DE3585437D1 - Verfahren zum verbessern der verbundwirkung zwischen einem lichtempfindlichen kleber und einem dielektrischen substrat. - Google Patents

Verfahren zum verbessern der verbundwirkung zwischen einem lichtempfindlichen kleber und einem dielektrischen substrat.

Info

Publication number
DE3585437D1
DE3585437D1 DE8585115909T DE3585437T DE3585437D1 DE 3585437 D1 DE3585437 D1 DE 3585437D1 DE 8585115909 T DE8585115909 T DE 8585115909T DE 3585437 T DE3585437 T DE 3585437T DE 3585437 D1 DE3585437 D1 DE 3585437D1
Authority
DE
Germany
Prior art keywords
connectivity
improving
sensitive adhesive
dielectric substrate
light sensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8585115909T
Other languages
English (en)
Inventor
Jeffrey Donald Gelorme
William Howell Lawrence
Slota, Jr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3585437D1 publication Critical patent/DE3585437D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
DE8585115909T 1985-01-02 1985-12-13 Verfahren zum verbessern der verbundwirkung zwischen einem lichtempfindlichen kleber und einem dielektrischen substrat. Expired - Fee Related DE3585437D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/688,388 US4615763A (en) 1985-01-02 1985-01-02 Roughening surface of a substrate

Publications (1)

Publication Number Publication Date
DE3585437D1 true DE3585437D1 (de) 1992-04-02

Family

ID=24764238

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585115909T Expired - Fee Related DE3585437D1 (de) 1985-01-02 1985-12-13 Verfahren zum verbessern der verbundwirkung zwischen einem lichtempfindlichen kleber und einem dielektrischen substrat.

Country Status (5)

Country Link
US (1) US4615763A (de)
EP (1) EP0186831B1 (de)
JP (1) JPS61168291A (de)
CA (1) CA1301698C (de)
DE (1) DE3585437D1 (de)

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US4931125A (en) * 1985-06-18 1990-06-05 The Dow Chemical Company Method for adhesive bonding with pretreatment of components
US4861407A (en) * 1985-06-18 1989-08-29 The Dow Chemical Company Method for adhesive bonding articles via pretreatment with energy beams
US4968383A (en) * 1985-06-18 1990-11-06 The Dow Chemical Company Method for molding over a preform
US4908094A (en) * 1986-04-14 1990-03-13 International Business Machines Corporation Method for laminating organic materials via surface modification
US4715941A (en) * 1986-04-14 1987-12-29 International Business Machines Corporation Surface modification of organic materials to improve adhesion
DE3631011A1 (de) * 1986-09-12 1988-03-24 Bayer Ag Flexible schaltungen
JPS6390542A (ja) * 1986-10-03 1988-04-21 Kuraray Co Ltd 粗面化フイルムの製造法
US4956197A (en) * 1986-10-27 1990-09-11 International Business Machines Corporation Plasma conditioning of a substrate for electroless plating
US4748104A (en) * 1986-11-10 1988-05-31 Macdermid, Incorporated Selective metallization process and additive method for manufactured printed circuit boards
JPH0660416B2 (ja) * 1986-11-18 1994-08-10 三共化成株式会社 プラスチック成形品の製法
JPS63260884A (ja) * 1987-04-16 1988-10-27 日本碍子株式会社 セラミツク基体およびその製造方法
US5122226A (en) * 1987-08-12 1992-06-16 United Technologies Corporation Method of making hybrid composite structures of fiber reinforced glass and resin matrices
US4853081A (en) * 1987-10-30 1989-08-01 Ibm Corporation Process for removing contaminant
US4820376A (en) * 1987-11-05 1989-04-11 American Telephone And Telegraph Company At&T Bell Laboratories Fabrication of CPI layers
DE3826522A1 (de) * 1988-08-04 1990-02-08 Teldix Gmbh Leiterplatte
US5419927A (en) * 1988-09-26 1995-05-30 Chromalloy Gas Turbine Corporation Process for coating fiber reinforced ceramic composites
US4971894A (en) * 1989-02-13 1990-11-20 International Business Machines Corporation Method and structure for preventing wet etchant penetration at the interface between a resist mask and an underlying metal layer
JPH0724328B2 (ja) * 1989-07-03 1995-03-15 ポリプラスチックス株式会社 精密細線回路用成形品の製造方法
JP2993065B2 (ja) * 1990-07-27 1999-12-20 三菱瓦斯化学株式会社 表面平滑金属箔張積層板
JPH04239533A (ja) * 1991-01-22 1992-08-27 Honshu Paper Co Ltd 無機質繊維基材プリプレグシートの製造法および絶縁性積層体の製造法
US5268260A (en) * 1991-10-22 1993-12-07 International Business Machines Corporation Photoresist develop and strip solvent compositions and method for their use
JP2645800B2 (ja) * 1993-12-14 1997-08-25 日本ピラー工業株式会社 膨張黒鉛製シール素材およびその製造方法ならびにガスケット用シート
US5486267A (en) * 1994-02-28 1996-01-23 International Business Machines Corporation Method for applying photoresist
US5765838A (en) * 1995-06-06 1998-06-16 Nippon Pillar Packing Co., Ltd. Sealing gasket made of expanded graphite, with opened thin-leaf surface structure
WO1998011605A1 (fr) 1995-06-19 1998-03-19 Ibiden Co., Ltd. Carte de circuit permettant le montage de pieces electroniques
EP1814153A3 (de) * 1996-09-12 2008-09-24 Ibiden Co., Ltd. Leiterplatte zum Montieren von Elektronikteilen
US5910341A (en) * 1996-10-31 1999-06-08 International Business Machines Corporation Method of controlling the spread of an adhesive on a circuitized organic substrate
US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
JP2000294922A (ja) * 1999-04-01 2000-10-20 Victor Co Of Japan Ltd 多層プリント配線板用の絶縁樹脂組成物
KR100627934B1 (ko) * 1999-06-16 2006-09-22 티디와이 인더스트리스, 인코포레이티드 에타상 형성 방지 기질 처리 방법 및 그 제조 물건
US6387719B1 (en) 2001-02-28 2002-05-14 Lexmark International, Inc. Method for improving adhesion
US6629348B2 (en) 2001-05-01 2003-10-07 Oak-Mitsui, Inc. Substrate adhesion enhancement to film
DE10223234B4 (de) * 2002-05-24 2005-02-03 MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. Verfahren zur Herstellung mikrostrukturierter Oberflächen mit gesteigerter Adhäsion und adhäsionssteigernd modifizierte Oberflächen
US20040258906A1 (en) * 2003-06-20 2004-12-23 Pascal Scaramuzzino Modified polyacetals for plating
CN100419008C (zh) * 2003-06-20 2008-09-17 纳幕尔杜邦公司 用于电镀的改性聚缩醛
US7581906B2 (en) 2004-05-19 2009-09-01 Tdy Industries, Inc. Al2O3 ceramic tools with diffusion bonding enhanced layer
US20070052132A1 (en) * 2005-09-02 2007-03-08 Gutierrez Roman C Method and system for cleaning molded items
JP4903723B2 (ja) * 2006-01-30 2012-03-28 京セラ株式会社 配線基板、および電子装置
WO2007087900A1 (en) * 2006-02-02 2007-08-09 The European Community, Represented By The European Commission Process for controlling surface wettability
US8483076B2 (en) * 2008-08-18 2013-07-09 Qualcomm Incorporated A-periodic PUCCH transmission on PUSCH
JP2013023666A (ja) * 2011-07-25 2013-02-04 Sekisui Chem Co Ltd エポキシ樹脂材料、硬化物及びプラズマ粗化処理硬化物
US9809493B2 (en) 2015-04-27 2017-11-07 Ford Global Technologies, Llc Surface treatment of glass bubbles

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE516819A (de) * 1952-01-10
AT310285B (de) * 1966-02-22 1973-09-25 Photocircuits Corp Verfahren zur Herstellung eines Schichtkörpers für gedruckte Schaltungen
US3567594A (en) * 1969-03-17 1971-03-02 Phillips Petroleum Co Electroplating plastics
GB1268807A (en) * 1969-08-01 1972-03-29 M L Alkan Ltd Improvements in and relating to electroless plating
JPS49348B1 (de) * 1970-12-25 1974-01-07
US3795557A (en) * 1972-05-12 1974-03-05 Lfe Corp Process and material for manufacturing semiconductor devices
JPS5517507B2 (de) * 1972-06-29 1980-05-12
US3978252A (en) * 1973-03-23 1976-08-31 Macdermid Incorporated Method of improving the adhesion between a molded resin substrate and a metal film deposited thereon
JPS5288772A (en) * 1976-01-20 1977-07-25 Matsushita Electric Ind Co Ltd Method of producing printed circuit board
GB1588475A (en) * 1977-05-14 1981-04-23 Hitachi Chemical Co Ltd Method of adhesion between insulating substrates and metal deposits electrolessly plated thereon and method of making additive printed circuit boards
US4113899A (en) * 1977-05-23 1978-09-12 Wear-Cote International, Inc. Method of obtaining electroless nickel coated filled epoxy resin article
US4147564A (en) * 1977-11-18 1979-04-03 Sri International Method of controlled surface texturization of crystalline semiconductor material
US4180432A (en) * 1977-12-19 1979-12-25 International Business Machines Corporation Process for etching SiO2 layers to silicon in a moderate vacuum gas plasma
DE2854385C2 (de) * 1978-12-16 1982-04-15 Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt Gedruckte Schaltung
US4283249A (en) * 1979-05-02 1981-08-11 International Business Machines Corporation Reactive ion etching
JPS6036471B2 (ja) * 1980-04-30 1985-08-20 ポリプラスチツクス株式会社 ポリアセタ−ル樹脂の表面処理法
US4325991A (en) * 1981-01-05 1982-04-20 Crown City Plating Co. Electroless plating of polyesters
US4427478A (en) * 1982-06-28 1984-01-24 International Business Machines Corporation Process for making an encapsulated circuit board and products made thereby
US4469777A (en) * 1983-12-01 1984-09-04 E. I. Du Pont De Nemours And Company Single exposure process for preparing printed circuits
JPS60214594A (ja) * 1984-04-11 1985-10-26 松下電器産業株式会社 印刷配線板の製造方法

Also Published As

Publication number Publication date
EP0186831A2 (de) 1986-07-09
EP0186831B1 (de) 1992-02-26
EP0186831A3 (en) 1987-06-03
JPS61168291A (ja) 1986-07-29
JPH0260237B2 (de) 1990-12-14
CA1301698C (en) 1992-05-26
US4615763A (en) 1986-10-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee