DE3677601D1 - Integriertes verdrahtungssystem fuer sehr hochintegrierte schaltungen. - Google Patents

Integriertes verdrahtungssystem fuer sehr hochintegrierte schaltungen.

Info

Publication number
DE3677601D1
DE3677601D1 DE8686111642T DE3677601T DE3677601D1 DE 3677601 D1 DE3677601 D1 DE 3677601D1 DE 8686111642 T DE8686111642 T DE 8686111642T DE 3677601 T DE3677601 T DE 3677601T DE 3677601 D1 DE3677601 D1 DE 3677601D1
Authority
DE
Germany
Prior art keywords
wiring system
integrated
highly
integrated circuits
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686111642T
Other languages
German (de)
English (en)
Inventor
Arnold Dipl Ing Blum
Marian Dipl Ing Briska
Knut Dipl Ing Najmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IBM Deutschland GmbH
Original Assignee
IBM Deutschland GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IBM Deutschland GmbH filed Critical IBM Deutschland GmbH
Application granted granted Critical
Publication of DE3677601D1 publication Critical patent/DE3677601D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/698—Semiconductor materials that are electrically insulating, e.g. undoped silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/28—Configurations of stacked chips the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
DE8686111642T 1986-08-22 1986-08-22 Integriertes verdrahtungssystem fuer sehr hochintegrierte schaltungen. Expired - Lifetime DE3677601D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP86111642A EP0257119B1 (en) 1986-08-22 1986-08-22 Integrated wiring system for vlsi

Publications (1)

Publication Number Publication Date
DE3677601D1 true DE3677601D1 (de) 1991-03-28

Family

ID=8195359

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686111642T Expired - Lifetime DE3677601D1 (de) 1986-08-22 1986-08-22 Integriertes verdrahtungssystem fuer sehr hochintegrierte schaltungen.

Country Status (4)

Country Link
US (1) US4802062A (enExample)
EP (1) EP0257119B1 (enExample)
JP (1) JPS6353960A (enExample)
DE (1) DE3677601D1 (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5007841A (en) * 1983-05-31 1991-04-16 Trw Inc. Integrated-circuit chip interconnection system
US5182420A (en) * 1989-04-25 1993-01-26 Cray Research, Inc. Method of fabricating metallized chip carriers from wafer-shaped substrates
FR2647961B1 (fr) * 1989-05-30 1994-04-08 Thomson Composants Milit Spatiau Circuit electronique a plusieurs puces, en boitier ceramique avec puce d'interconnexion
US5150196A (en) * 1989-07-17 1992-09-22 Hughes Aircraft Company Hermetic sealing of wafer scale integrated wafer
JPH0384804A (ja) * 1989-08-25 1991-04-10 Masaru Minagawa 植物を利用した台座の製造方法
JPH03211757A (ja) * 1989-12-21 1991-09-17 General Electric Co <Ge> 気密封じの物体
US5119273A (en) * 1990-01-29 1992-06-02 The United States Of America As Represented By The Secretary Of The Navy High speed parallel backplane
US5120572A (en) * 1990-10-30 1992-06-09 Microelectronics And Computer Technology Corporation Method of fabricating electrical components in high density substrates
US5254493A (en) * 1990-10-30 1993-10-19 Microelectronics And Computer Technology Corporation Method of fabricating integrated resistors in high density substrates
US5130768A (en) * 1990-12-07 1992-07-14 Digital Equipment Corporation Compact, high-density packaging apparatus for high performance semiconductor devices
US5196377A (en) * 1990-12-20 1993-03-23 Cray Research, Inc. Method of fabricating silicon-based carriers
DE69112389T2 (de) * 1991-06-06 1996-03-21 Ibm Elektronischer Packungsmodul.
EP0547807A3 (en) * 1991-12-16 1993-09-22 General Electric Company Packaged electronic system
US5508938A (en) * 1992-08-13 1996-04-16 Fujitsu Limited Special interconnect layer employing offset trace layout for advanced multi-chip module packages
FR2704690B1 (fr) * 1993-04-27 1995-06-23 Thomson Csf Procédé d'encapsulation de pastilles semi-conductrices, dispositif obtenu par ce procédé et application à l'interconnexion de pastilles en trois dimensions.
US5719748A (en) * 1995-06-28 1998-02-17 Honeywell Inc. Semiconductor package with a bridge for chip area connection
US6713854B1 (en) 2000-10-16 2004-03-30 Legacy Electronics, Inc Electronic circuit module with a carrier having a mounting pad array
US7102892B2 (en) * 2000-03-13 2006-09-05 Legacy Electronics, Inc. Modular integrated circuit chip carrier
US7337522B2 (en) * 2000-10-16 2008-03-04 Legacy Electronics, Inc. Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
CN100369536C (zh) * 2001-03-14 2008-02-13 莱格西电子股份有限公司 制造具有三维半导体芯片阵列安装面的电路板的方法和装置
WO2004112136A1 (en) * 2003-06-12 2004-12-23 Koninklijke Philips Electronics N.V. Electronic device
US7435097B2 (en) * 2005-01-12 2008-10-14 Legacy Electronics, Inc. Radial circuit board, system, and methods
CN107770956A (zh) * 2016-08-16 2018-03-06 光宝电子(广州)有限公司 电路板结构
US10985103B2 (en) 2019-03-01 2021-04-20 Samsung Electronics Co., Ltd Apparatus and method of forming backside buried conductor in integrated circuit
US10886224B2 (en) 2019-05-22 2021-01-05 Samsung Electronics Co., Ltd. Power distribution network using buried power rail
US11233008B2 (en) 2019-06-19 2022-01-25 Samsung Electronics Co., Ltd. Method of manufacturing an integrated circuit with buried power rail

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3777221A (en) * 1972-12-18 1973-12-04 Ibm Multi-layer circuit package
US4074342A (en) * 1974-12-20 1978-02-14 International Business Machines Corporation Electrical package for lsi devices and assembly process therefor
JPS5423484A (en) * 1977-07-25 1979-02-22 Hitachi Ltd Semiconductor integrated circuit and its manufacture
US4288841A (en) * 1979-09-20 1981-09-08 Bell Telephone Laboratories, Incorporated Double cavity semiconductor chip carrier
US4328530A (en) * 1980-06-30 1982-05-04 International Business Machines Corporation Multiple layer, ceramic carrier for high switching speed VLSI chips
US4445112A (en) * 1980-12-12 1984-04-24 Bei Electronics, Inc. Positional encoders with plug-together modules
US4598308A (en) * 1984-04-02 1986-07-01 Burroughs Corporation Easily repairable, low cost, high speed electromechanical assembly of integrated circuit die
FR2569052B1 (fr) * 1984-08-10 1987-05-22 Thomson Csf Procede d'interconnexion de circuits integres
US4598337A (en) * 1984-09-17 1986-07-01 Timex Corporation Electronic circuit board for a timepiece
US4645943A (en) * 1984-10-15 1987-02-24 Dallas Semiconductor Corporation Space-saving back-up power supply
JPS61107658A (ja) * 1984-10-31 1986-05-26 Canon Inc 電子機器
US4705917A (en) * 1985-08-27 1987-11-10 Hughes Aircraft Company Microelectronic package
US4688151A (en) * 1986-03-10 1987-08-18 International Business Machines Corporation Multilayered interposer board for powering high current chip modules

Also Published As

Publication number Publication date
EP0257119A1 (en) 1988-03-02
EP0257119B1 (en) 1991-02-20
JPS6353960A (ja) 1988-03-08
US4802062A (en) 1989-01-31
JPH0240219B2 (enExample) 1990-09-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee