781295T2 (de) | 1993-03-18 |
Family
ID=19847783
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8787200370T Expired - Fee Related DE3781295T2 (de) | 1986-03-27 | 1987-03-02 | Ladungsverschiebeanordnung. |
Country Status (7)
Country | Link |
---|---|
US (1) | US4878102A (de) |
EP (1) | EP0239151B1 (de) |
JP (1) | JPS62237761A (de) |
AU (1) | AU593080B2 (de) |
CA (1) | CA1278863C (de) |
DE (1) | DE3781295T2 (de) |
NL (1) | NL8600786A (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01171361A (ja) * | 1987-12-25 | 1989-07-06 | Fuji Xerox Co Ltd | 原稿読取装置 |
US5159419A (en) * | 1988-03-15 | 1992-10-27 | Texas Instruments Incorporated | CCD imager responsive to long wavelength radiation |
US5252509A (en) * | 1988-03-15 | 1993-10-12 | Texas Instruments Incorporated | Ccd imager responsive to long wavelength radiation |
JP2517375B2 (ja) * | 1988-12-19 | 1996-07-24 | 三菱電機株式会社 | 固体撮像装置および該装置に用いられる電荷転送装置ならびにその製造方法 |
JPH0355854A (ja) * | 1989-07-25 | 1991-03-11 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
US5223726A (en) * | 1989-07-25 | 1993-06-29 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device for charge transfer device |
US5173756A (en) * | 1990-01-05 | 1992-12-22 | International Business Machines Corporation | Trench charge-coupled device |
JP2825004B2 (ja) * | 1991-02-08 | 1998-11-18 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 側壁電荷結合撮像素子及びその製造方法 |
EP0512607B1 (de) * | 1991-05-03 | 1997-07-16 | Koninklijke Philips Electronics N.V. | Verfahren zur Herstellung eines Halbleiterbauelements mit Ionenimplantierung |
JP2816063B2 (ja) * | 1992-10-06 | 1998-10-27 | 松下電器産業株式会社 | 電荷転送装置 |
US5981988A (en) * | 1996-04-26 | 1999-11-09 | The Regents Of The University Of California | Three-dimensional charge coupled device |
FR2852770B1 (fr) * | 2003-03-21 | 2005-05-27 | Capteur d'image a cycle de lecture rapide | |
JP2005268476A (ja) * | 2004-03-18 | 2005-09-29 | Fuji Film Microdevices Co Ltd | 光電変換膜積層型固体撮像装置 |
US7859026B2 (en) * | 2006-03-16 | 2010-12-28 | Spansion Llc | Vertical semiconductor device |
GB2468668B (en) * | 2009-03-17 | 2014-07-16 | E2V Tech Uk Ltd | CCD imaging array with extended dynamic range |
KR102401724B1 (ko) * | 2015-04-30 | 2022-05-25 | 삼성디스플레이 주식회사 | 미세 전극 형성 방법 |
FR3108784B1 (fr) * | 2020-03-30 | 2022-04-01 | St Microelectronics Crolles 2 Sas | Dispositif à couplage de charges |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3906543A (en) * | 1971-12-23 | 1975-09-16 | Bell Telephone Labor Inc | Solid state imaging apparatus employing charge transfer devices |
NL181766C (nl) * | 1973-03-19 | 1987-10-16 | Philips Nv | Ladingsgekoppelde halfgeleiderschakeling, waarbij pakketten meerderheidsladingsdragers door een halfgeleiderlaag evenwijdig aan de halfgeleiderlaag kunnen worden overgedragen. |
DE2412345A1 (de) * | 1974-03-14 | 1975-09-18 | Siemens Ag | Ladungsverschiebeanordnung |
JPS5120680A (ja) * | 1974-08-13 | 1976-02-19 | Fujitsu Ltd | Denkatensosochi |
US4047215A (en) * | 1975-01-31 | 1977-09-06 | Texas Instruments Incorporated | Uniphase charge coupled devices |
DE2646301C3 (de) * | 1975-10-31 | 1981-01-15 | Fujitsu Ltd., Kawasaki, Kanagawa (Japan) | Ladungsgekoppeltes Halbleiterbauelement |
US4252579A (en) * | 1979-05-07 | 1981-02-24 | International Business Machines Corporation | Method for making single electrode U-MOSFET random access memory utilizing reactive ion etching and polycrystalline deposition |
US4450464A (en) * | 1980-07-23 | 1984-05-22 | Matsushita Electric Industrial Co., Ltd. | Solid state area imaging apparatus having a charge transfer arrangement |
DE3418778A1 (de) * | 1984-05-19 | 1985-11-21 | Josef Dr. 8048 Haimhausen Kemmer | Ccd-halbleiterbauelement |
JPS61161012A (ja) * | 1985-01-10 | 1986-07-21 | Matsushita Electronics Corp | Ccdシフトレジスタ |
JP3072670B2 (ja) * | 1992-02-28 | 2000-07-31 | 味の素株式会社 | ガラクトオリゴ糖の製造方法 |
-
1986
- 1986-03-27 NL NL8600786A patent/NL8600786A/nl not_active Application Discontinuation
-
1987
- 1987-03-02 DE DE8787200370T patent/DE3781295T2/de not_active Expired - Fee Related
- 1987-03-02 EP EP87200370A patent/EP0239151B1/de not_active Expired
- 1987-03-25 AU AU70606/87A patent/AU593080B2/en not_active Ceased
- 1987-03-26 CA CA000533094A patent/CA1278863C/en not_active Expired - Lifetime
- 1987-03-27 JP JP62071910A patent/JPS62237761A/ja active Pending
-
1988
- 1988-11-18 US US07/274,653 patent/US4878102A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0239151A1 (de) | 1987-09-30 |
DE3781295T2 (de) | 1993-03-18 |
JPS62237761A (ja) | 1987-10-17 |
US4878102A (en) | 1989-10-31 |
CA1278863C (en) | 1991-01-08 |
EP0239151B1 (de) | 1992-08-26 |
NL8600786A (nl) | 1987-10-16 |
AU593080B2 (en) | 1990-02-01 |
AU7060687A (en) | 1987-10-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: PHILIPS ELECTRONICS N.V., EINDHOVEN, NL |
|
8339 | Ceased/non-payment of the annual fee |