DE3639402A1 - Verfahren zur herstellung einer mehrschichtigen leiterplatte sowie danach hergestellte leiterplatte - Google Patents

Verfahren zur herstellung einer mehrschichtigen leiterplatte sowie danach hergestellte leiterplatte

Info

Publication number
DE3639402A1
DE3639402A1 DE19863639402 DE3639402A DE3639402A1 DE 3639402 A1 DE3639402 A1 DE 3639402A1 DE 19863639402 DE19863639402 DE 19863639402 DE 3639402 A DE3639402 A DE 3639402A DE 3639402 A1 DE3639402 A1 DE 3639402A1
Authority
DE
Germany
Prior art keywords
circuit board
contacted
holes
printed circuit
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19863639402
Other languages
German (de)
English (en)
Inventor
Gerhard Buettner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19863639402 priority Critical patent/DE3639402A1/de
Priority to EP87116247A priority patent/EP0271692A3/en
Priority to US07/119,719 priority patent/US4783815A/en
Priority to DK599287A priority patent/DK599287A/da
Publication of DE3639402A1 publication Critical patent/DE3639402A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/609—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of circuitry
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/603—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of mechanical or electronic switches or control elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/607—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of earhooks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/061—Lamination of previously made multilayered subassemblies
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Neurosurgery (AREA)
  • Otolaryngology (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE19863639402 1986-11-18 1986-11-18 Verfahren zur herstellung einer mehrschichtigen leiterplatte sowie danach hergestellte leiterplatte Withdrawn DE3639402A1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE19863639402 DE3639402A1 (de) 1986-11-18 1986-11-18 Verfahren zur herstellung einer mehrschichtigen leiterplatte sowie danach hergestellte leiterplatte
EP87116247A EP0271692A3 (en) 1986-11-18 1987-11-04 A miniature hearing aid having a multilayer circuit arrangement
US07/119,719 US4783815A (en) 1986-11-18 1987-11-12 Manufacturing miniature hearing aid having a multi-layer circuit arrangement
DK599287A DK599287A (da) 1986-11-18 1987-11-16 Fremgangsmaade til fremstilling af en flerlagskredsloebsplade samt en ifoelge fremgangsmaaden fremstillet kredsloebsplade

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19863639402 DE3639402A1 (de) 1986-11-18 1986-11-18 Verfahren zur herstellung einer mehrschichtigen leiterplatte sowie danach hergestellte leiterplatte

Publications (1)

Publication Number Publication Date
DE3639402A1 true DE3639402A1 (de) 1988-05-19

Family

ID=6314212

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19863639402 Withdrawn DE3639402A1 (de) 1986-11-18 1986-11-18 Verfahren zur herstellung einer mehrschichtigen leiterplatte sowie danach hergestellte leiterplatte

Country Status (4)

Country Link
US (1) US4783815A (da)
EP (1) EP0271692A3 (da)
DE (1) DE3639402A1 (da)
DK (1) DK599287A (da)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0481472A1 (en) * 1990-10-17 1992-04-22 Nec Corporation Multilayer printed wiring board and process for manufacturing the same
US5433000A (en) * 1990-10-01 1995-07-18 Sony Corporation Manufacturing method for a multilayer wiring board
WO2011025780A1 (en) * 2009-08-28 2011-03-03 Siemens Medical Instruments Pte. Ltd. Hearing aid device and a method of manufacturing a hearing aid device
WO2011025676A1 (en) * 2009-08-28 2011-03-03 Siemens Medical Instruments Pte. Ltd. Hearing aid device and method of producing a hearing aid device
EP3661232A1 (en) * 2018-11-30 2020-06-03 GN Hearing A/S Hearing device with embedded integrated circuit chip

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US5147210A (en) * 1988-03-03 1992-09-15 Western Digital Corporation Polymer film interconnect
US5069213A (en) * 1988-04-29 1991-12-03 Thor Technology Corporation Oximeter sensor assembly with integral cable and encoder
US5041187A (en) * 1988-04-29 1991-08-20 Thor Technology Corporation Oximeter sensor assembly with integral cable and method of forming the same
US4927983A (en) * 1988-12-16 1990-05-22 International Business Machines Corporation Circuit board
US4933045A (en) * 1989-06-02 1990-06-12 International Business Machines Corporation Thin film multilayer laminate interconnection board assembly method
US5056151A (en) * 1989-09-19 1991-10-08 Gennum Corporation Electrical component connection and combinations of electrical components
GB8928899D0 (en) * 1989-12-21 1990-02-28 Knowles Electronics Co Coil assemblies
ATE124599T1 (de) * 1990-04-05 1995-07-15 Dyconex Ag Herstellung von mehrschichtigen leiterplatten mit erhöhter leiterbahnendichte.
EP0548379B1 (de) * 1991-12-17 1994-07-20 Siemens Audiologische Technik GmbH Hörhilfegerät
US5475606A (en) * 1993-03-05 1995-12-12 International Business Machines Corporation Faraday cage for a printed circuit card
US5876842A (en) * 1995-06-07 1999-03-02 International Business Machines Corporation Modular circuit package having vertically aligned power and signal cores
US6018673A (en) * 1996-10-10 2000-01-25 Nellcor Puritan Bennett Incorporated Motion compatible sensor for non-invasive optical blood analysis
EP0852451A3 (de) * 1997-01-02 2004-05-12 Siemens Audiologische Technik GmbH Hörhilfegerät
WO2000021334A2 (en) * 1998-10-07 2000-04-13 Oticon A/S Behind-the-ear hearing aid
US6771786B1 (en) 1999-07-28 2004-08-03 Oticon A/S Hearing aid including an integrated circuit
US6469256B1 (en) * 2000-02-01 2002-10-22 International Business Machines Corporation Structure for high speed printed wiring boards with multiple differential impedance-controlled layers
JP4563803B2 (ja) * 2002-07-10 2010-10-13 オティコン アクティーセルスカプ 補聴器または類似の音響装置及び補聴器の製造方法
US7162288B2 (en) 2004-02-25 2007-01-09 Nellcor Purtain Bennett Incorporated Techniques for detecting heart pulses and reducing power consumption in sensors
US7657295B2 (en) 2005-08-08 2010-02-02 Nellcor Puritan Bennett Llc Medical sensor and technique for using the same
US7590439B2 (en) 2005-08-08 2009-09-15 Nellcor Puritan Bennett Llc Bi-stable medical sensor and technique for using the same
US7657294B2 (en) 2005-08-08 2010-02-02 Nellcor Puritan Bennett Llc Compliant diaphragm medical sensor and technique for using the same
US20070060808A1 (en) 2005-09-12 2007-03-15 Carine Hoarau Medical sensor for reducing motion artifacts and technique for using the same
US7869850B2 (en) 2005-09-29 2011-01-11 Nellcor Puritan Bennett Llc Medical sensor for reducing motion artifacts and technique for using the same
US7904130B2 (en) 2005-09-29 2011-03-08 Nellcor Puritan Bennett Llc Medical sensor and technique for using the same
US7899510B2 (en) 2005-09-29 2011-03-01 Nellcor Puritan Bennett Llc Medical sensor and technique for using the same
US7555327B2 (en) 2005-09-30 2009-06-30 Nellcor Puritan Bennett Llc Folding medical sensor and technique for using the same
US7486979B2 (en) 2005-09-30 2009-02-03 Nellcor Puritan Bennett Llc Optically aligned pulse oximetry sensor and technique for using the same
US7881762B2 (en) 2005-09-30 2011-02-01 Nellcor Puritan Bennett Llc Clip-style medical sensor and technique for using the same
US7483731B2 (en) * 2005-09-30 2009-01-27 Nellcor Puritan Bennett Llc Medical sensor and technique for using the same
US8073518B2 (en) 2006-05-02 2011-12-06 Nellcor Puritan Bennett Llc Clip-style medical sensor and technique for using the same
US7522948B2 (en) 2006-05-02 2009-04-21 Nellcor Puritan Bennett Llc Medical sensor and technique for using the same
US7477924B2 (en) 2006-05-02 2009-01-13 Nellcor Puritan Bennett Llc Medical sensor and technique for using the same
US8145288B2 (en) 2006-08-22 2012-03-27 Nellcor Puritan Bennett Llc Medical sensor for reducing signal artifacts and technique for using the same
US8219170B2 (en) 2006-09-20 2012-07-10 Nellcor Puritan Bennett Llc System and method for practicing spectrophotometry using light emitting nanostructure devices
US8396527B2 (en) 2006-09-22 2013-03-12 Covidien Lp Medical sensor for reducing signal artifacts and technique for using the same
US8190225B2 (en) 2006-09-22 2012-05-29 Nellcor Puritan Bennett Llc Medical sensor for reducing signal artifacts and technique for using the same
US8175671B2 (en) 2006-09-22 2012-05-08 Nellcor Puritan Bennett Llc Medical sensor for reducing signal artifacts and technique for using the same
US7869849B2 (en) 2006-09-26 2011-01-11 Nellcor Puritan Bennett Llc Opaque, electrically nonconductive region on a medical sensor
US7574245B2 (en) 2006-09-27 2009-08-11 Nellcor Puritan Bennett Llc Flexible medical sensor enclosure
US7796403B2 (en) 2006-09-28 2010-09-14 Nellcor Puritan Bennett Llc Means for mechanical registration and mechanical-electrical coupling of a faraday shield to a photodetector and an electrical circuit
US7684842B2 (en) * 2006-09-29 2010-03-23 Nellcor Puritan Bennett Llc System and method for preventing sensor misuse
US8652040B2 (en) 2006-12-19 2014-02-18 Valencell, Inc. Telemetric apparatus for health and environmental monitoring
US8280469B2 (en) 2007-03-09 2012-10-02 Nellcor Puritan Bennett Llc Method for detection of aberrant tissue spectra
US8265724B2 (en) 2007-03-09 2012-09-11 Nellcor Puritan Bennett Llc Cancellation of light shunting
US7894869B2 (en) * 2007-03-09 2011-02-22 Nellcor Puritan Bennett Llc Multiple configuration medical sensor and technique for using the same
US8346328B2 (en) 2007-12-21 2013-01-01 Covidien Lp Medical sensor and technique for using the same
US8352004B2 (en) 2007-12-21 2013-01-08 Covidien Lp Medical sensor and technique for using the same
EP2309829A1 (en) * 2009-09-24 2011-04-13 Harman Becker Automotive Systems GmbH Multilayer circuit board
CN103260360B (zh) * 2012-02-17 2017-07-14 宏达国际电子股份有限公司 线路板及其构造单元与制作工艺
US8921703B2 (en) * 2012-02-17 2014-12-30 Htc Corporation Circuit board, structural unit thereof and manufacturing method thereof
US9872109B2 (en) 2014-12-17 2018-01-16 Knowles Electronics, Llc Shared coil receiver
US20170064830A1 (en) * 2015-08-24 2017-03-02 Motorola Mobility Llc Circuit Assembly for Compact Acoustic Device

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5433000A (en) * 1990-10-01 1995-07-18 Sony Corporation Manufacturing method for a multilayer wiring board
EP0481472A1 (en) * 1990-10-17 1992-04-22 Nec Corporation Multilayer printed wiring board and process for manufacturing the same
WO2011025780A1 (en) * 2009-08-28 2011-03-03 Siemens Medical Instruments Pte. Ltd. Hearing aid device and a method of manufacturing a hearing aid device
WO2011025676A1 (en) * 2009-08-28 2011-03-03 Siemens Medical Instruments Pte. Ltd. Hearing aid device and method of producing a hearing aid device
US8224006B2 (en) 2009-08-28 2012-07-17 Siemens Medical Instruments Pte. Ltd. Hearing aid device and a method of manufacturing a hearing aid device
US8254608B2 (en) 2009-08-28 2012-08-28 Siemens Medical Instruments Pte. Ltd. Hearing aid device and method of producing a hearing aid device
US9271095B2 (en) 2009-08-28 2016-02-23 Sivantos Pte. Ltd. Hearing aid device and a method of manufacturing a hearing aid device
EP3661232A1 (en) * 2018-11-30 2020-06-03 GN Hearing A/S Hearing device with embedded integrated circuit chip
US11252519B2 (en) 2018-11-30 2022-02-15 Gn Hearing A/S Hearing device with embedded integrated circuit chips
US11553288B2 (en) 2018-11-30 2023-01-10 Gn Hearing A/S Hearing device with embedded integrated circuit chips

Also Published As

Publication number Publication date
EP0271692A2 (en) 1988-06-22
US4783815A (en) 1988-11-08
DK599287D0 (da) 1987-11-16
EP0271692A3 (en) 1988-07-06
DK599287A (da) 1988-05-19

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