DE3683670D1 - Halbleiteranordnung in deren umhuellung eindruecke mit laser hergestellt werden. - Google Patents

Halbleiteranordnung in deren umhuellung eindruecke mit laser hergestellt werden.

Info

Publication number
DE3683670D1
DE3683670D1 DE8686200646T DE3683670T DE3683670D1 DE 3683670 D1 DE3683670 D1 DE 3683670D1 DE 8686200646 T DE8686200646 T DE 8686200646T DE 3683670 T DE3683670 T DE 3683670T DE 3683670 D1 DE3683670 D1 DE 3683670D1
Authority
DE
Germany
Prior art keywords
impressions
sheath
laser
produced
semiconductor arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686200646T
Other languages
English (en)
Inventor
Joseph Bell C O M Titterington
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Application granted granted Critical
Publication of DE3683670D1 publication Critical patent/DE3683670D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Transfer Or Thermal Recording In General (AREA)
  • Semiconductor Lasers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE8686200646T 1985-04-22 1986-04-16 Halbleiteranordnung in deren umhuellung eindruecke mit laser hergestellt werden. Expired - Lifetime DE3683670D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8510200A GB2174063B (en) 1985-04-22 1985-04-22 Semiconductor device having a laser printable envelope

Publications (1)

Publication Number Publication Date
DE3683670D1 true DE3683670D1 (de) 1992-03-12

Family

ID=10577997

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686200646T Expired - Lifetime DE3683670D1 (de) 1985-04-22 1986-04-16 Halbleiteranordnung in deren umhuellung eindruecke mit laser hergestellt werden.

Country Status (5)

Country Link
US (1) US4965642A (de)
EP (1) EP0199415B1 (de)
JP (1) JPS61248448A (de)
DE (1) DE3683670D1 (de)
GB (1) GB2174063B (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE37707E1 (en) * 1990-02-22 2002-05-21 Stmicroelectronics S.R.L. Leadframe with heat dissipator connected to S-shaped fingers
SG83769A1 (en) * 2000-02-01 2001-10-16 Gintic Inst Of Mfg Technology Method of preparing an integrated circuit package for laser marking
US9099391B2 (en) 2013-03-14 2015-08-04 Infineon Technologies Austria Ag Semiconductor package with top-side insulation layer

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5760857A (en) * 1980-09-30 1982-04-13 Nec Corp Semiconductor device
JPS58500463A (ja) * 1981-03-23 1983-03-24 モトロ−ラ・インコ−ポレ−テッド めっきのしてないパッケ−ジを含む半導体デバイス
US4337182A (en) * 1981-03-26 1982-06-29 Phillips Petroleum Company Poly (arylene sulfide) composition suitable for use in semi-conductor encapsulation
US4560580A (en) * 1982-09-30 1985-12-24 Phillips Petroleum Company Process for encapsulating articles with optional laser printing
US4443571A (en) * 1982-09-30 1984-04-17 Phillips Petroleum Company Laser printable polyarylene sulfide compositions
US4654225A (en) * 1982-09-30 1987-03-31 Phillips Petroleum Company Laser printable polyarylene sulfide compositions process for encapsulating articles with optional laser printing
JPS5996749A (ja) * 1982-11-25 1984-06-04 Matsushita Electric Works Ltd 樹脂封止型電子部品の製造方法
JPS59175751A (ja) * 1983-03-26 1984-10-04 Mitsubishi Electric Corp 樹脂封止形半導体装置
DE3324551A1 (de) * 1983-07-07 1985-01-17 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen Verfahren zur kennzeichnung von halbleiteroberflaechen durch laserstrahlung
JPS6018941A (ja) * 1983-07-12 1985-01-31 Seiko Epson Corp 半導体装置

Also Published As

Publication number Publication date
JPS61248448A (ja) 1986-11-05
EP0199415B1 (de) 1992-01-29
GB2174063A (en) 1986-10-29
GB2174063B (en) 1988-08-17
EP0199415A3 (en) 1987-07-22
EP0199415A2 (de) 1986-10-29
GB8510200D0 (en) 1985-05-30
US4965642A (en) 1990-10-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee