DE3686314D1 - Vorrichtung zur bestimmung der haftkraefte eines klebstoffes zwischen einem halbleiter und seinem substrat. - Google Patents

Vorrichtung zur bestimmung der haftkraefte eines klebstoffes zwischen einem halbleiter und seinem substrat.

Info

Publication number
DE3686314D1
DE3686314D1 DE8686117185T DE3686314T DE3686314D1 DE 3686314 D1 DE3686314 D1 DE 3686314D1 DE 8686117185 T DE8686117185 T DE 8686117185T DE 3686314 T DE3686314 T DE 3686314T DE 3686314 D1 DE3686314 D1 DE 3686314D1
Authority
DE
Germany
Prior art keywords
adhesive
semiconductor
substrate
determining
adhesive force
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686117185T
Other languages
English (en)
Other versions
DE3686314T2 (de
Inventor
Eiichi Irie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1985190304U external-priority patent/JPH0643143Y2/ja
Priority claimed from JP16819786U external-priority patent/JPH0543079Y2/ja
Application filed by Lintec Corp filed Critical Lintec Corp
Application granted granted Critical
Publication of DE3686314D1 publication Critical patent/DE3686314D1/de
Publication of DE3686314T2 publication Critical patent/DE3686314T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N19/00—Investigating materials by mechanical methods
    • G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
    • Y10S156/935—Delaminating means in preparation for post consumer recycling
    • Y10S156/937—Means for delaminating specified electronic component in preparation for recycling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE8686117185T 1985-12-12 1986-12-10 Vorrichtung zur bestimmung der haftkraefte eines klebstoffes zwischen einem halbleiter und seinem substrat. Expired - Lifetime DE3686314T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1985190304U JPH0643143Y2 (ja) 1985-12-12 1985-12-12 半導体ウエハと薄板を接着する接着剤の接着力制御装置
JP16819786U JPH0543079Y2 (de) 1986-11-04 1986-11-04

Publications (2)

Publication Number Publication Date
DE3686314D1 true DE3686314D1 (de) 1992-09-10
DE3686314T2 DE3686314T2 (de) 1992-12-17

Family

ID=26491995

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686117185T Expired - Lifetime DE3686314T2 (de) 1985-12-12 1986-12-10 Vorrichtung zur bestimmung der haftkraefte eines klebstoffes zwischen einem halbleiter und seinem substrat.

Country Status (6)

Country Link
US (1) US4718967A (de)
EP (1) EP0226949B1 (de)
KR (1) KR900004688B1 (de)
DE (1) DE3686314T2 (de)
PH (1) PH25206A (de)
SG (1) SG106392G (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5094709A (en) * 1986-09-26 1992-03-10 General Electric Company Apparatus for packaging integrated circuit chips employing a polymer film overlay layer
US4934920A (en) * 1987-06-17 1990-06-19 Mitsubishi Denki Kabushiki Kaisha Apparatus for producing semiconductor device
US5115545A (en) * 1989-03-28 1992-05-26 Matsushita Electric Industrial Co., Ltd. Apparatus for connecting semiconductor devices to wiring boards
US5269868A (en) * 1989-10-12 1993-12-14 Mitsubishi Denki Kabushiki Kaisha Method for separating bonded substrates, in particular disassembling a liquid crystal display device
AU634838B2 (en) * 1989-12-08 1993-03-04 Sumitomo Electric Industries, Ltd. Pickup method and the pickup apparatus for chip-type part
US5476566A (en) * 1992-09-02 1995-12-19 Motorola, Inc. Method for thinning a semiconductor wafer
US5972051A (en) * 1993-06-17 1999-10-26 Vlsi Technology, Inc Method and apparatus for removing particles from semiconductor wafer edges using a particle withdrawing means
JP3518786B2 (ja) * 1995-12-02 2004-04-12 リンテック株式会社 ダイシングテープ用光照射装置および光照射方法
EP1498935B1 (de) * 2003-07-15 2006-04-26 Tokyo Seimitsu Co.,Ltd. Verfahren und Vorrichtung zum Berechnen einer Lichtmenge
JP4693805B2 (ja) * 2007-03-16 2011-06-01 株式会社東芝 半導体装置の製造装置及び製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3968885A (en) * 1973-06-29 1976-07-13 International Business Machines Corporation Method and apparatus for handling workpieces
CA1044379A (en) * 1974-12-28 1978-12-12 Sony Corporation Wafer transfer device
JPS5850164A (ja) * 1981-09-19 1983-03-24 Nippon Steel Corp 連続鋳造設備
US4436985A (en) * 1982-05-03 1984-03-13 Gca Corporation Apparatus for heat treating semiconductor wafers
US4497896A (en) * 1982-07-19 1985-02-05 St. Lawrence Technologies Limited Fermentation of glucose with recycle of non-fermented components
JPS59126648A (ja) * 1983-01-07 1984-07-21 Nec Home Electronics Ltd ペレツト剥離方法
GB8333794D0 (en) * 1983-12-19 1984-01-25 Atomic Energy Authority Uk Materials
US4664739A (en) * 1983-12-19 1987-05-12 Stauffer Chemical Company Removal of semiconductor wafers from dicing film
US4656358A (en) * 1985-03-12 1987-04-07 Optoscan Corporation Laser-based wafer measuring system

Also Published As

Publication number Publication date
EP0226949A3 (en) 1989-01-25
KR870005784A (ko) 1987-07-07
KR900004688B1 (ko) 1990-07-02
SG106392G (en) 1992-12-24
EP0226949B1 (de) 1992-08-05
PH25206A (en) 1991-03-27
DE3686314T2 (de) 1992-12-17
EP0226949A2 (de) 1987-07-01
US4718967A (en) 1988-01-12

Similar Documents

Publication Publication Date Title
DE3585437D1 (de) Verfahren zum verbessern der verbundwirkung zwischen einem lichtempfindlichen kleber und einem dielektrischen substrat.
DE3689735D1 (de) Verfahren und Gerät zur Herstellung von Halbleitervorrichtungen.
DE68919167T2 (de) Analysegerät mit einer Vorrichtung zur Detektion einer Flüssigkeitsoberfläche.
EP0239958A3 (en) Thin film semiconductor device and method of manufacturing the same
FI883075A0 (fi) Lämpökovettuva silikoniseos sekä menetelmä alustan pinnoittamiseksi seoksella
TR24840A (tr) Hatalarin teshisine mahsus usul ve aygit
KR880002253A (ko) 기판 표면처리 방법 및 장치
DE3588190T2 (de) Vorrichtung zur transdermalen Applikation von Medikamenten
IT1211436B (it) Metodo per asportare l elemento superiore di nastro dal nastro di chip e relativo dispositivo
DE3778453D1 (de) Verfahren und vorrichtung zur messung der streureflexion einer oberflaeche.
DE68901828D1 (de) Einrichtung zur ermittlung der standhoehe einer trennschicht zwischen zwei stoffen in einem behaelter.
DE3670548D1 (de) Optoelektronisches bauelement fuer oberflaecheneinbau und herstellungsverfahren.
DE3688096D1 (de) Vorrichtung zur pruefung einer duennen schicht von ueberzugsmaterial.
DE3685605T2 (de) Vorrichtung und verfahren zur messung der geschwindigkeit von ultraschallwellen.
DE3686314T2 (de) Vorrichtung zur bestimmung der haftkraefte eines klebstoffes zwischen einem halbleiter und seinem substrat.
IT8621204A0 (it) Substrato e procedimento d'uso. dispositivo di rivestimento di
DE3581902D1 (de) Geraet zur regulierbaren aufstellung von ultraschallpruefvorrichtungen.
DE3766136D1 (de) Verfahren und vorrichtung zur ermittlung der relativen dynamischen oberflaechenaktivitaet.
NO854418L (no) Fremgangsmaate for ikke-destruktiv proevning av klebebindignen mellom et belegg og et underlag.
DE69304396T2 (de) Vorrichtung zur Dickenmessung von Dünnschichten von Halbleitern
DE3675374D1 (de) Vorrichtung zur auslese von koernern der groesse zwischen 20 und 300 mikron.
NO840955L (no) Fremgangsmaate og innretning for jevn fordeling av et pulverformig faststoff paa et substrat samt det oppnaadde substrat
IT8148997A0 (it) Procedimento per la cernita di componenti a semiconduttori e dispositivo per la sua realizzazione
IT1178711B (it) Dispositivo per lo spantimento di materiali su una superfie e relativo metodo di impiego
DE3850850D1 (de) Koplanares verbindungsverfahren zwischen einem halbleiterwürfel und einem siliciumsubstrat.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition