DE3684519D1 - Verfahren zur herstellung eines optischen isolators. - Google Patents

Verfahren zur herstellung eines optischen isolators.

Info

Publication number
DE3684519D1
DE3684519D1 DE8686108623T DE3684519T DE3684519D1 DE 3684519 D1 DE3684519 D1 DE 3684519D1 DE 8686108623 T DE8686108623 T DE 8686108623T DE 3684519 T DE3684519 T DE 3684519T DE 3684519 D1 DE3684519 D1 DE 3684519D1
Authority
DE
Germany
Prior art keywords
producing
optical isolator
isolator
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686108623T
Other languages
English (en)
Inventor
Stephen P Merrick
Robert William Teichner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avago Technologies International Sales Pte Ltd
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Application granted granted Critical
Publication of DE3684519D1 publication Critical patent/DE3684519D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
    • H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
    • H01L31/167—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by at least one potential or surface barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
DE8686108623T 1985-06-25 1986-06-25 Verfahren zur herstellung eines optischen isolators. Expired - Lifetime DE3684519D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/748,520 US4694183A (en) 1985-06-25 1985-06-25 Optical isolator fabricated upon a lead frame

Publications (1)

Publication Number Publication Date
DE3684519D1 true DE3684519D1 (de) 1992-04-30

Family

ID=25009800

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686108623T Expired - Lifetime DE3684519D1 (de) 1985-06-25 1986-06-25 Verfahren zur herstellung eines optischen isolators.

Country Status (4)

Country Link
US (1) US4694183A (de)
EP (1) EP0206325B1 (de)
JP (1) JPH084148B2 (de)
DE (1) DE3684519D1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3713067A1 (de) * 1986-09-30 1988-03-31 Siemens Ag Optoelektronisches koppelelement und verfahren zu dessen herstellung
EP0276749A1 (de) * 1987-01-26 1988-08-03 Siemens Aktiengesellschaft Optoelektronisches Koppelelement
US4980568A (en) * 1989-05-22 1990-12-25 Hewlett-Packard Company Optical isolator having high voltage isolation and high light flux light guide
EP0454447A3 (en) * 1990-04-26 1993-12-08 Hitachi Ltd Semiconductor device assembly
JPH0749815Y2 (ja) * 1990-07-23 1995-11-13 シャープ株式会社 表面実装型光結合装置
US5329131A (en) * 1991-05-17 1994-07-12 U.S. Philips Corporation Opto-electronic coupler having improved moisture protective housing
JPH0621293A (ja) * 1992-06-29 1994-01-28 Rohm Co Ltd アキシャルリードフレーム
JP4801243B2 (ja) 2000-08-08 2011-10-26 ルネサスエレクトロニクス株式会社 リードフレームおよびそれを用いて製造した半導体装置並びにその製造方法
JP2004087802A (ja) * 2002-08-27 2004-03-18 Fujitsu Ltd 光通信装置
JP4897530B2 (ja) * 2007-03-23 2012-03-14 ルネサスエレクトロニクス株式会社 フォトカプラおよびその組立方法
JP5088059B2 (ja) * 2007-09-18 2012-12-05 富士電機株式会社 アイソレータおよびアイソレータの製造方法
CN101458366B (zh) * 2007-12-13 2010-12-01 旭丽电子(广州)有限公司 光耦合器导线架料带
TWI416684B (zh) * 2010-02-02 2013-11-21 Everlight Electronics Co Ltd 雙邊導線架結構
US20130168553A1 (en) * 2012-01-03 2013-07-04 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Thermally-Sensitive Optocoupler
US9029818B2 (en) * 2012-06-21 2015-05-12 Avago Technologies General Ip (Singapore) Pte. Ltd. Optoelectronic device and method of manufacture
CN103021892B (zh) * 2012-12-28 2016-05-11 日月光半导体（昆山）有限公司 无外引脚半导体封装构造及其制造方法与导线架条
US10283699B2 (en) * 2016-01-29 2019-05-07 Avago Technologies International Sales Pte. Limited Hall-effect sensor isolator
TWI630430B (zh) * 2017-07-26 2018-07-21 茂達電子股份有限公司 光耦合裝置及其支架模組

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3660669A (en) * 1970-04-15 1972-05-02 Motorola Inc Optical coupler made by juxtaposition of lead frame mounted sensor and light emitter
GB1423779A (en) * 1972-02-14 1976-02-04 Hewlett Packard Co Photon isolators
US3839782A (en) * 1972-03-15 1974-10-08 M Lincoln Method for using a lead frame for the manufacture of electric devices having semiconductor chips placed in a face-to-face relation
GB1417802A (en) * 1972-03-15 1975-12-17 Motorola Inc Lead frame and process facilitating the manufacture of electric devices having semiconductor chips placed in a face-to-face relation
US3893158A (en) * 1972-03-15 1975-07-01 Motorola Inc Lead frame for the manufacture of electric devices having semiconductor chips placed in a face to face relation
DE2304148A1 (de) * 1973-01-29 1974-08-01 Siemens Ag Optoelektronisches bauelement
US4047045A (en) * 1975-03-03 1977-09-06 Paxton Jr Grady W Optical coupler
GB1557685A (en) * 1976-02-02 1979-12-12 Fairchild Camera Instr Co Optically coupled isolator device
JPS57143889A (en) * 1981-03-02 1982-09-06 Toshiba Corp Photo-coupling semiconductor device
JPS57197880A (en) * 1981-05-29 1982-12-04 Toshiba Corp Photo coupling semiconductor device
US4446375A (en) * 1981-10-14 1984-05-01 General Electric Company Optocoupler having folded lead frame construction

Also Published As

Publication number Publication date
US4694183A (en) 1987-09-15
EP0206325B1 (de) 1992-03-25
EP0206325A2 (de) 1986-12-30
JPS6236883A (ja) 1987-02-17
JPH084148B2 (ja) 1996-01-17
EP0206325A3 (en) 1989-03-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: AGILENT TECHNOLOGIES, INC. (N.D.GES.D.STAATES DELA

8327 Change in the person/name/address of the patent owner

Owner name: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.,