DE3787709D1 - Halbleiteranordnung mit einem Elektrodenfleck. - Google Patents

Halbleiteranordnung mit einem Elektrodenfleck.

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Publication number
DE3787709D1
DE3787709D1 DE87118354T DE3787709T DE3787709D1 DE 3787709 D1 DE3787709 D1 DE 3787709D1 DE 87118354 T DE87118354 T DE 87118354T DE 3787709 T DE3787709 T DE 3787709T DE 3787709 D1 DE3787709 D1 DE 3787709D1
Authority
DE
Germany
Prior art keywords
semiconductor arrangement
electrode spot
spot
electrode
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE87118354T
Other languages
English (en)
Other versions
DE3787709T2 (de
Inventor
Osamu C O Patent Divisio Usuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
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Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE3787709D1 publication Critical patent/DE3787709D1/de
Application granted granted Critical
Publication of DE3787709T2 publication Critical patent/DE3787709T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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DE87118354T 1986-12-12 1987-12-10 Halbleiteranordnung mit einem Elektrodenfleck. Expired - Fee Related DE3787709T2 (de)

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JP61294902A JPS63148646A (ja) 1986-12-12 1986-12-12 半導体装置

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JPH0682704B2 (ja) * 1989-06-27 1994-10-19 株式会社東芝 半導体装置
NL8902695A (nl) * 1989-11-01 1991-06-03 Philips Nv Interconnectiestructuur.
JPH03208355A (ja) * 1990-01-10 1991-09-11 Mitsubishi Electric Corp 半導体装置及びその製造方法
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US5567981A (en) * 1993-03-31 1996-10-22 Intel Corporation Bonding pad structure having an interposed rigid layer
KR970011650B1 (en) * 1994-01-10 1997-07-12 Samsung Electronics Co Ltd Fabrication method of good die of solder bump
US5483105A (en) * 1994-04-25 1996-01-09 International Business Machines Corporation Module input-output pad having stepped set-back
US5455195A (en) * 1994-05-06 1995-10-03 Texas Instruments Incorporated Method for obtaining metallurgical stability in integrated circuit conductive bonds
US5865658A (en) * 1995-09-28 1999-02-02 Micron Display Technology, Inc. Method for efficient positioning of a getter
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US5060051A (en) 1991-10-22
JPS63148646A (ja) 1988-06-21
EP0271110A3 (en) 1989-02-22
EP0271110B1 (de) 1993-10-06
CN1020029C (zh) 1993-03-03
EP0271110A2 (de) 1988-06-15
CN87107402A (zh) 1988-06-22
JPH0482183B2 (de) 1992-12-25
KR910000757B1 (ko) 1991-02-06
DE3787709T2 (de) 1994-04-21
KR880008444A (ko) 1988-08-31

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