CN111098725B

CN111098725B - Electronic equipment and fixing module for fixing element

Info

Publication number: CN111098725B
Application number: CN201910926250.0A
Authority: CN
Inventors: 余水生; 观幸
Original assignee: Valeo Siemens eAutomotive Shenzhen Co Ltd
Current assignee: Valeo eAutomotive Shenzhen Co Ltd
Priority date: 2019-09-27
Filing date: 2019-09-27
Publication date: 2021-03-23
Anticipated expiration: 2039-09-27
Also published as: WO2021057950A1; EP4035513A1; EP4035513A4; CN111098725A

Abstract

The invention relates to a fixing module (200) for fixing a component (12) to a heat sink (20) of an electronic device (10); the mounting module (200) includes a component support (40) for mounting the component (12) thereon; a first fixing member (71) provided on the member holder (40); and a second fixing element (72) provided on a support plate (16) adjacent to the heat sink (20); wherein the second fixing element (72) is complementary to the first fixing element (71) and cooperates with the first fixing element (71) to attach the element support (40) to the support plate (16) such that the element (12) is fixed against the heat sink (20).

Description

Electronic equipment and fixing module for fixing element

Technical Field

The present invention relates to a battery Charger, and more particularly to an On-Board Charger (OBC) for an Electric Vehicle (EV) or a Plug-in Hybrid Electric Vehicle (PHEV).

The present invention is directed more precisely to providing a battery charger that can accommodate more internal components and can provide higher power.

Background

A conventional propulsion system for an electric vehicle or a hybrid electric vehicle includes a high-voltage power battery and a battery charger, wherein the high-voltage power battery is used for providing a supply voltage to a motor of the vehicle for propulsion of the vehicle. The battery charger, also called an "on-board charger", is connected to an AC power grid (e.g., a regional power grid or a national power grid) and converts one or more Alternating Currents (AC) received from the AC power grid into a Direct Current (DC) that can be directly input to the battery, so that the high-voltage battery can be charged.

The vehicle charger includes a plurality of internal components and components, such as one or more transformers, one or more inductors, a plurality of diodes, a plurality of transistors, and the like. These components and assemblies are mounted on a Printed Circuit Board (PCB) mounted on a housing of the vehicle charger, and an AC input connector (AC) and a DC output connector (DC) are mounted in the housing. The vehicle charger further comprises a radiator for absorbing, removing and discharging a large amount of heat energy generated by the above elements and components during operation.

However, the power requirement of the vehicle charger is higher, that is, more heat generating components may be required to be accommodated in the vehicle charger, but the size of the charger itself needs to be reduced as much as possible.

Disclosure of Invention

The present invention is directed to solving the above-mentioned problems, and provides an electronic device capable of accommodating more internal components and providing higher power, and a related fixing module thereof, so as to effectively discharge and remove heat energy generated by the internal components of the electronic device during operation.

In order to achieve the purpose, the invention adopts the following technical scheme:

a fixing module is used for fixing an element on a radiator of an electronic device; the fixing module comprises an element bracket for mounting the element thereon; a first fixing member provided on the member holder; and a second fixing element disposed on a supporting plate adjacent to the heat sink; wherein the second fixing element is complementary to the first fixing element and cooperates with the first fixing element to attach the element holder to the support plate such that the element is held against the heat sink.

Further, the first fixing member includes: a head portion for contacting the second fixing member; a neck extending from the component support and connected to the head; wherein a first interior angle formed between the head and the neck corresponds to a second interior angle formed in the second fixation element.

Further, the second fixing element comprises a hook arm; the hook arm extends from the edge of a supporting plate of the supporting plate and is used for contacting with the first fixing element; wherein the second inner angle formed between the support plate and the hook arm corresponds to the first inner angle.

Further, the first interior angle and the second interior angle are both less than or equal to 120 degrees.

Further, the head portion includes a main contact area for contacting an inner surface of the hook arm when the component is mounted on the component holder and the component holder is mounted on the heat sink; wherein the second interior angle is formed between the inner surface of the clasp arm and the support plate.

Further, the head part comprises at least one secondary contact area for contacting with at least one pin of the element, so that the element can be more stably arranged on the element support.

