DE3668011D1 - Loesung zum stromlosen goldplattieren. - Google Patents

Loesung zum stromlosen goldplattieren.

Info

Publication number
DE3668011D1
DE3668011D1 DE8686308308T DE3668011T DE3668011D1 DE 3668011 D1 DE3668011 D1 DE 3668011D1 DE 8686308308 T DE8686308308 T DE 8686308308T DE 3668011 T DE3668011 T DE 3668011T DE 3668011 D1 DE3668011 D1 DE 3668011D1
Authority
DE
Germany
Prior art keywords
powerful
plating solution
gold plating
gold
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686308308T
Other languages
German (de)
English (en)
Inventor
Masahiro Saito
Hideyuki Takami
Makoto Sato
Masayuki Kiso
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uemera Kogyo Co Ltd
C Uyemura and Co Ltd
Original Assignee
Uemera Kogyo Co Ltd
C Uyemura and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uemera Kogyo Co Ltd, C Uyemura and Co Ltd filed Critical Uemera Kogyo Co Ltd
Application granted granted Critical
Publication of DE3668011D1 publication Critical patent/DE3668011D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
DE8686308308T 1985-10-25 1986-10-24 Loesung zum stromlosen goldplattieren. Expired - Lifetime DE3668011D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60239150A JPS6299477A (ja) 1985-10-25 1985-10-25 無電解金めつき液

Publications (1)

Publication Number Publication Date
DE3668011D1 true DE3668011D1 (de) 1990-02-08

Family

ID=17040493

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686308308T Expired - Lifetime DE3668011D1 (de) 1985-10-25 1986-10-24 Loesung zum stromlosen goldplattieren.

Country Status (4)

Country Link
US (1) US4792469A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0225041B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS6299477A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3668011D1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4021681A1 (de) * 1989-07-12 1991-03-14 Kojima Chemicals Co Ltd Nichtelektrolytische goldplattierloesung
US4978559A (en) * 1989-11-03 1990-12-18 General Electric Company Autocatalytic electroless gold plating composition
US4985076A (en) * 1989-11-03 1991-01-15 General Electric Company Autocatalytic electroless gold plating composition
US4979988A (en) * 1989-12-01 1990-12-25 General Electric Company Autocatalytic electroless gold plating composition
JP2538461B2 (ja) * 1991-02-22 1996-09-25 奥野製薬工業株式会社 無電解金めっき方法
DE69224914T2 (de) * 1992-11-25 1998-10-22 Kanto Kagaku Stromloses goldbeschichtungsbad
JP3331261B2 (ja) * 1994-08-19 2002-10-07 日本エレクトロプレイテイング・エンジニヤース株式会社 無電解金めっき液
JP3302512B2 (ja) * 1994-08-19 2002-07-15 日本エレクトロプレイテイング・エンジニヤース株式会社 無電解金めっき液
JP3331260B2 (ja) * 1994-08-19 2002-10-07 日本エレクトロプレイテイング・エンジニヤース株式会社 無電解金めっき液
US5750018A (en) * 1997-03-18 1998-05-12 Learonal, Inc. Cyanide-free monovalent copper electroplating solutions
DE19745797C2 (de) * 1997-10-16 2001-11-08 Bosch Gmbh Robert Lösung und Verfahren zum stromlosen Vergolden
JP3466521B2 (ja) * 1999-10-04 2003-11-10 新光電気工業株式会社 置換型無電解金めっき液及び無電解金めっき方法
JP4649666B2 (ja) * 2006-07-11 2011-03-16 独立行政法人産業技術総合研究所 無電解金メッキ液
JP5526459B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JP5526458B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE361056B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1969-10-30 1973-10-15 Western Electric Co
JPS52124428A (en) * 1976-04-13 1977-10-19 Hideji Sasaki Nonnelectrolytic gold plating bath
GB1547028A (en) * 1976-11-19 1979-06-06 Mine Safety Appliances Co Electroless gold plating baths
FR2441666A1 (fr) * 1978-11-16 1980-06-13 Prost Tournier Patrick Procede de depot chimique d'or par reduction autocatalytique
US4337091A (en) * 1981-03-23 1982-06-29 Hooker Chemicals & Plastics Corp. Electroless gold plating
SE8302798L (sv) * 1982-06-07 1983-12-08 Occidental Chem Co Vattenhaltigt bad for stromlos utfellning av guld och sett att pa stromlos veg utfella guld med anvendning av badet
JPS59229478A (ja) * 1983-06-09 1984-12-22 Noritoshi Honma 無電解金めつき液の安定剤

Also Published As

Publication number Publication date
EP0225041B1 (en) 1990-01-03
US4792469A (en) 1988-12-20
JPH0320471B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-03-19
JPS6299477A (ja) 1987-05-08
EP0225041A1 (en) 1987-06-10

Similar Documents

Publication Publication Date Title
DE3672284D1 (de) Stromloses plattierungsverfahren.
FI861724A7 (fi) Flockulationsprocess.
NO863185L (no) Benmorfogeniske midler.
DE3672769D1 (de) Amorphe legierung.
FI860725L (fi) Sprutapparat.
FI870638L (fi) Uppvaermningsapparat foer under tryck staoende oeverfoeringsvaetska.
DE3687250D1 (de) Kupfer-chrom-polyimid-verbundwerkstoffe.
NO162299C (no) Silanordning.
DE3563508D1 (de) Parenteral alimentation solution
FI863140A7 (fi) Kuorimakone.
DE3672530D1 (de) Verbindungskopf.
DE3668011D1 (de) Loesung zum stromlosen goldplattieren.
FI861106A0 (fi) Metallurgisk process ii.
FI861105A0 (fi) Metallurgisk process i.
DE3686115D1 (de) Spanndorn.
FI861107L (fi) Metallurgisk process iii.
FI872065A7 (fi) Kultagalvanointikylpy.
AT380902B (de) Goldplattierungsbad
NO864837L (no) Redningsvest.
DE68902551D1 (de) Stromlose kupferplattierloesung.
IT8620247A0 (it) Apparecchio estrusore-turbomescolatore.
EP0214296A4 (en) Structure for mounting electronic devices.
FI874134A7 (fi) Plattbelaeggning.
DE3770928D1 (de) Elektrode zum elektroraffinieren.
DE3874106D1 (de) Mechanisches plattierungsverfahren.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee