DE3706344A1 - Schaltungsblock - Google Patents

Schaltungsblock

Info

Publication number
DE3706344A1
DE3706344A1 DE19873706344 DE3706344A DE3706344A1 DE 3706344 A1 DE3706344 A1 DE 3706344A1 DE 19873706344 DE19873706344 DE 19873706344 DE 3706344 A DE3706344 A DE 3706344A DE 3706344 A1 DE3706344 A1 DE 3706344A1
Authority
DE
Germany
Prior art keywords
lead frame
circuit block
aluminum wires
circuit
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19873706344
Other languages
English (en)
Inventor
Isato Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seikosha KK
Original Assignee
Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seikosha KK filed Critical Seikosha KK
Publication of DE3706344A1 publication Critical patent/DE3706344A1/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49589—Capacitor integral with or on the leadframe
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Description

Die Erfindung betrifft einen Schaltungsblock zur Verwen­ dung in einem elektrischen Instrument oder ähnlichem und im einzelnen einen Schaltungsblock mit einem Leiterrahmen, auf dem ein integrierter Schaltkreis (IC) angeordnet ist.
Bei einem in Fig. 2 gezeigten herkömmlichen Schaltungs­ block ist ein IC 12 auf einer Leiterplatte 11 angeordnet. Der IC 12 ist mit Hilfe der sogenannten Bondtechnik mittels Aluminiumdrähten 13 mit Anschlüssen 14 der Leiterplatte verbunden. Die angeschlossenen Aluminiumdrähte 13 sind in der Draufsicht im wesentlichen radial gerichtet. Aluminium­ drähte haben, wenn sie der Drahtbondtechnik ausgesetzt werden, eine Richtungseigenschaft. Das heißt, die Verbin­ dungsrichtung der Aluminiumdrähte ist beschränkt, und das Drahtbonden mit Aluminiumdrähten wird gewöhnlich unter Drehen der Leiterplatte 11 ausgeführt. Infolge des Drehens der Leiterplatte nimmt dieses herkömmliche Drahtbonden viel Zeit in Anspruch, was sich auf die Kosten des Schal­ tungsblocks auswirkt.
Es ist möglich, Leiterplatten (mit gedruckten Schaltungen) zu drehen, es ist aber sehr schwierig, einen Leiterrahmen in Form eines Schaltungsmusters zu drehen, während ein IC mit Aluminiumdrähten mittels der Bondtechnik angeschlossen wird, da der Teil des Leiterrahmens, an dem das Bonden ausgeführt wird, feststehen muß und nicht schwingen darf.
Aufgabe der Erfindung ist es, einen Schaltungsblock mit einem auf einem Leiterrahmen angeordneten IC zu schaffen, bei dem ein Anschluß des ICs mit Hilfe von Aluminiumdrähten, die durch die Bondtechnik befestigt werden, möglich ist, ohne daß der Leiterrahmen gedreht werden muß.
Diese Aufgabe wird erfindungsgemäß durch einen Schaltungs­ block mit den Merkmalen des Patentanspruchs gelöst.
Ein Ausführungsbeispiel der Erfindung wird nachfolgend anhand der Zeichnungen näher erläutert. Es zeigen:
Fig. 1 eine Draufsicht auf ein Ausführungs­ beispiel der Erfindung,
Fig. 2 eine Draufsicht auf einen herkömmlichen Schaltungsblock mit einer Leiterplatte.
Zur Erläuterung des Ausführungsbeispiels sei auf Fig. 1 Bezug genommen.
Ein Leiterrahmen 1 besteht aus elektrisch leitendem Metall­ material, das zu einem Schaltungsmuster geformt ist. Ein Kondensator 2 und ein Quarzschwinger 3 sind an dem Leiter­ rahmen 1 befestigt. Ein Batteriekontakt 4 ist einstückig mit dem Leiterrahmen ausgebildet. Ein IC 7 ist an einem Inselteil 6 befestigt. Der IC 7 und Leiter 8 A, 8 B, 8 C, 8 D, 8 E, 8 F sind mit Hilfe der Bondtechnik durch Aluminium­ drähte 9 verbunden. Die Aluminiumdrähte 9 sind im wesent­ lichen parallel ausgerichtet, wie deutlich in Fig. 1 er­ kennbar. Die Leiter 8 A-8 F sind so ausgebildet bzw. an­ geordnet, daß die Verbindungsdrähte parallel ausgerichtet sind. Nach dem Befestigen der Aluminiumdrähte wird der IC mit Hilfe eines Schutzharzes 10 überzogen und abgedichtet.

Claims (1)

  1. Schaltungsblock, umfassend einen ein Schaltungsmuster bil­ denden Leiterrahmen (1) und einen integrierten Schaltkreis (7), der auf dem Leiterrahmen (1) angeordnet ist und mit dessen Leitern (8 A-8 F) durch Aluminiumdrähte (9) ver­ bunden ist, dadurch gekennzeichnet, daß die mittels der Bondtechnik angeschlossenen Aluminium­ drähte (9) in einer Richtung ausgerichtet sind.
DE19873706344 1986-03-04 1987-02-27 Schaltungsblock Ceased DE3706344A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986031016U JPS62142850U (de) 1986-03-04 1986-03-04

Publications (1)

Publication Number Publication Date
DE3706344A1 true DE3706344A1 (de) 1987-09-10

Family

ID=12319738

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19873706344 Ceased DE3706344A1 (de) 1986-03-04 1987-02-27 Schaltungsblock

Country Status (4)

Country Link
JP (1) JPS62142850U (de)
DE (1) DE3706344A1 (de)
GB (1) GB2189934B (de)
HK (1) HK89192A (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2317990B (en) * 1994-01-12 1998-08-12 Fujitsu Ltd Hybrid integrated circuit module
JPH07211856A (ja) * 1994-01-12 1995-08-11 Fujitsu Ltd 集積回路モジュール

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3447345A1 (de) * 1983-12-27 1985-07-11 Mitsubishi Denki K.K., Tokio/Tokyo Integrierte halbleiterschaltkreisanordnung
DE3401286C2 (de) * 1984-01-16 1986-02-20 Deubzer-Eltec GmbH, 8000 München Bondgerät

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3760090A (en) * 1971-08-19 1973-09-18 Globe Union Inc Electronic circuit package and method for making same
DE3106376A1 (de) * 1981-02-20 1982-09-09 Siemens AG, 1000 Berlin und 8000 München Halbleiteranordnung mit aus blech ausgeschnittenen anschlussleitern
US4567545A (en) * 1983-05-18 1986-01-28 Mettler Rollin W Jun Integrated circuit module and method of making same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3447345A1 (de) * 1983-12-27 1985-07-11 Mitsubishi Denki K.K., Tokio/Tokyo Integrierte halbleiterschaltkreisanordnung
DE3401286C2 (de) * 1984-01-16 1986-02-20 Deubzer-Eltec GmbH, 8000 München Bondgerät

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Automatisches Bonden von integrierten Schaltkreisen. In: Feinwerktechnik u. Messtechnik 91(1983)7, S. 331-332 *
JP-PS-Abstract, Kokai No. 52-140272 (englischsprach.Übersetzung) *

Also Published As

Publication number Publication date
HK89192A (en) 1992-11-20
GB8704550D0 (en) 1987-04-01
GB2189934A (en) 1987-11-04
JPS62142850U (de) 1987-09-09
GB2189934B (en) 1989-11-08

Similar Documents

Publication Publication Date Title
DE2732529C2 (de) Gedruckte Schaltungsplatine
EP0961531B1 (de) Hochintegrierte elektronische Schaltung, insbesondere zum Einsatz in Herzschrittmachern
DE3610821C2 (de)
DE2242337C2 (de) Vorrichtung zur Halterung von Schaltungskarten
DE2755926A1 (de) Schaltungsplatine sowie verfahren zu ihrer herstellung
EP1393605B1 (de) Leiterplatte mit mindestens einem elektronischen bauteil
CH667562A5 (de) Verfahren zum aendern einer elektrischen flachbaugruppe.
EP0092086B1 (de) Anschlussvorrichtung für ein plattenförmiges elektrisches Gerät
DE2532727A1 (de) Verbindungsvorrichtung
DE2217647B2 (de) Verbindungsanordnung zum Anschließen einer integrierten Schaltung und Verfahren zu ihrer Herstellung
DE60128537T2 (de) Zusammenbau zur verbindung von mindestens zwei gedruckten schaltungen
EP0110114B1 (de) Abdeckband für galvanische Prozesse
DE19539181C2 (de) Chipkartenmodul sowie entsprechendes Herstellungsverfahren
DE4022829A1 (de) Tragbare speicherkarte
DE3706344A1 (de) Schaltungsblock
DE2528119A1 (de) Elektrisch leitendes band
DE3614087A1 (de) Vorrichtung und verfahren zur verbesserten verkapselung von halbleitervorrichtungen
DE19833928B4 (de) Biometrische Sensoreinrichtung mit in einem Flexleiterband integrierten elektronischen Bauelementen
DE3028047A1 (de) Vorrichtung zum aufbau von elektrischen schaltungen durch einstecken von elektrischen bauelementen, insbesondere elektronischer lehr- und experimentierbaukasten
DE3925155C2 (de)
DE2928960A1 (de) Halte- und anschlussvorrichtung fuer elektrische bauelemente
DE2657298A1 (de) Mehrschichtige, gedruckte verdrahtungsplatte
DD295499A5 (de) Verfahren zum fertigen von verdrahtungstraegern mit draehten
DE2314566A1 (de) Schaltkarte und verfahren zur herstellung der schaltkarte
DE3220942A1 (de) Substrat zum anbringen von elektrischen bauelementenund verfahren zum anbringen der bauelemente an einem derartigen substrat

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8131 Rejection