DE3590792T - - Google Patents

Info

Publication number
DE3590792T
DE3590792T DE19853590792 DE3590792T DE3590792T DE 3590792 T DE3590792 T DE 3590792T DE 19853590792 DE19853590792 DE 19853590792 DE 3590792 T DE3590792 T DE 3590792T DE 3590792 T DE3590792 T DE 3590792T
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19853590792
Other languages
German (de)
Other versions
DE3590792C2 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP60099396A external-priority patent/JPS61256777A/ja
Priority claimed from JP60099395A external-priority patent/JPS61256776A/ja
Priority claimed from JP60110155A external-priority patent/JPS61269386A/ja
Application filed filed Critical
Publication of DE3590792T publication Critical patent/DE3590792T/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N35/00—Magnetostrictive devices
    • H10N35/101—Magnetostrictive devices with mechanical input and electrical output, e.g. generators, sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/07—Hall effect devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/0052—Manufacturing aspects; Manufacturing of single devices, i.e. of semiconductor magnetic sensor chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N35/00—Magnetostrictive devices
    • H10N35/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N35/00—Magnetostrictive devices
    • H10N35/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N52/00—Hall-effect devices
    • H10N52/101—Semiconductor Hall-effect devices
    • H10W72/019—
    • H10W72/90—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/07533—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/5525—
    • H10W72/59—
    • H10W72/884—
    • H10W72/923—
    • H10W72/932—
    • H10W72/952—
    • H10W74/00—
    • H10W90/736—
    • H10W90/754—
    • H10W90/756—

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Hall/Mr Elements (AREA)
DE19853590792 1985-05-10 1985-10-14 Pending DE3590792T (enExample)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP60099396A JPS61256777A (ja) 1985-05-10 1985-05-10 磁電変換素子およびその製造方法
JP60099395A JPS61256776A (ja) 1985-05-10 1985-05-10 磁電変換素子
JP60110155A JPS61269386A (ja) 1985-05-24 1985-05-24 磁電変換素子

Publications (1)

Publication Number Publication Date
DE3590792T true DE3590792T (enExample) 1987-07-16

Family

ID=27308949

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19853590792 Pending DE3590792T (enExample) 1985-05-10 1985-10-14
DE3590792A Expired - Lifetime DE3590792C2 (enExample) 1985-05-10 1985-10-14

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE3590792A Expired - Lifetime DE3590792C2 (enExample) 1985-05-10 1985-10-14

Country Status (5)

Country Link
US (1) US4908685A (enExample)
KR (1) KR910002313B1 (enExample)
DE (2) DE3590792T (enExample)
NL (1) NL188488C (enExample)
WO (1) WO1986006878A1 (enExample)

Families Citing this family (72)

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US6756670B1 (en) * 1988-08-26 2004-06-29 Semiconductor Energy Laboratory Co., Ltd. Electronic device and its manufacturing method
FR2648941B1 (fr) * 1989-06-27 1991-09-06 Thomson Csf Tete de lecture magnetique a effet hall
WO1991014288A1 (en) * 1990-03-07 1991-09-19 Santa Barbara Research Center Magnetoresistor structure and operating method
JP2557998B2 (ja) * 1990-04-04 1996-11-27 旭化成工業株式会社 ＩｎＡｓホール効果素子
US5216405A (en) * 1991-01-14 1993-06-01 General Motors Corporation Package for the magnetic field sensitive device
JPH04360536A (ja) * 1991-06-07 1992-12-14 Sony Corp アルミニウム・ゲルマニウム合金膜のゲルマニウムの除去方法
JPH0737706A (ja) * 1993-07-19 1995-02-07 Murata Mfg Co Ltd 半導体セラミック素子
US6153318A (en) * 1996-04-30 2000-11-28 Rothberg; Gerald M. Layered material having properties that are variable by an applied electric field
JP3031268B2 (ja) * 1996-11-20 2000-04-10 株式会社村田製作所 磁器コンデンサ
US5963028A (en) * 1997-08-19 1999-10-05 Allegro Microsystems, Inc. Package for a magnetic field sensing device
US6391675B1 (en) 1998-11-25 2002-05-21 Raytheon Company Method and apparatus for switching high frequency signals
JP2002026419A (ja) * 2000-07-07 2002-01-25 Sanken Electric Co Ltd 磁電変換装置
JP3678195B2 (ja) * 2001-12-18 2005-08-03 株式会社村田製作所 電子部品の製造方法、及び電子部品
CN100403572C (zh) * 2002-04-19 2008-07-16 旭化成电子材料元件株式会社 磁电变换元件及其制造方法
EP1367644A1 (en) * 2002-05-29 2003-12-03 STMicroelectronics S.r.l. Semiconductor electronic device and method of manufacturing thereof
US20040036171A1 (en) * 2002-08-22 2004-02-26 Farnworth Warren M. Method and apparatus for enabling a stitch wire bond in the absence of discrete bump formation, semiconductor device assemblies and electronic systems including same
CN1754270A (zh) * 2003-02-26 2006-03-29 旭化成电子株式会社 半导体传感器及其制造方法
WO2004105132A1 (en) * 2003-05-20 2004-12-02 Axalto Sa An electrical connection for a microelectronic chip, and a method for manufacturing such a connection
TWI281037B (en) * 2004-03-24 2007-05-11 Yamaha Corp Semiconductor device, magnetic sensor, and magnetic sensor unit
US7459340B2 (en) * 2004-12-14 2008-12-02 Casio Computer Co., Ltd. Semiconductor device and manufacturing method thereof
JPWO2006070826A1 (ja) * 2004-12-28 2008-08-07 旭化成エレクトロニクス株式会社 磁気方式回転角センサ、および、角度情報処理装置
EP2741095B1 (en) * 2006-04-13 2015-08-19 Asahi Kasei EMD Corporation Magnetic sensor and method for fabricating the same
US7816772B2 (en) * 2007-03-29 2010-10-19 Allegro Microsystems, Inc. Methods and apparatus for multi-stage molding of integrated circuit package
US9823090B2 (en) 2014-10-31 2017-11-21 Allegro Microsystems, Llc Magnetic field sensor for sensing a movement of a target object
US8486755B2 (en) * 2008-12-05 2013-07-16 Allegro Microsystems, Llc Magnetic field sensors and methods for fabricating the magnetic field sensors
JP2010141112A (ja) * 2008-12-11 2010-06-24 Sharp Corp 半導体装置および半導体装置の製造方法
US20100188078A1 (en) * 2009-01-28 2010-07-29 Andrea Foletto Magnetic sensor with concentrator for increased sensing range
CN101924046A (zh) * 2009-06-16 2010-12-22 飞思卡尔半导体公司 在半导体器件中形成引线键合的方法
JP5327233B2 (ja) * 2009-07-08 2013-10-30 トヨタ自動車株式会社 半導体装置とその製造方法
JP2013051459A (ja) * 2011-08-30 2013-03-14 Canon Inc 電気機械変換装置及びその製造方法
US8629539B2 (en) 2012-01-16 2014-01-14 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having non-conductive die paddle
US9812588B2 (en) 2012-03-20 2017-11-07 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
US10234513B2 (en) 2012-03-20 2019-03-19 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
US9494660B2 (en) 2012-03-20 2016-11-15 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US9666788B2 (en) 2012-03-20 2017-05-30 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US10215550B2 (en) 2012-05-01 2019-02-26 Allegro Microsystems, Llc Methods and apparatus for magnetic sensors having highly uniform magnetic fields
US9817078B2 (en) 2012-05-10 2017-11-14 Allegro Microsystems Llc Methods and apparatus for magnetic sensor having integrated coil
US10725100B2 (en) 2013-03-15 2020-07-28 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having an externally accessible coil
US9411025B2 (en) 2013-04-26 2016-08-09 Allegro Microsystems, Llc Integrated circuit package having a split lead frame and a magnet
KR101768254B1 (ko) * 2013-06-12 2017-08-16 매그나칩 반도체 유한회사 반도체 기반의 자기 센서 및 그 제조 방법
US10495699B2 (en) 2013-07-19 2019-12-03 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having an integrated coil or magnet to detect a non-ferromagnetic target
US9810519B2 (en) 2013-07-19 2017-11-07 Allegro Microsystems, Llc Arrangements for magnetic field sensors that act as tooth detectors
US10145908B2 (en) 2013-07-19 2018-12-04 Allegro Microsystems, Llc Method and apparatus for magnetic sensor producing a changing magnetic field
KR102116147B1 (ko) * 2014-03-06 2020-05-28 매그나칩 반도체 유한회사 매립형 마그네틱 센서
US9720054B2 (en) 2014-10-31 2017-08-01 Allegro Microsystems, Llc Magnetic field sensor and electronic circuit that pass amplifier current through a magnetoresistance element
US10712403B2 (en) 2014-10-31 2020-07-14 Allegro Microsystems, Llc Magnetic field sensor and electronic circuit that pass amplifier current through a magnetoresistance element
US9823092B2 (en) 2014-10-31 2017-11-21 Allegro Microsystems, Llc Magnetic field sensor providing a movement detector
US9719806B2 (en) 2014-10-31 2017-08-01 Allegro Microsystems, Llc Magnetic field sensor for sensing a movement of a ferromagnetic target object
GB2535683A (en) * 2014-11-03 2016-08-31 Melexis Technologies Nv Magnetic field sensor and method for making same
US11067643B2 (en) 2014-11-03 2021-07-20 Melexis Technologies Nv Magnetic field sensor and method for making same
US10012518B2 (en) 2016-06-08 2018-07-03 Allegro Microsystems, Llc Magnetic field sensor for sensing a proximity of an object
US10041810B2 (en) 2016-06-08 2018-08-07 Allegro Microsystems, Llc Arrangements for magnetic field sensors that act as movement detectors
US10260905B2 (en) 2016-06-08 2019-04-16 Allegro Microsystems, Llc Arrangements for magnetic field sensors to cancel offset variations
US11428755B2 (en) 2017-05-26 2022-08-30 Allegro Microsystems, Llc Coil actuated sensor with sensitivity detection
US10641842B2 (en) 2017-05-26 2020-05-05 Allegro Microsystems, Llc Targets for coil actuated position sensors
US10324141B2 (en) 2017-05-26 2019-06-18 Allegro Microsystems, Llc Packages for coil actuated position sensors
US10837943B2 (en) 2017-05-26 2020-11-17 Allegro Microsystems, Llc Magnetic field sensor with error calculation
US10996289B2 (en) 2017-05-26 2021-05-04 Allegro Microsystems, Llc Coil actuated position sensor with reflected magnetic field
US10310028B2 (en) 2017-05-26 2019-06-04 Allegro Microsystems, Llc Coil actuated pressure sensor
US10866117B2 (en) 2018-03-01 2020-12-15 Allegro Microsystems, Llc Magnetic field influence during rotation movement of magnetic target
US11255700B2 (en) 2018-08-06 2022-02-22 Allegro Microsystems, Llc Magnetic field sensor
US10921391B2 (en) 2018-08-06 2021-02-16 Allegro Microsystems, Llc Magnetic field sensor with spacer
US10823586B2 (en) 2018-12-26 2020-11-03 Allegro Microsystems, Llc Magnetic field sensor having unequally spaced magnetic field sensing elements
US11061084B2 (en) 2019-03-07 2021-07-13 Allegro Microsystems, Llc Coil actuated pressure sensor and deflectable substrate
US10955306B2 (en) 2019-04-22 2021-03-23 Allegro Microsystems, Llc Coil actuated pressure sensor and deformable substrate
US10991644B2 (en) 2019-08-22 2021-04-27 Allegro Microsystems, Llc Integrated circuit package having a low profile
US11237020B2 (en) 2019-11-14 2022-02-01 Allegro Microsystems, Llc Magnetic field sensor having two rows of magnetic field sensing elements for measuring an angle of rotation of a magnet
US11280637B2 (en) 2019-11-14 2022-03-22 Allegro Microsystems, Llc High performance magnetic angle sensor
US11262422B2 (en) 2020-05-08 2022-03-01 Allegro Microsystems, Llc Stray-field-immune coil-activated position sensor
US11493361B2 (en) 2021-02-26 2022-11-08 Allegro Microsystems, Llc Stray field immune coil-activated sensor
US11578997B1 (en) 2021-08-24 2023-02-14 Allegro Microsystems, Llc Angle sensor using eddy currents
US12523717B2 (en) 2024-02-15 2026-01-13 Allegro Microsystems, Llc Closed loop magnetic field sensor with current control

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JPS50126389A (enExample) * 1974-03-25 1975-10-04
US3964666A (en) * 1975-03-31 1976-06-22 Western Electric Company, Inc. Bonding contact members to circuit boards
US4000842A (en) * 1975-06-02 1977-01-04 National Semiconductor Corporation Copper-to-gold thermal compression gang bonding of interconnect leads to semiconductive devices
JPS51147191A (en) * 1975-06-12 1976-12-17 Asahi Chem Ind Co Ltd Hall element and its method of manufacturing
US4296424A (en) * 1978-03-27 1981-10-20 Asahi Kasei Kogyo Kabushiki Kaisha Compound semiconductor device having a semiconductor-converted conductive region
US4609936A (en) * 1979-09-19 1986-09-02 Motorola, Inc. Semiconductor chip with direct-bonded external leadframe

Also Published As

Publication number Publication date
US4908685A (en) 1990-03-13
NL188488C (nl) 1992-07-01
NL8520325A (nl) 1987-04-01
KR910002313B1 (ko) 1991-04-11
DE3590792C2 (enExample) 1991-05-23
WO1986006878A1 (fr) 1986-11-20
KR870700275A (ko) 1987-08-20
NL188488B (nl) 1992-02-03

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