DE3588111D1 - Kunststoffzusammensetzung für Lötschutztinte - Google Patents

Kunststoffzusammensetzung für Lötschutztinte

Info

Publication number
DE3588111D1
DE3588111D1 DE3588111T DE3588111T DE3588111D1 DE 3588111 D1 DE3588111 D1 DE 3588111D1 DE 3588111 T DE3588111 T DE 3588111T DE 3588111 T DE3588111 T DE 3588111T DE 3588111 D1 DE3588111 D1 DE 3588111D1
Authority
DE
Germany
Prior art keywords
plastic composition
protection ink
solder protection
solder
ink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3588111T
Other languages
English (en)
Other versions
DE3588111T2 (de
Inventor
Sato Yoneji
Hoshino Masato
Kitazawa Seiichi
Yasuda Tadashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Research Laboratory Co Ltd
DIC Corp
Original Assignee
Asahi Chemical Research Laboratory Co Ltd
Dainippon Ink and Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP14326985A external-priority patent/JPS624391A/ja
Priority claimed from JP60143268A external-priority patent/JPH0689284B2/ja
Priority claimed from JP14577985A external-priority patent/JPH0689285B2/ja
Priority claimed from JP14577885A external-priority patent/JPS627773A/ja
Application filed by Asahi Chemical Research Laboratory Co Ltd, Dainippon Ink and Chemicals Co Ltd filed Critical Asahi Chemical Research Laboratory Co Ltd
Publication of DE3588111D1 publication Critical patent/DE3588111D1/de
Application granted granted Critical
Publication of DE3588111T2 publication Critical patent/DE3588111T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/224—Anti-weld compositions; Braze stop-off compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Resins (AREA)
DE3588111T 1985-06-29 1985-09-06 Kunststoffzusammensetzung für Lötschutztinte Expired - Fee Related DE3588111T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP14326985A JPS624391A (ja) 1985-06-29 1985-06-29 ソルダ−レジストインキ用樹脂組成物
JP60143268A JPH0689284B2 (ja) 1985-06-29 1985-06-29 ソルダ−レジストインキ用硬化性樹脂組成物
JP14577985A JPH0689285B2 (ja) 1985-07-04 1985-07-04 ソルダ−レジストインキ用硬化性樹脂組成物
JP14577885A JPS627773A (ja) 1985-07-04 1985-07-04 ソルダ−レジストインキ用樹脂組成物

Publications (2)

Publication Number Publication Date
DE3588111D1 true DE3588111D1 (de) 1996-07-25
DE3588111T2 DE3588111T2 (de) 1996-10-31

Family

ID=27472510

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3588111T Expired - Fee Related DE3588111T2 (de) 1985-06-29 1985-09-06 Kunststoffzusammensetzung für Lötschutztinte

Country Status (3)

