US4674005A - Multiple fastening clip and device for the collective mounting of electronic power components - Google Patents

Multiple fastening clip and device for the collective mounting of electronic power components Download PDF

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Publication number
US4674005A
US4674005A US06/836,280 US83628086A US4674005A US 4674005 A US4674005 A US 4674005A US 83628086 A US83628086 A US 83628086A US 4674005 A US4674005 A US 4674005A
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Prior art keywords
clip
heat sink
branch
fastening
printed circuit
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Expired - Fee Related
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US06/836,280
Inventor
Alexandre Lacz
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Bendix Electronics SA
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Bendix Electronics SA
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure

Definitions

  • the present invention relates to a multiple fastening clip intended to be resiliently placed in position by force particularly for the purpose of effecting the collective mounting of electronic power components on a single heat sink. It also relates to a particular device for the collective mounting of such components with the aid of this clip.
  • the technical problem in the mounting of electronic power components, connected to a printed circuit, on a heat sink for the dissipation of heat during the operation of the circuit is at the present time solved by two scarcely satisfactory methods.
  • the first method consists in screwing each electronic power component through a heat sink after placing an insulating grommet around the hole formed in the component, in order to insulate the fastening screw.
  • this method of mounting must be applied unit by unit and is therefore expensive, it has two main disadvantages:
  • the first is the curvature of the sole of the component, the sole generally being of copper, and the consequent irregularity of the force transmitted through the fastening screw.
  • the second is the creep of the insulating grommet disposed in the hole in the heat sink in the course of utilization at high temperatures, entailing a reduction of the screw connection force and consequently poor fastening of the component on the heat sink.
  • the second method consists in fastening each power component on the heat sink with the aid of a transverse clip, which makes it necessary to provide a cutout on each side of the component for support purposes.
  • this method must also be applied unit by unit and is therefore expensive.
  • a multiple fastening clip intended to be resiliently placed in position by pressure, characterized in that it is made from a strip of thermally conductive material, cut out to form two series of crenels along the two long sides of the strip and folded on either side of the longitudinal axis of the strip in such a manner that between two consecutive crenels there is defined an element of the clip connected to the following element by a bridge, each element comprising a base from which extend two branches: a first branch in a plane perpendicular to the base, with its end curved towards the outside of the clip to form a hook, and a second branch in a plane inclined towards the curved end of the first branch, with its end likewise folded over outwardly to form a hook, the first branch of at least two elements provided with a barb directed towards the interior of the clip.
  • the invention further provides a device for the collective mounting of electronic power components on a heat sink with the aid of the clip according to the preceding paragraph, the electronic components being connectd to a printed circuit, while the heat sink and also this printed circuit are intended to be mounted in a casing, said device comprising:
  • a heat sink in the form of a square angle section, provided with one face perforated by a row of apertures parallel to the edge of the angle section, and provided with means for fastening to the casing;
  • FIG. 1 is an elevation view of a clip according to the invention is made.
  • FIGS. 2a and 2b are as perspective view and a cross-sectional view of the same clip according to the invention.
  • FIG. 3 is an exploded view in perspective of a collective mounting device according to the invention.
  • the multiple fastening clip 21 is made from a rectangular strip of thermally concuctive material, which is cut out, folded and then threated.
  • This material is generally metal, of example, cupro-beryllium alloy or hardened steel.
  • the strip has been cut out to form two series of crenellations 2 along the two long sides 3 and 4 of the strip.
  • This strip has then been folded on either side of its longitudinal axis ⁇ in such manner that between consecutive crenels 2 there is defined an element 5 of the clip.
  • Two consecutive elements 5 are connected by a bridge 6 the width of which makes it possible for each element 5 to have autonomous elasticity and for the clip as a whole to have adequate mechanical strength.
  • FIGS. 2a and 2b are respectively a view in perpestive and a cross-sectional view of the clip 21.
  • the previously described strip has been folded on either side of the axis ⁇ in such a manner that each element 5 comprises a base 7 from which extend two branches 8 and 9--the first branch 8 in a plane perpendicular to the base, with its end 10 curved towards the outside of the clip to form a hook.
  • the second branch 9 is inclined towards said curved end 10 of the first branch 8 and in turn has a hook-shaped end 11 curved towards the outside of the clip.
  • the first branch 8 of each lement has a projection 12 directed towards the interior of the clip.
  • only two elements 5 of the clip are provided with a projection.
  • FIG. 3 is an exploded view of the device for mounting electronic components with the aid of a multiple clip of the kind just described. It is required to fix electronic power components 13, intended to be connected to a printed circuit 14, to a heat sink 15 whose function is to dissipate the heat produced by the components during their operation. These power components 13 will for this purpose be placed on an edge 16 of the printed circuit in order to ensure good dissipation of heat out of the circuit.
  • the device for the collective mounting of power components comprises firstly a heat sink 15 in the form of a square angle section, of which one face 17 is perforated with a row of equidistant holes 18 parallel to the edge 19 of the angle section.
  • a heat sink 15 in the form of a square angle section, of which one face 17 is perforated with a row of equidistant holes 18 parallel to the edge 19 of the angle section.
  • it comprises a sheet 20 of dielectric material of uniform thickness, and finally a clip 21.
  • the power components 13 intended to be connected to the printed circuit 16, for example by means of metallized holes 25, are placed against the face 17 of the heat sink 15, but separated from it by the dielectric plate 20, whose function is elecrical insulation between the foot of the components 13 and the heat sink 15, which is generally of metal, without hindering the dissipation of heat.
  • the clip 21 is resiliently placed in position by force, by pressure, to embrace the perforated face 17 of the heat sink and the components 13.
  • the right-angled portion of the clip, comprising the base 7 and the branch 8 of each element 5, permits the positioning of the clip, in respect of heighth. on the heat sink, and its inclined portion comprising the base 7 and the branch 9 enables the components 13 to be placed against the heat sink 15.
  • the clip is secured in position by the clipping of the projections 12 in the holes 18 in the heat sink, these projections being directed towards the base of the clip in such a manner that they resist its removal.
  • the curved ends 10 and 11 of the clip are used for moving the branches 8 and 9 apart with the aid of needle-nose pliers for the purpose of placing the clip in position or removing it.
  • the insulating sheet 20 which is retangular in shape and has no openings, can be obtained by cutting from a sheet of mica. It has the same length as the heat sink 15 in order to facilitate visual centering in the horizontal direction.
  • the heat sink 15 in the form of an angle section can be made from a sheet of copper or aluminium, for example, cut out and folded. It is provided with two lugs 22 at right angles to the perforated face 17, which are perforated with a hole and are intended for cooperation with two screws or rivets 23 for fastening to the printed circuit 14. These two lugs 22 serve in addition as vertical positioning stops for the dielectric sheet 20. For the purpose of holding said dielectric sheet 20 on the heat sink 15 during assembly, it is at least partly coated on one face with a silicone based conductive grease.
  • a printed circuit is generally placed in a protective casing, which may in addition act as a heat radiator.
  • a protective casing which may in addition act as a heat radiator.
  • means for fastening the heat sink 15 to a casing 26 are also provided. These fastening means are for example screws 27 intended to cooperate with holes 28 and 29 formed respectively in the heat sink 15 and the casing 26.
  • the invention thus permits the collective mounting of electronic power components on the same heat sink, the cost of this arrangement being lower than that of unitary mounting systems of the prior art and its reliability being greater.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Clamps And Clips (AREA)

Abstract

The invention relates to a multiple fastening clip (21) and its application to a device for the collective mounting of electronic power components (3) on a heat sink (15). This mounting device comprises a heat sink (15) in the form of an angle section perforated with apertures (18), a dielectric plate (20) interposed between said heat sink (15) and said components (13), and a thermally conductive multiple clip (21) provided with projections intended for cooperating with said apertures (18) in order to secure the clip.

Description

The present invention relates to a multiple fastening clip intended to be resiliently placed in position by force particularly for the purpose of effecting the collective mounting of electronic power components on a single heat sink. It also relates to a particular device for the collective mounting of such components with the aid of this clip.
The technical problem in the mounting of electronic power components, connected to a printed circuit, on a heat sink for the dissipation of heat during the operation of the circuit is at the present time solved by two scarcely satisfactory methods. The first method consists in screwing each electronic power component through a heat sink after placing an insulating grommet around the hole formed in the component, in order to insulate the fastening screw. In addition to the fact that this method of mounting must be applied unit by unit and is therefore expensive, it has two main disadvantages: The first is the curvature of the sole of the component, the sole generally being of copper, and the consequent irregularity of the force transmitted through the fastening screw. The second is the creep of the insulating grommet disposed in the hole in the heat sink in the course of utilization at high temperatures, entailing a reduction of the screw connection force and consequently poor fastening of the component on the heat sink.
The second method consists in fastening each power component on the heat sink with the aid of a transverse clip, which makes it necessary to provide a cutout on each side of the component for support purposes. In addition to the space required for a fastening device of this kind, this method must also be applied unit by unit and is therefore expensive.
It is therefore an object of the invention to provide inexpensive and completely reliable means for the collective mounting of a plurality of electronic power components on a heat sink.
According to the present invention there is provided a multiple fastening clip intended to be resiliently placed in position by pressure, characterized in that it is made from a strip of thermally conductive material, cut out to form two series of crenels along the two long sides of the strip and folded on either side of the longitudinal axis of the strip in such a manner that between two consecutive crenels there is defined an element of the clip connected to the following element by a bridge, each element comprising a base from which extend two branches: a first branch in a plane perpendicular to the base, with its end curved towards the outside of the clip to form a hook, and a second branch in a plane inclined towards the curved end of the first branch, with its end likewise folded over outwardly to form a hook, the first branch of at least two elements provided with a barb directed towards the interior of the clip.
The invention further provides a device for the collective mounting of electronic power components on a heat sink with the aid of the clip according to the preceding paragraph, the electronic components being connectd to a printed circuit, while the heat sink and also this printed circuit are intended to be mounted in a casing, said device comprising:
a heat sink in the form of a square angle section, provided with one face perforated by a row of apertures parallel to the edge of the angle section, and provided with means for fastening to the casing;
a sheet of dielectric material of uniform thickness, placed against the perforated face of the heat sink;
a clip resiliently placed in position perforated face of the heat sink and of the electronic components separated form this conductor by the dielectric plate, the projections on the clip being clipped into the apertures in the heat sink.
The invention offers the following advantages:
it is possible for different types of electronic components, of different widths and thickness, to be mounted on the same heat sink with the aid of the same clip, whether these components are aligned close side by side or spaced apart. Moreover, since the insulation is in the form of a sheet, it is simply placed in position by contact between the components and the heat sink, without requiring very accurate operation.
The invention will now be described by way of example with reference to the accompanying drawings in which:
FIG. 1 is an elevation view of a clip according to the invention is made.
FIGS. 2a and 2b are as perspective view and a cross-sectional view of the same clip according to the invention, and
FIG. 3 is an exploded view in perspective of a collective mounting device according to the invention.
Elements given the same references in the different Figures serve the same functions of the purpose of achieving the same results.
The multiple fastening clip 21 according to the invention is made from a rectangular strip of thermally concuctive material, which is cut out, folded and then threated. This material is generally metal, of example, cupro-beryllium alloy or hardened steel. As shown in FIG. 1, the strip has been cut out to form two series of crenellations 2 along the two long sides 3 and 4 of the strip. This strip has then been folded on either side of its longitudinal axis Δ in such manner that between consecutive crenels 2 there is defined an element 5 of the clip. Two consecutive elements 5 are connected by a bridge 6 the width of which makes it possible for each element 5 to have autonomous elasticity and for the clip as a whole to have adequate mechanical strength.
FIGS. 2a and 2b are respectively a view in perpestive and a cross-sectional view of the clip 21. The previously described strip has been folded on either side of the axis Δ in such a manner that each element 5 comprises a base 7 from which extend two branches 8 and 9--the first branch 8 in a plane perpendicular to the base, with its end 10 curved towards the outside of the clip to form a hook. The second branch 9 is inclined towards said curved end 10 of the first branch 8 and in turn has a hook-shaped end 11 curved towards the outside of the clip. In addition, the first branch 8 of each lement has a projection 12 directed towards the interior of the clip. In an other embodiment of the invention (not shown) only two elements 5 of the clip are provided with a projection.
FIG. 3 is an exploded view of the device for mounting electronic components with the aid of a multiple clip of the kind just described. It is required to fix electronic power components 13, intended to be connected to a printed circuit 14, to a heat sink 15 whose function is to dissipate the heat produced by the components during their operation. These power components 13 will for this purpose be placed on an edge 16 of the printed circuit in order to ensure good dissipation of heat out of the circuit.
The device for the collective mounting of power components according to the invention comprises firstly a heat sink 15 in the form of a square angle section, of which one face 17 is perforated with a row of equidistant holes 18 parallel to the edge 19 of the angle section. In addition, it comprises a sheet 20 of dielectric material of uniform thickness, and finally a clip 21.
The power components 13 intended to be connected to the printed circuit 16, for example by means of metallized holes 25, are placed against the face 17 of the heat sink 15, but separated from it by the dielectric plate 20, whose function is elecrical insulation between the foot of the components 13 and the heat sink 15, which is generally of metal, without hindering the dissipation of heat. The clip 21 is resiliently placed in position by force, by pressure, to embrace the perforated face 17 of the heat sink and the components 13. The right-angled portion of the clip, comprising the base 7 and the branch 8 of each element 5, permits the positioning of the clip, in respect of heighth. on the heat sink, and its inclined portion comprising the base 7 and the branch 9 enables the components 13 to be placed against the heat sink 15.
The clip is secured in position by the clipping of the projections 12 in the holes 18 in the heat sink, these projections being directed towards the base of the clip in such a manner that they resist its removal. The curved ends 10 and 11 of the clip are used for moving the branches 8 and 9 apart with the aid of needle-nose pliers for the purpose of placing the clip in position or removing it.
The insulating sheet 20, which is retangular in shape and has no openings, can be obtained by cutting from a sheet of mica. It has the same length as the heat sink 15 in order to facilitate visual centering in the horizontal direction.
The heat sink 15 in the form of an angle section can be made from a sheet of copper or aluminium, for example, cut out and folded. It is provided with two lugs 22 at right angles to the perforated face 17, which are perforated with a hole and are intended for cooperation with two screws or rivets 23 for fastening to the printed circuit 14. These two lugs 22 serve in addition as vertical positioning stops for the dielectric sheet 20. For the purpose of holding said dielectric sheet 20 on the heat sink 15 during assembly, it is at least partly coated on one face with a silicone based conductive grease.
Thus, once the power components 13 are held by pressure by means of the clip 21 against the heat sink 15, this assembly is placed above the printed circuit 14 in such a manner that the connections 24 of each component 13 are received in the metallized holes 25 of the circuit 14. The heat sink 15 is then fixed to the printed circuit by rivets 23, and the assembly can be passed over a solder bath in accordance with a conventional wave soldering process.
A printed circuit is generally placed in a protective casing, which may in addition act as a heat radiator. In this case, means for fastening the heat sink 15 to a casing 26 are also provided. These fastening means are for example screws 27 intended to cooperate with holes 28 and 29 formed respectively in the heat sink 15 and the casing 26.
The invention thus permits the collective mounting of electronic power components on the same heat sink, the cost of this arrangement being lower than that of unitary mounting systems of the prior art and its reliability being greater.

Claims (9)

I claim:
1. A system for the simultaneous and collective mounting on a heat sink of electronic power components connected to a printed circuit, said system comprising:
a heat sink having a square angle section, provided with one face perforated by a row of apertures parallel to an edge of said angle section, and means for fastening said heat sink to the printed circuit;
a sheet of dielectric material of uniform thickness, placed against said perforated face of said heat sink; and
a multiple fastening substantially U-shaped resilient clip resiliently placed in position to embrace said perforated face of said heat sink, said dielectric sheet and the electronic power components, said clip having a plurality of projections along one side of said clip for snappingly engaging in said apertures in said heat sink for securing said clip to said heat sink.
2. The system according to claim 1 wherein said multiple fastening clip is fabricated from a strip of thermally conductive resilent material having two series of crenels along the two long sides of said strip and folded on either side of the longitudinal axis of said strip in such a manner that said crenels are defined an element connected to the following element by a bridge, each of said elements comprising a base from which extend a first branch extending in a plane perpendicular to said base, and having a free end curved towards the outside of said clip, and a second branch extending in a plane inclined towards said curved free end of said first branch, and having a free end curved towards the outside of said clip, said first branch of at least two elements having said projection directed towards the interior of the clip.
3. The system according to claim 1, characterized in that said means for fastening said heat sink to the printed circuit comprises two lugs disposed at the ends of said heat sink and each perforated for receiving with fastening means passing through the printed circuit.
4. The system according to claim 1, additionally including a protective casing, and means for mounting said heat sink thereto for serving as thermal radiator.
5. The system according to claim 1 chracterized in that said clip is fabricated of cuproberyllium alloy.
6. The system according to claim 1, characterized in that said dielectric sheet is of mica.
7. The system according to claim 1, characterized in that said free end of each of said first branch and second branch form an adjustment means in the form of a hook.
8. The system according to claim 1, characterized in that said clip is fabricated of hardened steel.
9. The system according to claim 1, characterized in that the length of said first branch corresponds to height and said heat sinks for positioning said clip on said heat sink and inserting said projections in said apertures.
US06/836,280 1985-03-07 1986-03-05 Multiple fastening clip and device for the collective mounting of electronic power components Expired - Fee Related US4674005A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8503351 1985-03-07
FR8503351A FR2578710B1 (en) 1985-03-07 1985-03-07 MULTIPLE FASTENING CLIP AND DEVICE FOR COLLECTIVE MOUNTING OF ELECTRONIC POWER COMPONENTS

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US4674005A true US4674005A (en) 1987-06-16

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EP (1) EP0195701B1 (en)
JP (1) JPS61212100A (en)
KR (1) KR860007854A (en)
DE (1) DE3664858D1 (en)
FR (1) FR2578710B1 (en)

Cited By (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4845590A (en) * 1987-11-02 1989-07-04 Chrysler Motors Corporation Heat sink for electrical components
US4872089A (en) * 1988-12-19 1989-10-03 Motorola Inc. Heat sink assembly for densely packed transistors
US4888637A (en) * 1988-01-15 1989-12-19 Chrysler Motors Corporation Multiple semiconductor heat sink/mounting assembly
US4891735A (en) * 1987-11-02 1990-01-02 Chrysler Motors Corporation Heat sink for electrical components
US4922601A (en) * 1987-11-02 1990-05-08 Chrysler Corporation Method of making a heat sink for electrical components
US4923179A (en) * 1987-11-02 1990-05-08 Chrysler Corporation Spring panel heat sink for electrical components
DE3906973A1 (en) * 1989-03-04 1990-09-13 Telefunken Electronic Gmbh Housing for motor-vehicle electronics
US4972294A (en) * 1989-04-03 1990-11-20 Motorola, Inc. Heat sink clip assembly
WO1991006201A1 (en) * 1989-10-16 1991-05-02 Fmtt, Inc. Integrated structure for a matrix transformer
US5051866A (en) * 1988-11-28 1991-09-24 Mita Industrial Co., Ltd. Power circuit device for an image-forming apparatus
US5077638A (en) * 1987-11-04 1991-12-31 Saab Automobile Aktienbolag Heat sink for an electric circuit board
US5274193A (en) * 1992-04-24 1993-12-28 Chrysler Corporation Heat sink spring and wedge assembly
US5307236A (en) * 1991-07-23 1994-04-26 Alcatel Telspace Heatsink for contact with multiple electronic components mounted on a circuit board
US5327324A (en) * 1993-11-05 1994-07-05 Ford Motor Company Spring clip for a heat sink apparatus
US5344113A (en) * 1990-06-21 1994-09-06 Siemens Aktiengesellschaft Multiple spring-retention device and method for manufacturing it
US5373099A (en) * 1992-01-28 1994-12-13 Alcatel Converters Fixing device for fixing electronic component against a wall of a heatsink
US5477188A (en) * 1994-07-14 1995-12-19 Eni Linear RF power amplifier
EP0788155A1 (en) * 1996-02-05 1997-08-06 Ford Motor Company Spring clip for electronics assembly
WO1997031513A1 (en) * 1996-02-21 1997-08-28 Telefonaktiebolaget Lm Ericsson (Publ) Heat conductive device
US6043981A (en) * 1997-11-13 2000-03-28 Chrysler Corporation Heat sink assembly for electrical components
US6104612A (en) * 1998-03-09 2000-08-15 Schneider Automation Inc. Clip-on heat sink
US6130821A (en) * 1998-12-03 2000-10-10 Motorola, Inc. Multi-chip assembly having a heat sink and method thereof
US6445588B1 (en) 2001-01-02 2002-09-03 Motorola, Inc. Apparatus and method for securing a printed circuit board to a base plate
US20070153484A1 (en) * 2004-10-19 2007-07-05 Cinch Connectors, Inc. Electronic control enclosure
US20090244847A1 (en) * 2007-05-18 2009-10-01 Acbel Polytech Inc. Mounting device for chips
US20100243203A1 (en) * 2009-03-24 2010-09-30 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Cooling device for add-on card
US20100271785A1 (en) * 2009-04-22 2010-10-28 Hung-Chang Hsieh Heat-dissipating and fixing mechanism of electronic component and process for assembling same
US20110110044A1 (en) * 2009-11-12 2011-05-12 Hon Hai Precision Industry Co., Ltd. Heat dissipation apparatus for electronic device
US8797743B2 (en) 2010-12-01 2014-08-05 Aisin Aw Co., Ltd. Fixing structure for heat source element and heat conducting member, and method of fixing heat source element and heat conducting member
US8893770B2 (en) 2011-07-29 2014-11-25 Schneider Electric It Corporation Heat sink assembly for electronic components
CN105451936A (en) * 2014-07-22 2016-03-30 株式会社纳倍路 Bellows with protective plate member
US9312201B2 (en) 2010-12-30 2016-04-12 Schneider Electric It Corporation Heat dissipation device
US20180035530A1 (en) * 2016-07-28 2018-02-01 JVC Kenwood Corporation Heat dissipating structure and electronic device
CN111098725A (en) * 2019-09-27 2020-05-05 法雷奥西门子新能源汽车(深圳)有限公司 Electronic equipment and fixing module for fixing element
US20220279643A1 (en) * 2019-11-18 2022-09-01 Huawei Digital Power Technologies Co., Ltd. Electronic component with enclosure frame, circuit board with electronic component, and electronic device
US12127328B2 (en) * 2022-05-18 2024-10-22 Huawei Digital Power Technologies Co., Ltd. Electronic component with enclosure frame, circuit board with electronic component, and electronic device

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63137950U (en) * 1987-02-28 1988-09-12
GB2253654B (en) * 1991-03-14 1994-06-01 Reford Thomas Kearns Brush attachment
DE4223522A1 (en) * 1992-07-17 1994-01-20 Bosch Gmbh Robert Electronic control device circuit module - has power components attached in two rows in two respective arms of U=shaped cooling element
JP2006148105A (en) * 2004-11-15 2006-06-08 Samsung Electronics Co Ltd Semiconductor module and its manufacturing method
JP5647452B2 (en) * 2010-07-20 2014-12-24 三菱電機株式会社 Positive temperature coefficient thermistor device
JP5609678B2 (en) * 2011-01-26 2014-10-22 アイシン・エィ・ダブリュ株式会社 Assembly structure and assembly method
JP2014036124A (en) * 2012-08-09 2014-02-24 Nidec Servo Corp Electronic apparatus, heat dissipation mechanism, clip and jig
JP2013214770A (en) * 2013-07-10 2013-10-17 Mitsubishi Electric Corp Metal fitting and method for fixing heating component
CN104682457B (en) 2013-11-26 2017-08-29 台达电子企业管理（上海）有限公司 The charging device of electronic installation and automobile
WO2018221296A1 (en) * 2017-05-30 2018-12-06 三菱電機株式会社 Power conversion device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3654521A (en) * 1971-01-13 1972-04-04 Gen Electric Electronic card module thermal clip
US4204248A (en) * 1978-11-20 1980-05-20 General Electric Company Heat transfer mounting arrangement for a solid state device connected to a circuit board
US4288839A (en) * 1979-10-18 1981-09-08 Gould Inc. Solid state device mounting and heat dissipating assembly
US4388967A (en) * 1980-09-02 1983-06-21 Thermalloy Incorporated Solderable mounting stakes for heat sinks
US4563725A (en) * 1983-01-06 1986-01-07 Welwyn Electronics Limited Electrical assembly
US4609040A (en) * 1985-04-01 1986-09-02 Thermalloy Incorporated Self-securing heat sink