Further, the at least one secondary contact area is adjacent to the primary contact area and is formed on the same side of the head as the primary contact area.

Further, the supporting plate comprises at least one edge opening which is arranged on the edge of the supporting plate; when the component is mounted on the component support and the component support is mounted on the heat sink, the at least one edge opening is used for allowing the at least one pin of the component to pass through.

Further, the second fixing element is adjacent to the at least one edge opening.

Further, the at least one edge opening is a hole-shaped or a notch-shaped opening for assisting the alignment of the position of the at least one pin of the component when the component is fixed on the heat sink in an abutting manner.

Further, the component support includes: a first bracket edge for the first fixing element to be disposed thereon; a second bracket edge opposite the first bracket edge; and at least one bracket leg arranged on the edge of the second bracket and used for matching with a snap-in element positioned on the electronic equipment when the element is abutted and fixed on the radiator.

Furthermore, the fixing module further comprises an auxiliary fixing device for fixing the component support on the heat sink in an abutting manner.

Further, the auxiliary fixture includes a pressing member which allows the pressing member to tilt itself toward the component holder in such a manner as to apply a force to press the component holder; the pressing element includes a spring.

Further, the auxiliary fixing device further comprises a fixing element, wherein the fixing element extends from the pressing element and is fixed in the electronic equipment.

Further, the fixing member is fixed in the electronic device by using at least one screw.

Further, the supporting plate is an insulating plate made of an insulating material.

Further, the first fixing element and the element holder are formed in an integrally molded manner.

Further, the second fixing element and the support plate are formed in an integrally molded manner.

An electronic device, comprising: a housing, an insulating plate, and a fixing module as described above; the shell comprises at least one inner chamber for accommodating a first element, in particular a magnetic element, and a surrounding wall of the inner chamber forms a heat sink; the insulating plate is made of an insulating material and covers the inner cavity; the fixing module is used for abutting and fixing a second element on the radiator; wherein the component holder is used for accommodating the second component; the second fixing element is arranged on the insulating plate and is matched with the first fixing element when the second element is abutted and fixed on the radiator so as to fix the element bracket.

Further, the electronic device further comprises an electronic board, and the electronic board is located above the insulating board.

Further, the insulating plate includes at least one edge opening formed on a supporting plate edge of the insulating plate and used for allowing the at least one pin of the second element to pass through when the second element is fixed on the heat sink in an abutting manner; wherein the at least one pin of the second element is connected to the electronic board.

Further, the insulating plate comprises at least one through hole for passing through at least one pin of the first component and connecting to the electronic board.

Further, when the electronic board is positioned over the insulating board, the pins of the first and second components are inserted into corresponding pin holes provided on the electronic board, each electrically connected to the electronic board.

Further, the component support includes: a first bracket edge for the first fixing element to be disposed thereon; a second bracket edge opposite the first bracket edge; and at least one bracket leg arranged on the edge of the second bracket and used for matching with a snap-in element of the electronic equipment so as to ensure that the element is abutted and fixed on the heat radiator.

Further, the snap element comprises at least one aperture located on the perimeter wall of the inner chamber or on the floor of the housing from which the perimeter wall of the inner chamber extends.

An assembling method for assembling the electronic device comprises at least the following steps: mounting the second element on the element support of the fixed module; placing the at least one bracket leg arranged at the edge of the second bracket into the occlusion element arranged on the electronic equipment; and joining the first fixing element with the second fixing element arranged on the insulating plate, so that a contact surface of the second element contacts an insulating gasket, and the insulating gasket is pasted on the peripheral wall of the inner cavity.

Drawings

Fig. 1 is a schematic longitudinal sectional view of an electronic device according to an embodiment of the invention.

Fig. 2 is a schematic diagram of the parts and the fixing module of the embodiment shown in fig. 1 after assembly.

Fig. 3 is a structural view of each of the fixing module and the second member of fig. 2.

Fig. 4 is a schematic view of the component holder of fig. 2 being fixed to the heat sink and the support plate.

Fig. 5 is a schematic view of the component holder of fig. 3 from another perspective.

Detailed Description

The essential features and advantages of the invention will be explained in more detail below with reference to the drawings and exemplary embodiments, to which the invention is not restricted.

Fig. 1 is a schematic longitudinal sectional view of an electronic device 10 according to an embodiment of the invention. The electronic device 10 includes a housing 50, an electronic board 18, an insulating board 16, at least one first element 32, at least one second element 12, a heat sink 20 and a fixing module 200. The housing 50 may include a plurality of sidewalls and a bottom plate 51. The bottom plate 51 and the sidewalls form a main cavity opposite to the bottom plate 51, and the main cavity is used to accommodate components and assemblies included in the electronic device 10, including the insulating plate 16, the at least one first component 32, the at least one second component 12, and the heat sink 20.

The main chamber comprises an inner chamber formed between the insulating plate 16 and the bottom plate 51, the insulating plate 16 being parallel to the electronic board 18 and covering the inner chamber. The inner chamber is configured to receive at least a portion of the at least one first component 32 and the at least one second component 12. In the present embodiment, the inner chamber is used for accommodating the at least one first element 32. The at least one first component 32 has at least one lead 325. The insulating plate 16 is provided with a plurality of through holes 167 for passing through the respective leads of at least a portion of the at least one first component 32 and the at least one second component 12. The insulating plate 16 is made of an electrically insulating material, however, the insulating plate 16 has a function of a supporting member in addition to an insulating function, and thus can also be regarded as a supporting plate 16; the support function and the construction of the support plate 16 will be described in detail below.

An electronic board 18 is positioned above the insulating board 16 and covers the opening of the main chamber. The electronic board 18 is provided with a plurality of pin holes. When the electronic board 18 is located on the insulating board 16, the pins of at least a part of the at least one first component 32 and the at least one second component 12 are inserted into the corresponding pin holes on the electronic board 18 after passing through the corresponding through holes 167 on the insulating board 16, so that the at least one first component 32 and the at least one second component 12 are electrically connected to the electronic board 18. Further, the electronic Board 18 is a Printed Circuit Board (PCB).

In one embodiment, the at least one first element 32 may include one or more magnetic elements, such as inductors or transformers; the at least one second element 12 may include one or more diodes (diodes) or Field Effect transistors, such as Metal-Oxide-Semiconductor Field-Effect transistors (MOSFETs). The electronic device 10 may be an On-Board Charger (OBC) suitable for an electric vehicle or a hybrid electric vehicle.

During operation of the electronic device 10, the at least one first element 32 and the at least one second element 12 emit a large amount of heat energy, and the heat sink 20 absorbs the heat energy. Under general design principles, the at least one first element 32 and the at least one second element 12 are installed as close to the heat sink 20 as possible, so as to enhance the heat dissipation effect provided by the heat sink 20.

In the present embodiment, the inner chamber is used for accommodating the at least one first element 32, and the surrounding walls of the inner chamber extend upward from the bottom plate 51 (i.e., extend to the positions of the insulating plate 16 and the electronic plate 18), and thus can also be regarded as a part of the bottom plate 51, that is, the surrounding walls include the side walls and the bottom wall of the inner chamber; further, the heat sink 20 is disposed in the bottom plate 51 (the wall including the inner chamber), such that the heat sink 20 is disposed adjacent to the insulating plate 16, and the at least one first element 32 is surrounded by the heat sink 20, so that the heat of the at least one first element 32 is more effectively absorbed, dissipated and released by the heat sink 20. In addition, there is a gap between the surrounding wall and the bottom wall in the inner chamber and the first element 32, and the gap needs to be filled with a heat-conducting pouring sealant, which is a liquid substance that can be cured under specific conditions and has the functions of heat conduction and electrical insulation.

As regards the dissipation of heat from the at least one second element 12, the fixing module 200 is relied on to fix the at least one second element 12 against the heat sink 20, i.e. against the wall of the inner chamber, as shown in fig. 2. As mentioned above, the heat sink 20 is also adjacent to the supporting plate 16 (in the present embodiment, the insulating plate 16). In addition, the electronic device 10 may further include an insulating spacer 56 for separating the heat sink 20 from the at least one second element 12. Further, a dielectric spacer 56 is attached flat to the wall of the inner chamber, as shown in FIG. 2. Insulating spacer 56 is made of an insulating material, and preferably can be an electrically insulating material with good thermal conductivity, such as a thermally conductive silicone pad.

