DK599287A - Fremgangsmaade til fremstilling af en flerlagskredsloebsplade samt en ifoelge fremgangsmaaden fremstillet kredsloebsplade - Google Patents
Fremgangsmaade til fremstilling af en flerlagskredsloebsplade samt en ifoelge fremgangsmaaden fremstillet kredsloebspladeInfo
- Publication number
- DK599287A DK599287A DK599287A DK599287A DK599287A DK 599287 A DK599287 A DK 599287A DK 599287 A DK599287 A DK 599287A DK 599287 A DK599287 A DK 599287A DK 599287 A DK599287 A DK 599287A
- Authority
- DK
- Denmark
- Prior art keywords
- procedure
- circuit
- manufacturing
- circuit plate
- layer circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
- H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
- H04R25/609—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of circuitry
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
- H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
- H04R25/603—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of mechanical or electronic switches or control elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
- H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
- H04R25/607—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of earhooks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/061—Lamination of previously made multilayered subassemblies
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Neurosurgery (AREA)
- Otolaryngology (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19863639402 DE3639402A1 (de) | 1986-11-18 | 1986-11-18 | Verfahren zur herstellung einer mehrschichtigen leiterplatte sowie danach hergestellte leiterplatte |
Publications (2)
Publication Number | Publication Date |
---|---|
DK599287D0 DK599287D0 (da) | 1987-11-16 |
DK599287A true DK599287A (da) | 1988-05-19 |
Family
ID=6314212
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK599287A DK599287A (da) | 1986-11-18 | 1987-11-16 | Fremgangsmaade til fremstilling af en flerlagskredsloebsplade samt en ifoelge fremgangsmaaden fremstillet kredsloebsplade |
Country Status (4)
Country | Link |
---|---|
US (1) | US4783815A (da) |
EP (1) | EP0271692A3 (da) |
DE (1) | DE3639402A1 (da) |
DK (1) | DK599287A (da) |
Families Citing this family (57)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5147210A (en) * | 1988-03-03 | 1992-09-15 | Western Digital Corporation | Polymer film interconnect |
US5069213A (en) * | 1988-04-29 | 1991-12-03 | Thor Technology Corporation | Oximeter sensor assembly with integral cable and encoder |
US5041187A (en) * | 1988-04-29 | 1991-08-20 | Thor Technology Corporation | Oximeter sensor assembly with integral cable and method of forming the same |
US4927983A (en) * | 1988-12-16 | 1990-05-22 | International Business Machines Corporation | Circuit board |
US4933045A (en) * | 1989-06-02 | 1990-06-12 | International Business Machines Corporation | Thin film multilayer laminate interconnection board assembly method |
US5056151A (en) * | 1989-09-19 | 1991-10-08 | Gennum Corporation | Electrical component connection and combinations of electrical components |
GB8928899D0 (en) * | 1989-12-21 | 1990-02-28 | Knowles Electronics Co | Coil assemblies |
DE59105820D1 (de) * | 1990-04-05 | 1995-08-03 | Dyconex Ag | Herstellung von mehrschichtigen Leiterplatten mit erhöhter Leiterbahnendichte. |
JP3226533B2 (ja) * | 1990-10-01 | 2001-11-05 | ソニー株式会社 | 多層配線基板及びその製造方法 |
JP2551224B2 (ja) * | 1990-10-17 | 1996-11-06 | 日本電気株式会社 | 多層配線基板および多層配線基板の製造方法 |
DE59102288D1 (de) * | 1991-12-17 | 1994-08-25 | Siemens Audiologische Technik | Hörhilfegerät. |
US5475606A (en) * | 1993-03-05 | 1995-12-12 | International Business Machines Corporation | Faraday cage for a printed circuit card |
US5876842A (en) * | 1995-06-07 | 1999-03-02 | International Business Machines Corporation | Modular circuit package having vertically aligned power and signal cores |
US6018673A (en) * | 1996-10-10 | 2000-01-25 | Nellcor Puritan Bennett Incorporated | Motion compatible sensor for non-invasive optical blood analysis |
