DE3650170T2 - Halbleiteranordnung mit Verbindungselektroden. - Google Patents
Halbleiteranordnung mit Verbindungselektroden.Info
- Publication number
- DE3650170T2 DE3650170T2 DE19863650170 DE3650170T DE3650170T2 DE 3650170 T2 DE3650170 T2 DE 3650170T2 DE 19863650170 DE19863650170 DE 19863650170 DE 3650170 T DE3650170 T DE 3650170T DE 3650170 T2 DE3650170 T2 DE 3650170T2
- Authority
- DE
- Germany
- Prior art keywords
- connecting electrodes
- semiconductor arrangement
- semiconductor
- arrangement
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
- H01L23/53214—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being aluminium
- H01L23/53223—Additional layers associated with aluminium layers, e.g. adhesion, barrier, cladding layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
- H01L29/456—Ohmic electrodes on silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60100915A JPS61258452A (ja) | 1985-05-13 | 1985-05-13 | 半導体装置 |
JP19650385A JPS6255929A (ja) | 1985-09-05 | 1985-09-05 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3650170D1 DE3650170D1 (de) | 1995-01-26 |
DE3650170T2 true DE3650170T2 (de) | 1995-05-18 |
Family
ID=26441855
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19863650170 Expired - Lifetime DE3650170T2 (de) | 1985-05-13 | 1986-05-07 | Halbleiteranordnung mit Verbindungselektroden. |
Country Status (2)
Country | Link |
---|---|
EP (2) | EP0209654B1 (de) |
DE (1) | DE3650170T2 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8800359A (nl) * | 1988-02-15 | 1989-09-01 | Philips Nv | Werkwijze voor het vervaardigen van een halfgeleiderinrichting. |
KR920005242A (ko) * | 1990-08-20 | 1992-03-28 | 김광호 | 게이트-절연체-반도체의 구조를 가지는 트랜지스터의 제조방법 |
EP0517368B1 (de) * | 1991-05-03 | 1998-09-16 | STMicroelectronics, Inc. | Lokalverbindungen für integrierte Schaltungen |
EP0514103A1 (de) * | 1991-05-14 | 1992-11-19 | STMicroelectronics, Inc. | Herstellungsverfahren von einer Metallbarriere für submikron Kontakte |
JPH0730095A (ja) * | 1993-06-25 | 1995-01-31 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
KR0148325B1 (ko) * | 1995-03-04 | 1998-12-01 | 김주용 | 반도체 소자의 금속 배선 형성방법 |
EP0732731A3 (de) * | 1995-03-13 | 1997-10-08 | Applied Materials Inc | Behandlung einer Titannitrid-Schicht zur Verbesserung der Beständigkeit gegen höhere Temperaturen |
WO2018161100A1 (de) | 2017-03-07 | 2018-09-13 | Karl Angleitner | Lagerregal für Lagergüter und Regalbedieneinrichtung zum Ein- und Auslagern der Lagergüter |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3217026A1 (de) * | 1981-05-06 | 1982-12-30 | Mitsubishi Denki K.K., Tokyo | Halbleitervorrichtung |
JPS58101454A (ja) * | 1981-12-12 | 1983-06-16 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置の電極 |
JPS59231836A (ja) * | 1983-06-14 | 1984-12-26 | Toshiba Corp | 多層構造アルミニウム層の形成方法 |
-
1986
- 1986-05-07 EP EP86106245A patent/EP0209654B1/de not_active Expired - Lifetime
- 1986-05-07 DE DE19863650170 patent/DE3650170T2/de not_active Expired - Lifetime
- 1986-05-07 EP EP9494108007A patent/EP0613180A3/de not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
EP0209654B1 (de) | 1994-12-14 |
EP0613180A2 (de) | 1994-08-31 |
EP0613180A3 (de) | 1994-10-19 |
EP0209654A3 (en) | 1988-10-12 |
EP0209654A2 (de) | 1987-01-28 |
DE3650170D1 (de) | 1995-01-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) |