The fixing module 200 includes a component support 40, at least one first fixing component 71 and at least one second fixing component 72; the supporting plate 16 further includes at least one edge opening 165, which may be a hole-shaped opening or a notch-shaped opening, in addition to the through holes 167. Fig. 3 is a structural diagram of the insulating plate 16, the at least one second component 12, and the component holder 40, respectively. Fig. 5 is a schematic view of the component holder 40 of fig. 3 from another perspective.

As shown in fig. 2 and 3, the component holder 40 is configured to receive one or more second components 12, and the support plate 16 includes at least one support plate edge 161 having one or more edge openings 165; the edge openings 165 are used to allow the pins 125 of the second components 12 to pass through when the second components 12 are mounted on the component support 40 and the component support 40 is mounted on the heat sink 20, and to assist in aligning the positions of the pins 125 of the second components 12 when the second components 12 are abutted against and fixed on the heat sink 20. When the electronic board 18 is placed on the supporting board 16 (insulating board 16), the edge openings 165 are used to align the pins 125 of the second component 12 and insert into corresponding pin holes provided on the electronic board 18, so that the assembly of the electronic device 10 is easier.

In the present embodiment, as shown in fig. 3 and 5, the component support 40 includes a support body 408, which may be a flat plate and includes a first support edge 401 and a second support edge 402 opposite to each other. At least one fixing column 407 and at least one supporting sheet 408 are arranged on the bracket main body 408; for example, to mount a second component 12, the fixing post 407 is adapted to be engaged with a fixing hole 133 of the component main body 122 of the second component 12, and the fixing post 407 is inserted into the fixing hole 133 of the second component 12, so as to mount the second component 12 on the bracket main body 408 of the component bracket 40. The support tabs 408 contact the bottom 130c of the device body 122 to help secure the second device 12. The component main body 122 of the second component 12 has a thickness 126 and two

contact surfaces

130a, 130b, wherein the contact surface 130b contacts the holder main body 408 when the second component 12 is mounted on the component holder 40; as for the contact face 130a opposite to the contact face 130b, the insulating gasket 56 is contacted when the component holder 40 is attached to the support plate 16 while being fixed to the heat sink 20, as shown in fig. 2.

The example of fig. 2 and 3 shows that the fixing module 200 comprises a plurality of first fixing elements 71 arranged on the component carrier 40 and a plurality of second fixing elements 72 arranged on the support plate 16, which second fixing elements 72 are complementary and cooperate with the first fixing elements 71, both being used to attach the component carrier 40, which carries the second components 12, to the support plate 16 and simultaneously fix the component carrier 40 to the heat sink 20; in other words, the heat dissipation efficiency of the heat sink 20 for the second elements 12 is enhanced by using the fixing module 200 to fix the element support 40 carrying the second elements 12 against the heat sink 20, so as to fix the second elements 12 against the heat sink 20.

In the present embodiment, the first fixing elements 71 are disposed on the first frame edge 401 of the element frame 40, and preferably are distributed equidistantly. Further, each of the first fixing elements 71 includes a head portion 711 and a neck portion 712. A neck 712 extends from the first leg edge 401 of the component leg 40 and is connected to the head 711; the head 711 is used to contact the second fixing element 72 disposed on the supporting plate 16. The neck 712 and the support body 408 have a fifth interior angle a5, which may be equal to or slightly greater than 90 degrees. In addition, in one embodiment, the length of the neck 712 is equal to or approximately less than the thickness 126 of the device body 122 of the second device 12.

Further, the head 711 includes a main contact region 713 for contacting an inner surface of a hook arm 723 of the second fixing member 72 when the second component 12 is mounted on the component holder 40 and the component holder 40 is mounted on the heat sink 20. Wherein a first inner angle a1 formed between the head 711 and the neck 712 corresponds to a second inner angle a2 formed in the second fixing element 72.

In the present embodiment, each of the second fixing elements 72 disposed on the supporting plate 16 is adjacent to one of the edge openings 165. Further, one or more edge openings 165 may be spaced between the two second fixing elements 72, as shown in fig. 2 and 3, and at least two edge openings 165 corresponding to the two pins 125 of the second element 12 are spaced between the two second fixing elements 72. In the present embodiment, the hook arm 723 of the second fixing member 72 extends from the support plate edge 161 of the support plate 16 and is configured to contact the first fixing member 71; wherein a second inner angle a2 formed between the inner surface of the hook arm 723 and the support plate 16 corresponds to the first inner angle a1 described above. Further, the first interior angle a1 and the second interior angle a2 are both less than 120 degrees. In one embodiment, the first interior angle a1 and the second interior angle a2 have the same value. In another embodiment, the first interior angle a1 and the second interior angle a2 may have different values.

In addition, in order to enable the second device 12 to be more stably mounted on the device support 40 when the second device 12 is mounted on the device support 40 and the device support 40 is mounted on the heat sink 20, the head 711 of the first fixing device 71 further includes at least one

secondary contact area

715a, 715b for contacting with one or more pins 125 of the second device 12, as shown in fig. 2 and 3. Preferably, the at least one

secondary contact region

715a, 715b is adjacent to the primary contact region 713, and is formed on the same side of the head 711 as the primary contact region 713.

Further, the head 711 of the first fixing element 71 at one end 401a of the first bracket edge 401 comprises only one secondary contact area 715b, while the head 711 of the first fixing element 71 at the other end 401b of the first bracket edge 401 comprises only one secondary contact area 715 a. As for each of the second elements 12 located between the two ends 401a, 401b of the first frame edge 401, the head 711 has two

secondary contact areas

715a, 715 b.

In one embodiment, the component carrier 40 further comprises at least one carrier leg 405 disposed at the second carrier edge 402, as shown in fig. 3, the component carrier 40 comprises four carrier legs 405. Preferably, the at least one carrier leg 405 and the component carrier 40 are formed in an integrally formed manner.

Fig. 4 is a schematic view of the component holder 40 of fig. 2 secured to the heat sink 20 and the support plate 16. During assembly of the electronic device 10, the stand legs 405 are adapted to mate with a snap-in component 93 of the electronic device 10 after the second components 12 are mounted on the component stand 40. The snap member 93 may be located on the base plate 51 or on the wall of the inner chamber as described above. Further, the biting element 93 includes one or more holes, and in the example shown in fig. 3 and 4, the biting element 93 has four holes corresponding to the four bracket legs 405; in the above-mentioned assembling process, the bracket legs 405 of the component bracket 40, which has carried the second components 12, are respectively inserted into one or more holes of the engaging component 93. After the support legs 405 are placed in the engaging elements 93, the element support 40 is pushed toward the support plate 16 (i.e., "insulating plate 16") and the heat sink 20 with the support legs 405 as a fulcrum, and the first fixing elements 71 are engaged with the second fixing elements 72 disposed on the insulating plate 16, as shown by arrow F1 in fig. 4, so that the contact surfaces 130a of the second elements 12 contact the insulating pads 56 adhered to the heat sink 20, and the second elements 12 are abutted against and fixed on the heat sink 20.

The first fixing element 71, the second fixing element 72, the element support 40, and the support plate 16 may be made of plastic.

In one embodiment, the first fixing element 71 and the element carrier 40 are formed in one piece. In another embodiment, the second fixing element 72 and the support plate 16 are formed in an integrally formed manner. In a preferred embodiment, the first fixing element 71 is formed integrally with the element support 40, and the second fixing element 72 is formed integrally with the support plate 16.

Further, in a preferred embodiment, the fixing module 200 further includes an auxiliary fixing device 80 for enhancing the effect of fixing the component support 40 on the heat sink 20. In the present embodiment, the auxiliary fixing device 80 includes a pressing element 81 and a fixing element 82. The pressing member 81 may be made of a slightly elastic material, which allows the pressing member 81 to tilt itself toward the component holder 40 to apply force to press the component holder 40. Further, the pressing member 81 may be a spring. In one embodiment, the pressing element 81 and the holder body 408 of the element holder 40 form an inner angle of less than 35 degrees. In addition, in the present embodiment, the fixing element 82 is formed extending from the pressing element 81, and the fixing element 82 may be fixed in the electronic device 10 by using one or more screws 83, as shown in fig. 2. Preferably, a fourth inner angle a4 formed between the pressing member 81 and the fixing member 82 is greater than 90 degrees.

The material of the heat sink 20 of the present invention may be one of the following materials: aluminum and aluminum alloys, copper and copper alloys. The material of the cooling medium in the radiator 20 can be water or oil and its mixture, water and glycol mixture; however, the present invention is not limited to the selection of the materials of the heat sink 20 and the cooling medium.

The electronic device 10 of the present invention can provide higher power, accommodate more internal components, and simultaneously ensure that the heat generated by the internal components during operation can be effectively absorbed, discharged and dissipated. Furthermore, the fixing module 200 of the present invention can make the second elements 12 be fixed on the heat sink 20 in an abutting manner, so that the heat energy of the second elements 12 during operation can be effectively absorbed, dissipated and released by the heat sink 20.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims

1. A mounting module (200) for mounting a component (12) to a heat sink (20) of an electronic device (10); the fixing module (200) is characterized in that it comprises:

-an element holder (40) for mounting the element (12) thereon;

-a first fixing element (71) arranged on the element support (40);

-a second fixing element (72) arranged on a support plate (16) adjacent to the heat sink (20); the second fixing element (72) being complementary to the first fixing element (71) and cooperating with the first fixing element (71) to attach the element support (40) to the support plate (16) in such a way that the element (12) is fixed against the heat sink (20),

wherein the first fixing element (71) comprises a head (711) for contacting the second fixing element (72), the second fixing element (72) comprising a hook arm (723), the head (711) comprising a main contact region (713) for contacting an inner surface of the hook arm (723).

2. The securing module (200) according to claim 1, characterized in that: the first fixing element (71) further comprises:

-a neck (712) extending from the element holder (40) and connected to the head (711);

wherein a first inner angle (a1) formed between the head (711) and the neck (712) corresponds to a second inner angle (a2) formed in the second fixing element (72).

3. The securing module (200) according to claim 2, characterized in that: the hook arm (723) extends from a support plate edge (161) of the support plate (16) and is adapted to contact the first fixing member (71); wherein the second interior angle (a2) formed between the support plate (16) and the hook arm (723) corresponds to the first interior angle (a 1).

4. The securing module (200) according to claim 3, characterized in that: the first interior angle (a1) and the second interior angle (a2) are both less than or equal to 120 degrees.

5. The securing module (200) according to claim 3, characterized in that: the main contact region (713) for contacting an inner surface of the hook arm (723) when the component (12) is mounted on the component holder (40) and the component holder (40) is mounted on the heat sink (20); wherein the second interior angle (a2) is formed between the inner surface of the hook arm (723) and the support plate (16).

6. The securing module (200) of claim 5, wherein: the head (711) includes at least one secondary contact area (715a, 715b) for contacting at least one lead (125) of the component (12), thereby enabling the component (12) to be more securely mounted on the component support (40).

7. The securing module (200) according to claim 6, characterized in that: the at least one secondary contact region (715a, 715b) is adjacent to the primary contact region (713) and is formed on the same side of the head (711) as the primary contact region (713).

8. The securing module (200) according to claim 6, characterized in that: the support plate (16) includes at least one edge opening (165) disposed on the support plate edge (161); the at least one edge opening (165) is configured to allow passage of the at least one pin (125) of the component (12) when the component (12) is mounted on the component support (40) and the component support (40) is mounted on the heat sink (20).

9. The securing module (200) of claim 8, characterized in that: the second securing element (72) is adjacent to the at least one edge opening (165).

10. The securing module (200) of claim 8, characterized in that: the at least one edge opening (165) is a hole-like or a notch-like opening to assist in the alignment of the position of the at least one pin (125) of the component (12) when the component (12) is secured against the heat sink (20).

11. The securing module (200) according to claim 1, characterized in that: the component holder (40) comprises:

-a first bracket edge (401) for the first fixing element (71) to be arranged thereon;

-a second shelf edge (402) opposite the first shelf edge (401);

-at least one bracket leg (405) arranged on the second bracket edge (402) for cooperating with a snap-in element (93) located on the electronic device (10) when the component (12) is secured against the heat sink (20).

12. The securing module (200) according to claim 1, characterized in that: the fixing module (200) further comprises an auxiliary fixing device (80) for fixing the component support (40) against the heat sink (20).

13. The securing module (200) according to claim 12, characterized in that: the auxiliary fixing device (80) includes a pressing member (81) which allows the pressing member (81) to tilt itself toward the component holder (40) in such a manner as to force the pressing of the component holder (40); the pressing member (81) includes a spring.

14. The securing module (200) according to claim 13, characterized in that: the auxiliary fixing device (80) further comprises a fixing element (82), and the fixing element (82) extends from the pressing element (81) and is fixed in the electronic device (10).

15. The securing module (200) according to claim 14, characterized in that: the fixing element (82) is fixed in the electronic device (10) by using at least one screw (83).

16. The securing module (200) according to claim 1, characterized in that: the support plate (16) is an insulating plate made of an insulating material.

17. The securing module (200) of claim 1, wherein:

-the first fixing element (71) and the element holder (40) are formed in an integrally formed manner; and/or

-the second fixing element (72) and the support plate (16) are formed in an integrally formed manner.

18. An electronic device (10), characterized in that it comprises:

-a housing (50) comprising at least one inner chamber for housing a first element (32), a wall of the inner chamber forming a heat sink (20);

-a support plate (16) made of an insulating material and covering the inner chamber;

-a fixing module (200) for fixing an element (12) against the heat sink (20) according to any one of the preceding claims 1 to 17;

wherein the component holder (40) is adapted to receive the component (12); the second fixing member (72) is provided on the support plate (16) and cooperates with the first fixing member (71) to fix the component holder (40) when the component (12) is fixed against the heat sink (20).

19. The electronic device (10) of claim 18, wherein: the first element is a magnetic element.

20. The electronic device (10) of claim 19, wherein: the electronic device (10) further comprises an electronic board (18), wherein the electronic board (18) is positioned above the supporting plate (16).

21. The electronic device (10) of claim 20, wherein: the support plate (16) comprises at least one edge opening (165) formed on a support plate edge (161) of the support plate (16) and intended to allow the passage of at least one pin (125) of the component (12) when the component (12) is fixed against the heat sink (20); wherein at least one pin (125) of the component (12) is connected to the electronic board (18).

22. The electronic device (10) of claim 20, wherein: the support plate (16) comprises at least one through hole (167) for passing through at least one pin of the first component (32) and connecting to the electronic board (18).

23. The electronic device (10) of claim 20, wherein: when the electronic board (18) is positioned above the support plate (16), the pins (325, 125) of the first component (32) and the component (12) are inserted into corresponding pin holes provided on the electronic board (18), each electrically connected to the electronic board (18).

24. The electronic device (10) of claim 19, wherein: the component holder (40) comprises:

-a second shelf edge (402) opposite the first shelf edge (401);

-at least one bracket leg (405) provided on the second bracket edge (402) for cooperating with a snap-in element (93) at the electronic device (10) for securing the element (12) against the heat sink (20).

25. The electronic device (10) of claim 24, wherein: the snap element (93) comprises at least one aperture located on the perimeter wall of the inner chamber or on a floor (51) of the housing (50) from which the perimeter wall of the inner chamber extends (51).

26. An assembly method for assembling an electronic device (10) according to claim 24, characterized in that: the assembly method comprises at least the following steps:

a) mounting the component (12) on the component support (40) of the fixed module (200); and

b) placing the at least one cradle leg (405) disposed at the second cradle edge (402) into the engagement element (93) disposed at the electronic device (10); and

c) -engaging the first fixing element (71) with the second fixing element (72) provided on the support plate (16) so that a contact face (130a) of the element (12) contacts an insulating gasket (56), the insulating gasket (56) being glued to the peripheral wall of the inner chamber.