JPH0543079Y2 - - Google Patents
Info
- Publication number
- JPH0543079Y2 JPH0543079Y2 JP16819786U JP16819786U JPH0543079Y2 JP H0543079 Y2 JPH0543079 Y2 JP H0543079Y2 JP 16819786 U JP16819786 U JP 16819786U JP 16819786 U JP16819786 U JP 16819786U JP H0543079 Y2 JPH0543079 Y2 JP H0543079Y2
- Authority
- JP
- Japan
- Prior art keywords
- container
- carry
- workpiece
- adhesive
- arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 claims description 41
- 230000001070 adhesive effect Effects 0.000 claims description 41
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 14
- 239000001301 oxygen Substances 0.000 claims description 14
- 229910052760 oxygen Inorganic materials 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 12
- 229920003002 synthetic resin Polymers 0.000 claims description 7
- 239000000057 synthetic resin Substances 0.000 claims description 7
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 6
- 229910052753 mercury Inorganic materials 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 claims 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 229910001873 dinitrogen Inorganic materials 0.000 description 7
- 239000010408 film Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 3
- 238000003908 quality control method Methods 0.000 description 3
- 238000011109 contamination Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16819786U JPH0543079Y2 (de) | 1986-11-04 | 1986-11-04 | |
| PH34571A PH25206A (en) | 1985-12-12 | 1986-12-09 | Control apparatus for reducing adhesive force of adhesive agent adhering between semiconductor wafer and substrate |
| EP86117185A EP0226949B1 (de) | 1985-12-12 | 1986-12-10 | Vorrichtung zur Bestimmung der Haftkräfte eines Klebstoffes zwischen einem Halbleiter und seinem Substrat |
| DE8686117185T DE3686314T2 (de) | 1985-12-12 | 1986-12-10 | Vorrichtung zur bestimmung der haftkraefte eines klebstoffes zwischen einem halbleiter und seinem substrat. |
| US06/940,328 US4718967A (en) | 1985-12-12 | 1986-12-11 | Control apparatus for reducing adhesive force of adhesive agent adhering between semiconductor wafer and substrate |
| KR1019860010635A KR900004688B1 (ko) | 1985-12-12 | 1986-12-12 | 반도체 웨이퍼와 박판을 접착하는 접착제의 접착력 제어장치 |
| SG1063/92A SG106392G (en) | 1985-12-12 | 1992-10-13 | Control apparatus for adhesive force of adhesive agent adhering between semiconductor wafer and substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16819786U JPH0543079Y2 (de) | 1986-11-04 | 1986-11-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6373337U JPS6373337U (de) | 1988-05-16 |
| JPH0543079Y2 true JPH0543079Y2 (de) | 1993-10-29 |
Family
ID=31100851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16819786U Expired - Lifetime JPH0543079Y2 (de) | 1985-12-12 | 1986-11-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0543079Y2 (de) |
-
1986
- 1986-11-04 JP JP16819786U patent/JPH0543079Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6373337U (de) | 1988-05-16 |
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