EP0852451A3 (de) * | 1997-01-02 | 2004-05-12 | Siemens Audiologische Technik GmbH | Hörhilfegerät |
DE69942276D1 (de) * | 1998-10-07 | 2010-06-02 | Oticon As | Hinter-dem-ohr hörgerät |
US6771786B1 (en) | 1999-07-28 | 2004-08-03 | Oticon A/S | Hearing aid including an integrated circuit |
US6469256B1 (en) * | 2000-02-01 | 2002-10-22 | International Business Machines Corporation | Structure for high speed printed wiring boards with multiple differential impedance-controlled layers |
DK1532842T3 (da) * | 2002-07-10 | 2013-11-04 | Oticon As | Høreapparat eller lignende audioanordning og fremgangsmåde til fremstilling af et hørreapparat |
US7162288B2 (en) | 2004-02-25 | 2007-01-09 | Nellcor Purtain Bennett Incorporated | Techniques for detecting heart pulses and reducing power consumption in sensors |
US7590439B2 (en) | 2005-08-08 | 2009-09-15 | Nellcor Puritan Bennett Llc | Bi-stable medical sensor and technique for using the same |
US7657294B2 (en) | 2005-08-08 | 2010-02-02 | Nellcor Puritan Bennett Llc | Compliant diaphragm medical sensor and technique for using the same |
US7657295B2 (en) | 2005-08-08 | 2010-02-02 | Nellcor Puritan Bennett Llc | Medical sensor and technique for using the same |
US20070060808A1 (en) * | 2005-09-12 | 2007-03-15 | Carine Hoarau | Medical sensor for reducing motion artifacts and technique for using the same |
US7869850B2 (en) | 2005-09-29 | 2011-01-11 | Nellcor Puritan Bennett Llc | Medical sensor for reducing motion artifacts and technique for using the same |
US7899510B2 (en) | 2005-09-29 | 2011-03-01 | Nellcor Puritan Bennett Llc | Medical sensor and technique for using the same |
US7904130B2 (en) | 2005-09-29 | 2011-03-08 | Nellcor Puritan Bennett Llc | Medical sensor and technique for using the same |
US7555327B2 (en) | 2005-09-30 | 2009-06-30 | Nellcor Puritan Bennett Llc | Folding medical sensor and technique for using the same |
US7483731B2 (en) * | 2005-09-30 | 2009-01-27 | Nellcor Puritan Bennett Llc | Medical sensor and technique for using the same |
US7881762B2 (en) | 2005-09-30 | 2011-02-01 | Nellcor Puritan Bennett Llc | Clip-style medical sensor and technique for using the same |
US7486979B2 (en) | 2005-09-30 | 2009-02-03 | Nellcor Puritan Bennett Llc | Optically aligned pulse oximetry sensor and technique for using the same |
US7477924B2 (en) | 2006-05-02 | 2009-01-13 | Nellcor Puritan Bennett Llc | Medical sensor and technique for using the same |
US7522948B2 (en) | 2006-05-02 | 2009-04-21 | Nellcor Puritan Bennett Llc | Medical sensor and technique for using the same |
US8073518B2 (en) | 2006-05-02 | 2011-12-06 | Nellcor Puritan Bennett Llc | Clip-style medical sensor and technique for using the same |
US8145288B2 (en) | 2006-08-22 | 2012-03-27 | Nellcor Puritan Bennett Llc | Medical sensor for reducing signal artifacts and technique for using the same |
US8219170B2 (en) | 2006-09-20 | 2012-07-10 | Nellcor Puritan Bennett Llc | System and method for practicing spectrophotometry using light emitting nanostructure devices |
US8175671B2 (en) | 2006-09-22 | 2012-05-08 | Nellcor Puritan Bennett Llc | Medical sensor for reducing signal artifacts and technique for using the same |
US8195264B2 (en) | 2006-09-22 | 2012-06-05 | Nellcor Puritan Bennett Llc | Medical sensor for reducing signal artifacts and technique for using the same |
US8396527B2 (en) | 2006-09-22 | 2013-03-12 | Covidien Lp | Medical sensor for reducing signal artifacts and technique for using the same |
US7869849B2 (en) | 2006-09-26 | 2011-01-11 | Nellcor Puritan Bennett Llc | Opaque, electrically nonconductive region on a medical sensor |
US7574245B2 (en) | 2006-09-27 | 2009-08-11 | Nellcor Puritan Bennett Llc | Flexible medical sensor enclosure |
US7796403B2 (en) | 2006-09-28 | 2010-09-14 | Nellcor Puritan Bennett Llc | Means for mechanical registration and mechanical-electrical coupling of a faraday shield to a photodetector and an electrical circuit |
US7684842B2 (en) * | 2006-09-29 | 2010-03-23 | Nellcor Puritan Bennett Llc | System and method for preventing sensor misuse |
US8652040B2 (en) | 2006-12-19 | 2014-02-18 | Valencell, Inc. | Telemetric apparatus for health and environmental monitoring |
US8265724B2 (en) | 2007-03-09 | 2012-09-11 | Nellcor Puritan Bennett Llc | Cancellation of light shunting |
US7894869B2 (en) * | 2007-03-09 | 2011-02-22 | Nellcor Puritan Bennett Llc | Multiple configuration medical sensor and technique for using the same |
US8280469B2 (en) | 2007-03-09 | 2012-10-02 | Nellcor Puritan Bennett Llc | Method for detection of aberrant tissue spectra |
US8352004B2 (en) | 2007-12-21 | 2013-01-08 | Covidien Lp | Medical sensor and technique for using the same |
US8346328B2 (en) | 2007-12-21 | 2013-01-01 | Covidien Lp | Medical sensor and technique for using the same |
US8224006B2 (en) | 2009-08-28 | 2012-07-17 | Siemens Medical Instruments Pte. Ltd. | Hearing aid device and a method of manufacturing a hearing aid device |
US8254608B2 (en) | 2009-08-28 | 2012-08-28 | Siemens Medical Instruments Pte. Ltd. | Hearing aid device and method of producing a hearing aid device |
EP2309829A1 (en) * | 2009-09-24 | 2011-04-13 | Harman Becker Automotive Systems GmbH | Multilayer circuit board |
US8921703B2 (en) * | 2012-02-17 | 2014-12-30 | Htc Corporation | Circuit board, structural unit thereof and manufacturing method thereof |
TWI481322B (zh) * | 2012-02-17 | 2015-04-11 | Htc Corp | 線路板及其構造單元與製程 |
US9872109B2 (en) | 2014-12-17 | 2018-01-16 | Knowles Electronics, Llc | Shared coil receiver |
US20170064830A1 (en) * | 2015-08-24 | 2017-03-02 | Motorola Mobility Llc | Circuit Assembly for Compact Acoustic Device |
EP3661232A1 (en) * | 2018-11-30 | 2020-06-03 | GN Hearing A/S | Hearing device with embedded integrated circuit chip |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1256632A (fr) * | 1960-02-09 | 1961-03-24 | Electronique & Automatisme Sa | Perfectionnements à la réalisation des circuits électriques du genre dit imprimé |
US3219749A (en) * | 1961-04-21 | 1965-11-23 | Litton Systems Inc | Multilayer printed circuit board with solder access apertures |
US3436819A (en) * | 1965-09-22 | 1969-04-08 | Litton Systems Inc | Multilayer laminate |
US3436879A (en) * | 1966-07-13 | 1969-04-08 | Louie C Duke | Drive-in advertiser |
US3471631A (en) * | 1968-04-03 | 1969-10-07 | Us Air Force | Fabrication of microminiature multilayer circuit boards |
US3471348A (en) * | 1968-10-04 | 1969-10-07 | North American Rockwell | Method of making flexible circuit connections to multilayer circuit boards |
US4037047A (en) * | 1974-12-31 | 1977-07-19 | Martin Marietta Corporation | Multilayer circuit board with integral flexible appendages |
DE2724399A1 (de) * | 1977-05-28 | 1978-11-30 | Martin Marietta Corp | Verfahren zur herstellung einer mehrschichtigen gedruckten schaltungsplatte mit integralen, flexiblen anschlusstuecken, sowie nach diesem verfahren gefertigte schaltungsplatte |
JPS60149196A (ja) * | 1984-01-17 | 1985-08-06 | ソニー株式会社 | プリント基板およびその製造方法 |
US4710419A (en) * | 1984-07-16 | 1987-12-01 | Gregory Vernon C | In-mold process for fabrication of molded plastic printed circuit boards |
DE8428488U1 (de) * | 1984-09-27 | 1986-01-23 | Siemens AG, 1000 Berlin und 8000 München | Kleinhörgerät |
EP0183936A1 (de) * | 1984-11-28 | 1986-06-11 | Contraves Ag | Multisubstrat-Schaltungsanordnung und Verfahren zur Herstellung der elektrischer Verbindungen |
US4758586A (en) * | 1985-02-01 | 1988-07-19 | Usv Pharmaceutical Corp. | Indolyl compounds and hyposensitivity use thereof |
-
1986
- 1986-11-18 DE DE19863639402 patent/DE3639402A1/de not_active Withdrawn
-
1987
- 1987-11-04 EP EP87116247A patent/EP0271692A3/en not_active Withdrawn
- 1987-11-12 US US07/119,719 patent/US4783815A/en not_active Expired - Fee Related
- 1987-11-16 DK DK599287A patent/DK599287A/da not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
DE3639402A1 (de) | 1988-05-19 |
EP0271692A2 (en) | 1988-06-22 |
EP0271692A3 (en) | 1988-07-06 |
DK599287D0 (da) | 1987-11-16 |
US4783815A (en) | 1988-11-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AHB | Application shelved due to non-payment |