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3654521A (en) * 1971-01-13 1972-04-04 Gen Electric Electronic card module thermal clip
US4204248A (en) * 1978-11-20 1980-05-20 General Electric Company Heat transfer mounting arrangement for a solid state device connected to a circuit board
US4288839A (en) * 1979-10-18 1981-09-08 Gould Inc. Solid state device mounting and heat dissipating assembly
US4388967A (en) * 1980-09-02 1983-06-21 Thermalloy Incorporated Solderable mounting stakes for heat sinks
US4563725A (en) * 1983-01-06 1986-01-07 Welwyn Electronics Limited Electrical assembly
US4609040A (en) * 1985-04-01 1986-09-02 Thermalloy Incorporated Self-securing heat sink

Cited By (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4845590A (en) * 1987-11-02 1989-07-04 Chrysler Motors Corporation Heat sink for electrical components
US4891735A (en) * 1987-11-02 1990-01-02 Chrysler Motors Corporation Heat sink for electrical components
US4922601A (en) * 1987-11-02 1990-05-08 Chrysler Corporation Method of making a heat sink for electrical components
US4923179A (en) * 1987-11-02 1990-05-08 Chrysler Corporation Spring panel heat sink for electrical components
US5077638A (en) * 1987-11-04 1991-12-31 Saab Automobile Aktienbolag Heat sink for an electric circuit board
US4888637A (en) * 1988-01-15 1989-12-19 Chrysler Motors Corporation Multiple semiconductor heat sink/mounting assembly
US5051866A (en) * 1988-11-28 1991-09-24 Mita Industrial Co., Ltd. Power circuit device for an image-forming apparatus
WO1990007256A1 (en) * 1988-12-19 1990-06-28 Motorola, Inc. Heat sink assembly for densely packed transistors
US4872089A (en) * 1988-12-19 1989-10-03 Motorola Inc. Heat sink assembly for densely packed transistors
DE3906973A1 (en) * 1989-03-04 1990-09-13 Telefunken Electronic Gmbh Housing for motor-vehicle electronics
US5075822A (en) * 1989-03-04 1991-12-24 Telefunken Electronic Gmbh Housing for installation in motor vehicles
US4972294A (en) * 1989-04-03 1990-11-20 Motorola, Inc. Heat sink clip assembly
WO1991006201A1 (en) * 1989-10-16 1991-05-02 Fmtt, Inc. Integrated structure for a matrix transformer
US5344113A (en) * 1990-06-21 1994-09-06 Siemens Aktiengesellschaft Multiple spring-retention device and method for manufacturing it
US5307236A (en) * 1991-07-23 1994-04-26 Alcatel Telspace Heatsink for contact with multiple electronic components mounted on a circuit board
US5373099A (en) * 1992-01-28 1994-12-13 Alcatel Converters Fixing device for fixing electronic component against a wall of a heatsink
US5274193A (en) * 1992-04-24 1993-12-28 Chrysler Corporation Heat sink spring and wedge assembly
US5327324A (en) * 1993-11-05 1994-07-05 Ford Motor Company Spring clip for a heat sink apparatus
US5477188A (en) * 1994-07-14 1995-12-19 Eni Linear RF power amplifier
US5726603A (en) * 1994-07-14 1998-03-10 Eni Technologies, Inc. Linear RF power amplifier
US5731955A (en) * 1996-02-05 1998-03-24 Ford Motor Company Spring clip for electronics assembly
EP0788155A1 (en) * 1996-02-05 1997-08-06 Ford Motor Company Spring clip for electronics assembly
US6259602B1 (en) 1996-02-21 2001-07-10 Telefonaktiebolaget L.M. Ericsson Heat conductive device
WO1997031513A1 (en) * 1996-02-21 1997-08-28 Telefonaktiebolaget Lm Ericsson (Publ) Heat conductive device
US6043981A (en) * 1997-11-13 2000-03-28 Chrysler Corporation Heat sink assembly for electrical components
US6104612A (en) * 1998-03-09 2000-08-15 Schneider Automation Inc. Clip-on heat sink
US6130821A (en) * 1998-12-03 2000-10-10 Motorola, Inc. Multi-chip assembly having a heat sink and method thereof
US6445588B1 (en) 2001-01-02 2002-09-03 Motorola, Inc. Apparatus and method for securing a printed circuit board to a base plate
US20070153484A1 (en) * 2004-10-19 2007-07-05 Cinch Connectors, Inc. Electronic control enclosure
US7542294B2 (en) * 2004-10-19 2009-06-02 Cinch Connectors, Inc. Electronic control enclosure
US20090244847A1 (en) * 2007-05-18 2009-10-01 Acbel Polytech Inc. Mounting device for chips
US7715196B2 (en) * 2007-05-18 2010-05-11 Acbel Polytech Inc. Mounting device for chips
US20100243203A1 (en) * 2009-03-24 2010-09-30 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Cooling device for add-on card
US20100271785A1 (en) * 2009-04-22 2010-10-28 Hung-Chang Hsieh Heat-dissipating and fixing mechanism of electronic component and process for assembling same
US20110110044A1 (en) * 2009-11-12 2011-05-12 Hon Hai Precision Industry Co., Ltd. Heat dissipation apparatus for electronic device
US8238102B2 (en) * 2009-11-12 2012-08-07 Hon Hai Precision Industry Co., Ltd. Heat dissipation apparatus for electronic device
US8797743B2 (en) 2010-12-01 2014-08-05 Aisin Aw Co., Ltd. Fixing structure for heat source element and heat conducting member, and method of fixing heat source element and heat conducting member
US9312201B2 (en) 2010-12-30 2016-04-12 Schneider Electric It Corporation Heat dissipation device
US8893770B2 (en) 2011-07-29 2014-11-25 Schneider Electric It Corporation Heat sink assembly for electronic components
CN105451936A (en) * 2014-07-22 2016-03-30 株式会社纳倍路 Bellows with protective plate member
US10035232B2 (en) 2014-07-22 2018-07-31 Nabell Corporation Bellows with protective plate members
CN105451936B (en) * 2014-07-22 2019-07-09 株式会社纳倍路 Corrugated cover with protection board member
US20180035530A1 (en) * 2016-07-28 2018-02-01 JVC Kenwood Corporation Heat dissipating structure and electronic device
US10271419B2 (en) * 2016-07-28 2019-04-23 JVC Kenwood Corporation Heat dissipating structure and electronic device
CN111098725A (en) * 2019-09-27 2020-05-05 法雷奥西门子新能源汽车(深圳)有限公司 Electronic equipment and fixing module for fixing element
CN111098725B (en) * 2019-09-27 2021-03-23 法雷奥西门子新能源汽车(深圳)有限公司 Electronic equipment and fixing module for fixing element
US20220279643A1 (en) * 2019-11-18 2022-09-01 Huawei Digital Power Technologies Co., Ltd. Electronic component with enclosure frame, circuit board with electronic component, and electronic device
US12127328B2 (en) * 2022-05-18 2024-10-22 Huawei Digital Power Technologies Co., Ltd. Electronic component with enclosure frame, circuit board with electronic component, and electronic device

Also Published As

Publication number Publication date
KR860007854A (en) 1986-10-17
EP0195701A1 (en) 1986-09-24
FR2578710A1 (en) 1986-09-12
FR2578710B1 (en) 1988-03-04
EP0195701B1 (en) 1989-08-02
DE3664858D1 (en) 1989-09-07
JPS61212100A (en) 1986-09-20

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