Country Link
US (1) US4888269A (de)
EP (1) EP0207188B1 (de)
DE (1) DE3588111T2 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0639518B2 (ja) * 1986-04-28 1994-05-25 東京応化工業株式会社 耐熱性感光性樹脂組成物
JPS63258975A (ja) * 1986-12-26 1988-10-26 Toshiba Corp ソルダーレジストインキ組成物
JP2604173B2 (ja) * 1987-02-25 1997-04-30 東京応化工業株式会社 耐熱性感光性樹脂組成物
EP0801253A3 (de) * 1987-05-22 1998-03-04 Kabushiki Kaisha Komatsu Seisakusho Einrichtung zur Steuerung einer Überbrückungskupplung
US5215863A (en) * 1987-12-18 1993-06-01 Nippon Kayaku Kabushiki Kaisha Resin composition and solder resist composition
JPH01161038A (ja) * 1987-12-18 1989-06-23 Nippon Kayaku Co Ltd 樹脂組成物及びソルダーレジスト樹脂組成物
JP2573661B2 (ja) * 1988-07-09 1997-01-22 キヤノン株式会社 感光感熱型接着剤
US5043184A (en) * 1989-02-06 1991-08-27 Somar Corporation Method of forming electrically conducting layer
GB8927786D0 (en) * 1989-12-08 1990-02-14 Coates Brothers Plc Curable materials
AU649695B2 (en) * 1990-08-02 1994-06-02 Ppg Industries Ohio, Inc. Photoimageable electrodepositable photoresist composition
US5268256A (en) * 1990-08-02 1993-12-07 Ppg Industries, Inc. Photoimageable electrodepositable photoresist composition for producing non-tacky films
US6329475B1 (en) * 1992-08-12 2001-12-11 The Dow Chemical Company Curable epoxy vinylester composition having a low peak exotherm during cure
KR0126118B1 (ko) * 1992-09-10 1997-12-18 다나카 쇼소 솔더레지스트용 잉크조성물
US5854313A (en) * 1994-09-28 1998-12-29 Takeda Chemical Industries, Ltd. Fine particles of high heat resistant polymer and epoxy esters
EP0827517B2 (de) * 1995-03-16 2006-03-01 Ashland Inc. Vinylesterharze mit niedrigem epoxywert enthaltend einen kupfersalzinhibitor
EP1796446B1 (de) * 1996-11-20 2011-05-11 Ibiden Co., Ltd. Leiterplatten
JP3489369B2 (ja) * 1997-01-31 2004-01-19 松下電器産業株式会社 ゴキブリ忌避剤含有電子部品材料を用いた電子部品
JP4081217B2 (ja) * 1999-03-17 2008-04-23 互応化学工業株式会社 紫外線硬化性樹脂組成物、フォトソルダーレジストインク、予備乾燥被膜、基板及びプリント配線板
US7794918B2 (en) 2005-12-28 2010-09-14 Fujifilm Corporation Ink composition, inkjet recording method, printed material, method for producing planographic printing plate, and planographic printing plate
WO2009096438A1 (ja) * 2008-01-30 2009-08-06 Mitsubishi Paper Mills Limited 導電パターンの作製方法
BR112013016006A2 (pt) * 2010-12-21 2018-07-10 Elantas Gmbh composições de resina epóxi contendo grupos epóxi e grupos viniléster
DE102011017708A1 (de) 2011-04-28 2012-10-31 Elantas Gmbh Harz-Zusammensetzung enthaltend Sorbinsäureester
EP2764063B1 (de) 2011-10-09 2018-01-24 HP Scitex Ltd Lichthärtbare tintenzusammensetzung
US8703385B2 (en) 2012-02-10 2014-04-22 3M Innovative Properties Company Photoresist composition
US8715904B2 (en) 2012-04-27 2014-05-06 3M Innovative Properties Company Photocurable composition
EP2666832B1 (de) 2012-05-22 2018-10-10 HP Scitex Ltd Lichthärtbare Tintenzusammensetzung
EP2883109A1 (de) 2012-08-09 2015-06-17 3M Innovative Properties Company Lichthärtbare zusammensetzungen
US8883402B2 (en) 2012-08-09 2014-11-11 3M Innovative Properties Company Photocurable compositions
US10080287B2 (en) * 2012-09-27 2018-09-18 Dell Products L.P. Blind via printed circuit board fabrication supporting press fit connectors

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3551246A (en) * 1967-07-10 1970-12-29 Sun Chemical Corp Radiation curable compositions
BE793732A (fr) * 1972-01-10 1973-05-02 Grace W R & Co Composition contenant un polyene et un polythiol
DE2406400B2 (de) * 1973-02-14 1977-04-28 Hitachi Chemical Co., Ltd., Tokio Lichtempfindliche harzzusammensetzungen auf der basis von verbindungen mit epoxy- bzw. photopolymerisierbaren acrylgruppen
US3932401A (en) * 1974-01-31 1976-01-13 Minnesota Mining And Manufacturing Company Mixed acrylic acid/methacrylic acid esters of tris (hydroxyalkyl) isocyanurates
US4169732A (en) * 1978-01-09 1979-10-02 International Business Machines Corporation Photosensitive coating composition and use thereof
GB2032939B (en) * 1978-11-01 1982-11-17 Coates Brothers & Co Coating compositions
US4237216A (en) * 1978-12-08 1980-12-02 International Business Machines Corporation Photosensitive patternable coating composition containing novolak type materials
US4390615A (en) * 1979-11-05 1983-06-28 Courtney Robert W Coating compositions
EP0075537B2 (de) * 1981-09-17 1991-03-20 Ciba-Geigy Ag Verfahren zum Beschichten gedruckter Schaltungen
JPS58204008A (ja) * 1982-05-24 1983-11-28 Hitachi Ltd 感光性樹脂組成物
US4510593A (en) * 1982-10-18 1985-04-09 Minnesota Mining And Manufacturing Company Information disk of grooved, metal-coated crosslinked polymeric layer
US4479983A (en) * 1983-01-07 1984-10-30 International Business Machines Corporation Method and composition for applying coatings on printed circuit boards
JPS59204837A (ja) * 1983-05-09 1984-11-20 Asahi Chem Ind Co Ltd 光重合性積層体及びそれを用いたレジスト像形成方法
KR860001555B1 (ko) * 1983-10-14 1986-10-04 가부시기가이샤 히다찌세이사꾸쇼 에폭시 수지 조성물
JPS60175044A (ja) * 1984-02-20 1985-09-09 Toyobo Co Ltd リスフィルム用感光性組成物

Also Published As

Publication number Publication date
EP0207188A2 (de) 1987-01-07
EP0207188B1 (de) 1996-06-19
US4888269A (en) 1989-12-19
DE3588111T2 (de) 1996-10-31
EP0207188A3 (en) 1988-08-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee