DE3664858D1 - Multiple staple and device for mounting electronic power components collectively - Google Patents

Multiple staple and device for mounting electronic power components collectively

Info

Publication number
DE3664858D1
DE3664858D1 DE8686400414T DE3664858T DE3664858D1 DE 3664858 D1 DE3664858 D1 DE 3664858D1 DE 8686400414 T DE8686400414 T DE 8686400414T DE 3664858 T DE3664858 T DE 3664858T DE 3664858 D1 DE3664858 D1 DE 3664858D1
Authority
DE
Germany
Prior art keywords
electronic power
mounting electronic
power components
components collectively
multiple staple
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8686400414T
Other languages
English (en)
Inventor
Alexandre Lacz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bendix Electronics SA
Original Assignee
Bendix Electronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=9316961&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE3664858(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Bendix Electronics SA filed Critical Bendix Electronics SA
Application granted granted Critical
Publication of DE3664858D1 publication Critical patent/DE3664858D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Clamps And Clips (AREA)
DE8686400414T 1985-03-07 1986-02-26 Multiple staple and device for mounting electronic power components collectively Expired DE3664858D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8503351A FR2578710B1 (fr) 1985-03-07 1985-03-07 Agrafe multiple de fixation et dispositif de montage collectif de composants electroniques de puissance

Publications (1)

Publication Number Publication Date
DE3664858D1 true DE3664858D1 (en) 1989-09-07

Family

ID=9316961

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686400414T Expired DE3664858D1 (en) 1985-03-07 1986-02-26 Multiple staple and device for mounting electronic power components collectively

Country Status (6)

Country Link
US (1) US4674005A (de)
EP (1) EP0195701B1 (de)
JP (1) JPS61212100A (de)
KR (1) KR860007854A (de)
DE (1) DE3664858D1 (de)
FR (1) FR2578710B1 (de)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63137950U (de) * 1987-02-28 1988-09-12
US4845590A (en) * 1987-11-02 1989-07-04 Chrysler Motors Corporation Heat sink for electrical components
US4891735A (en) * 1987-11-02 1990-01-02 Chrysler Motors Corporation Heat sink for electrical components
US4923179A (en) * 1987-11-02 1990-05-08 Chrysler Corporation Spring panel heat sink for electrical components
US4922601A (en) * 1987-11-02 1990-05-08 Chrysler Corporation Method of making a heat sink for electrical components
SE460008B (sv) * 1987-11-04 1989-08-28 Saab Scania Ab Kylkropp foer ett elektriskt kretskort samt anvaendning daerav
US4888637A (en) * 1988-01-15 1989-12-19 Chrysler Motors Corporation Multiple semiconductor heat sink/mounting assembly
JPH0275791U (de) * 1988-11-28 1990-06-11
US4872089A (en) * 1988-12-19 1989-10-03 Motorola Inc. Heat sink assembly for densely packed transistors
DE3906973A1 (de) * 1989-03-04 1990-09-13 Telefunken Electronic Gmbh Gehaeuse fuer kfz-elektronik
US4972294A (en) * 1989-04-03 1990-11-20 Motorola, Inc. Heat sink clip assembly
WO1991006201A1 (en) * 1989-10-16 1991-05-02 Fmtt, Inc. Integrated structure for a matrix transformer
FR2663809B1 (fr) * 1990-06-21 1996-07-19 Siemens Automotive Sa Organe multiple de retenue a ressort et son procede de fabrication.
GB2253654B (en) * 1991-03-14 1994-06-01 Reford Thomas Kearns Brush attachment
FR2679729B1 (fr) * 1991-07-23 1994-04-29 Alcatel Telspace Dissipateur thermique.
FR2686765B1 (fr) * 1992-01-28 1994-03-18 Alcatel Converters Dispositif de fixation, notamment pour la fixation d'un composant electronique sur une paroi d'un dissipateur thermique .
US5274193A (en) * 1992-04-24 1993-12-28 Chrysler Corporation Heat sink spring and wedge assembly
DE4223522A1 (de) * 1992-07-17 1994-01-20 Bosch Gmbh Robert Baugruppe für elektronische Steuergeräte
US5327324A (en) * 1993-11-05 1994-07-05 Ford Motor Company Spring clip for a heat sink apparatus
US5477188A (en) * 1994-07-14 1995-12-19 Eni Linear RF power amplifier
US5731955A (en) * 1996-02-05 1998-03-24 Ford Motor Company Spring clip for electronics assembly
SE9600649L (sv) 1996-02-21 1997-07-07 Ericsson Telefon Ab L M Värmeledande anordning
US6043981A (en) * 1997-11-13 2000-03-28 Chrysler Corporation Heat sink assembly for electrical components
US6104612A (en) * 1998-03-09 2000-08-15 Schneider Automation Inc. Clip-on heat sink
US6130821A (en) * 1998-12-03 2000-10-10 Motorola, Inc. Multi-chip assembly having a heat sink and method thereof
US6445588B1 (en) 2001-01-02 2002-09-03 Motorola, Inc. Apparatus and method for securing a printed circuit board to a base plate
US7190589B2 (en) * 2004-10-19 2007-03-13 Cinch Connectors, Inc. Electronic control enclosure
JP2006148105A (ja) * 2004-11-15 2006-06-08 Samsung Electronics Co Ltd 半導体モジュール及びその製造方法
TW200846881A (en) * 2007-05-18 2008-12-01 Acbel Polytech Inc Mounting device for chips and heat dissipating fins
CN101847040A (zh) * 2009-03-24 2010-09-29 富准精密工业(深圳)有限公司 散热器组合
TWI389272B (zh) * 2009-04-22 2013-03-11 Delta Electronics Inc 電子元件之散熱模組及其組裝方法
CN102065667B (zh) * 2009-11-12 2015-03-25 赛恩倍吉科技顾问（深圳）有限公司 电子装置及其散热装置
JP5647452B2 (ja) * 2010-07-20 2014-12-24 三菱電機株式会社 正特性サーミスタ装置
JP5609596B2 (ja) 2010-12-01 2014-10-22 アイシン・エィ・ダブリュ株式会社 熱源素子と熱伝導性部材との固定構造、及び熱源素子と熱伝導性部材との固定方法
US9312201B2 (en) 2010-12-30 2016-04-12 Schneider Electric It Corporation Heat dissipation device
JP5609678B2 (ja) * 2011-01-26 2014-10-22 アイシン・エィ・ダブリュ株式会社 アセンブリ構造、及びアセンブリ方法
US8893770B2 (en) 2011-07-29 2014-11-25 Schneider Electric It Corporation Heat sink assembly for electronic components
JP2014036124A (ja) * 2012-08-09 2014-02-24 Nidec Servo Corp 電子機器、放熱機構、クリップ及び治具
JP2013214770A (ja) * 2013-07-10 2013-10-17 Mitsubishi Electric Corp 発熱部品固定金具および発熱部品固定構造
CN104682457B (zh) 2013-11-26 2017-08-29 台达电子企业管理（上海）有限公司 电子装置及汽车的充电装置
JP6383201B2 (ja) * 2014-07-22 2018-08-29 株式会社ナベル 保護板部材付蛇腹
JP6722540B2 (ja) * 2016-07-28 2020-07-15 株式会社Ｊｖｃケンウッド 放熱構造および電子機器
WO2018221296A1 (ja) * 2017-05-30 2018-12-06 三菱電機株式会社 電力変換装置
CN111098725B (zh) * 2019-09-27 2021-03-23 法雷奥西门子新能源汽车(深圳)有限公司 一种电子设备与其用于固定元件的固定模块

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3654521A (en) * 1971-01-13 1972-04-04 Gen Electric Electronic card module thermal clip
US4204248A (en) * 1978-11-20 1980-05-20 General Electric Company Heat transfer mounting arrangement for a solid state device connected to a circuit board
US4288839A (en) * 1979-10-18 1981-09-08 Gould Inc. Solid state device mounting and heat dissipating assembly
US4388967A (en) * 1980-09-02 1983-06-21 Thermalloy Incorporated Solderable mounting stakes for heat sinks
US4563725A (en) * 1983-01-06 1986-01-07 Welwyn Electronics Limited Electrical assembly
US4609040A (en) * 1985-04-01 1986-09-02 Thermalloy Incorporated Self-securing heat sink

Also Published As

Publication number Publication date
US4674005A (en) 1987-06-16
KR860007854A (ko) 1986-10-17
EP0195701A1 (de) 1986-09-24
FR2578710A1 (fr) 1986-09-12
FR2578710B1 (fr) 1988-03-04
EP0195701B1 (de) 1989-08-02
JPS61212100A (ja) 1986-09-20

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Legal Events

Date Code Title Description
8363 Opposition against the patent
8339 Ceased/non-payment of the annual fee