DE3781050T2 - Fertigbearbeitung durch loetung von draehten an integrierten schaltungsgehaeusen. - Google Patents
Fertigbearbeitung durch loetung von draehten an integrierten schaltungsgehaeusen.Info
- Publication number
- DE3781050T2 DE3781050T2 DE8787401417T DE3781050T DE3781050T2 DE 3781050 T2 DE3781050 T2 DE 3781050T2 DE 8787401417 T DE8787401417 T DE 8787401417T DE 3781050 T DE3781050 T DE 3781050T DE 3781050 T2 DE3781050 T2 DE 3781050T2
- Authority
- DE
- Germany
- Prior art keywords
- finishing
- integrated circuit
- soldering wires
- circuit boxes
- boxes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005476 soldering Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/878,307 US4720396A (en) | 1986-06-25 | 1986-06-25 | Solder finishing integrated circuit package leads |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3781050D1 DE3781050D1 (de) | 1992-09-17 |
DE3781050T2 true DE3781050T2 (de) | 1992-12-17 |
Family
ID=25371767
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8787401417T Expired - Lifetime DE3781050T2 (de) | 1986-06-25 | 1987-06-23 | Fertigbearbeitung durch loetung von draehten an integrierten schaltungsgehaeusen. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4720396A (de) |
EP (1) | EP0251879B1 (de) |
JP (1) | JPH078431B2 (de) |
KR (1) | KR950013051B1 (de) |
CA (1) | CA1247753A (de) |
DE (1) | DE3781050T2 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5057969A (en) * | 1990-09-07 | 1991-10-15 | International Business Machines Corporation | Thin film electronic device |
US5248520A (en) * | 1992-02-13 | 1993-09-28 | National Semiconductor Corporation | Solder finishing planar leaded flat package integrated circuit leads |
KR960039315A (ko) * | 1995-04-06 | 1996-11-25 | 이대원 | 리드프레임 제조방법 |
US6315189B1 (en) * | 1998-10-13 | 2001-11-13 | Texas Instruments Incorporated | Semiconductor package lead plating method and apparatus |
US7196313B2 (en) * | 2004-04-02 | 2007-03-27 | Fairchild Semiconductor Corporation | Surface mount multi-channel optocoupler |
WO2007005263A2 (en) | 2005-06-30 | 2007-01-11 | Fairchild Semiconductor Corporation | Semiconductor die package and method for making the same |
US20090057852A1 (en) * | 2007-08-27 | 2009-03-05 | Madrid Ruben P | Thermally enhanced thin semiconductor package |
US20070164428A1 (en) * | 2006-01-18 | 2007-07-19 | Alan Elbanhawy | High power module with open frame package |
US7868432B2 (en) * | 2006-02-13 | 2011-01-11 | Fairchild Semiconductor Corporation | Multi-chip module for battery power control |
US7768075B2 (en) * | 2006-04-06 | 2010-08-03 | Fairchild Semiconductor Corporation | Semiconductor die packages using thin dies and metal substrates |
US7656024B2 (en) | 2006-06-30 | 2010-02-02 | Fairchild Semiconductor Corporation | Chip module for complete power train |
US7564124B2 (en) * | 2006-08-29 | 2009-07-21 | Fairchild Semiconductor Corporation | Semiconductor die package including stacked dice and heat sink structures |
US7659531B2 (en) * | 2007-04-13 | 2010-02-09 | Fairchild Semiconductor Corporation | Optical coupler package |
US7902657B2 (en) * | 2007-08-28 | 2011-03-08 | Fairchild Semiconductor Corporation | Self locking and aligning clip structure for semiconductor die package |
US20090057855A1 (en) * | 2007-08-30 | 2009-03-05 | Maria Clemens Quinones | Semiconductor die package including stand off structures |
US20090140266A1 (en) * | 2007-11-30 | 2009-06-04 | Yong Liu | Package including oriented devices |
US7589338B2 (en) * | 2007-11-30 | 2009-09-15 | Fairchild Semiconductor Corporation | Semiconductor die packages suitable for optoelectronic applications having clip attach structures for angled mounting of dice |
US7781872B2 (en) * | 2007-12-19 | 2010-08-24 | Fairchild Semiconductor Corporation | Package with multiple dies |
US8106406B2 (en) | 2008-01-09 | 2012-01-31 | Fairchild Semiconductor Corporation | Die package including substrate with molded device |
US7626249B2 (en) * | 2008-01-10 | 2009-12-01 | Fairchild Semiconductor Corporation | Flex clip connector for semiconductor device |
US20090194856A1 (en) * | 2008-02-06 | 2009-08-06 | Gomez Jocel P | Molded package assembly |
KR101524545B1 (ko) * | 2008-02-28 | 2015-06-01 | 페어차일드코리아반도체 주식회사 | 전력 소자 패키지 및 그 제조 방법 |
US8193618B2 (en) | 2008-12-12 | 2012-06-05 | Fairchild Semiconductor Corporation | Semiconductor die package with clip interconnection |
US7973393B2 (en) * | 2009-02-04 | 2011-07-05 | Fairchild Semiconductor Corporation | Stacked micro optocouplers and methods of making the same |
US8421204B2 (en) | 2011-05-18 | 2013-04-16 | Fairchild Semiconductor Corporation | Embedded semiconductor power modules and packages |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3196830A (en) * | 1959-07-06 | 1965-07-27 | Sprague Electric Co | Capillary applicator for semiconductor alloying apparatus |
GB1036222A (en) * | 1964-03-04 | 1966-07-13 | Ericsson Telephones Ltd | Soldered connections to printed circuit boards |
US3593677A (en) * | 1967-11-09 | 1971-07-20 | Brown Engineering Co | Soldering apparatus and method |
US3713876A (en) * | 1970-04-07 | 1973-01-30 | Western Electric Co | Methods of metal coating articles |
US4212265A (en) * | 1978-07-31 | 1980-07-15 | Motorola, Inc. | Tinning apparatus for multiple solder surfaces |
US4410126A (en) * | 1978-10-12 | 1983-10-18 | Cooper Industries, Inc. | Mass soldering system |
US4383494A (en) * | 1979-11-13 | 1983-05-17 | Allied Corporation | Solder-coating apparatus |
US4437943A (en) * | 1980-07-09 | 1984-03-20 | Olin Corporation | Method and apparatus for bonding metal wire to a base metal substrate |
US4512510A (en) * | 1982-10-26 | 1985-04-23 | Nihon Den-Nitsu Keiki Co. Ltd. | Printed circuit board soldering apparatus |
JPS59202163A (ja) * | 1983-04-30 | 1984-11-15 | Tamura Seisakusho Co Ltd | 自動はんだ付け装置 |
US4570569A (en) * | 1983-11-14 | 1986-02-18 | Nihon Den-Netsu Keiki Co., Ltd. | Soldering apparatus |
JPS6158261A (ja) * | 1984-08-29 | 1986-03-25 | Toshiba Corp | 半導体装置の製造方法 |
JPH06158261A (ja) * | 1992-11-30 | 1994-06-07 | Nippon Steel Corp | 溶融金属めっきの付着量制御方法 |
-
1986
- 1986-06-25 US US06/878,307 patent/US4720396A/en not_active Expired - Lifetime
-
1987
- 1987-06-23 EP EP87401417A patent/EP0251879B1/de not_active Expired - Lifetime
- 1987-06-23 DE DE8787401417T patent/DE3781050T2/de not_active Expired - Lifetime
- 1987-06-24 KR KR1019870006405A patent/KR950013051B1/ko not_active IP Right Cessation
- 1987-06-24 CA CA000540461A patent/CA1247753A/en not_active Expired
- 1987-06-25 JP JP62156702A patent/JPH078431B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CA1247753A (en) | 1988-12-28 |
US4720396A (en) | 1988-01-19 |
EP0251879A2 (de) | 1988-01-07 |
EP0251879A3 (en) | 1988-03-30 |
JPS6372478A (ja) | 1988-04-02 |
DE3781050D1 (de) | 1992-09-17 |
KR950013051B1 (ko) | 1995-10-24 |
KR880001190A (ko) | 1988-03-31 |
JPH078431B2 (ja) | 1995-02-01 |
EP0251879B1 (de) | 1992-08-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |