DE3576737D1 - Verfahren zum beobachten eines objektes in einem schmalen spalt und geraet dafuer. - Google Patents

Verfahren zum beobachten eines objektes in einem schmalen spalt und geraet dafuer.

Info

Publication number
DE3576737D1
DE3576737D1 DE8585303515T DE3576737T DE3576737D1 DE 3576737 D1 DE3576737 D1 DE 3576737D1 DE 8585303515 T DE8585303515 T DE 8585303515T DE 3576737 T DE3576737 T DE 3576737T DE 3576737 D1 DE3576737 D1 DE 3576737D1
Authority
DE
Germany
Prior art keywords
observing
narrow gap
device therefor
therefor
narrow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8585303515T
Other languages
English (en)
Inventor
Moritoshi C O Fujitsu Lim Ando
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE3576737D1 publication Critical patent/DE3576737D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8803—Visual inspection
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/0004—Microscopes specially adapted for specific applications
    • G02B21/0016—Technical microscopes, e.g. for inspection or measuring in industrial production processes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Optics & Photonics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE8585303515T 1984-05-22 1985-05-20 Verfahren zum beobachten eines objektes in einem schmalen spalt und geraet dafuer. Expired - Fee Related DE3576737D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59104249A JPS60247106A (ja) 1984-05-22 1984-05-22 形状検査装置

Publications (1)

Publication Number Publication Date
DE3576737D1 true DE3576737D1 (de) 1990-04-26

Family

ID=14375660

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585303515T Expired - Fee Related DE3576737D1 (de) 1984-05-22 1985-05-20 Verfahren zum beobachten eines objektes in einem schmalen spalt und geraet dafuer.

Country Status (5)

Country Link
US (1) US4686565A (de)
EP (1) EP0162683B1 (de)
JP (1) JPS60247106A (de)
KR (1) KR900000653B1 (de)
DE (1) DE3576737D1 (de)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4788564A (en) * 1986-07-10 1988-11-29 Canon Kabushiki Kaisha Board recording apparatus with reduced smudge
JPH077446B2 (ja) * 1986-11-12 1995-01-30 松下電器産業株式会社 部品認識方法
US4862510A (en) * 1987-03-24 1989-08-29 Emhart Industries, Inc. Lead sense system for component insertion machine
JPH0814546B2 (ja) * 1987-05-07 1996-02-14 富士通株式会社 光学式形状検査装置
US4795237A (en) * 1987-05-26 1989-01-03 Paul Stuart Kempf Optical inspection method with side-viewing mirror
US4924304A (en) * 1987-11-02 1990-05-08 Mpm Corporation Video probe aligning of object to be acted upon
US4815204A (en) * 1988-05-02 1989-03-28 Emhart Industries, Inc. Electronic component insertion machine
US4854039A (en) * 1988-05-04 1989-08-08 The Technology Congress, Ltd. Prototype circuit board and method of testing
JP2577805B2 (ja) * 1989-12-27 1997-02-05 株式会社日立製作所 はんだ付部検査方法とその装置並びに電子部品実装状態検査方法
JPH03203399A (ja) * 1989-12-29 1991-09-05 Matsushita Electric Ind Co Ltd 部品装着装置
US5298989A (en) * 1990-03-12 1994-03-29 Fujitsu Limited Method of and apparatus for multi-image inspection of bonding wire
US5060063A (en) * 1990-07-30 1991-10-22 Mpm Corporation Viewing and illuminating video probe with viewing means for simultaneously viewing object and device images along viewing axis and translating them along optical axis
US5245421A (en) * 1990-09-19 1993-09-14 Control Automation, Incorporated Apparatus for inspecting printed circuit boards with surface mounted components
US5152055A (en) * 1991-04-26 1992-10-06 At&T Bell Laboratories Article alignment method
JP2563659Y2 (ja) * 1991-05-23 1998-02-25 株式会社電子技研 半田付け検査用治具
JPH06300697A (ja) * 1992-04-28 1994-10-28 Texas Instr Inc <Ti> 非改質性検査プラテン
US6011586A (en) * 1996-12-04 2000-01-04 Cognex Corporation Low-profile image formation apparatus
JPH10293158A (ja) * 1997-04-18 1998-11-04 Advantest Corp Ｉｃ試験装置
US5956134A (en) * 1997-07-11 1999-09-21 Semiconductor Technologies & Instruments, Inc. Inspection system and method for leads of semiconductor devices
US6055055A (en) * 1997-12-01 2000-04-25 Hewlett-Packard Company Cross optical axis inspection system for integrated circuits
US6072898A (en) 1998-01-16 2000-06-06 Beaty; Elwin M. Method and apparatus for three dimensional inspection of electronic components
US6144762A (en) * 1998-02-23 2000-11-07 Olympus America Inc. Stereo video microscope
SG84530A1 (en) * 1998-05-21 2001-11-20 Agilent Technologies Inc Cross optical axis inspection system for integrated circuits
US6043876A (en) * 1998-10-08 2000-03-28 Lucent Technologies, Inc. Method and apparatus for detecting a solder bridge in a ball grid array
DE19847913B4 (de) * 1998-10-19 2005-09-22 Ersa Gmbh Vorrichtung und Verfahren zur optischen Inspektion insbesondere verdeckter Lötverbindungen
US20030021886A1 (en) * 2000-02-23 2003-01-30 Baele Stephen James Method of printing and printing machine
EP1220596A1 (de) * 2000-12-29 2002-07-03 Icos Vision Systems N.V. Verfahren und Einrichtung zur Lageerfassung der Anschlusskontakte elektronischer Bauelemente
KR100395426B1 (ko) * 2001-06-25 2003-08-21 에이티아이 주식회사 2개의 보트를 이용한 아이씨용 피씨비 형상결함 검사장치
US6788406B2 (en) * 2001-11-02 2004-09-07 Delaware Capital Formation, Inc. Device and methods of inspecting soldered connections
US7110115B2 (en) * 2003-06-30 2006-09-19 Motorola, Inc. Method and arrangement for aligning an optical component on a printed wiring board
US7643136B2 (en) * 2006-02-02 2010-01-05 Optilia Instrument Ab Device for inspection of narrow spaces and objects in narrow spaces
KR101925541B1 (ko) * 2012-08-06 2018-12-06 삼성디스플레이 주식회사 구동 ｉｃ실장 장치 및 구동 ｉｃ 실장 방법
TWI493201B (zh) 2012-11-09 2015-07-21 Ind Tech Res Inst 電子零件腳位判斷與插件之方法與系統
JP6242078B2 (ja) * 2013-05-20 2017-12-06 オリンパス株式会社 半導体装置、および半導体装置の位置決め装置
GB2519991B (en) * 2013-11-04 2016-10-12 Dave Hall Entpr Ltd Optical inspection of soldered components
CN104267037A (zh) * 2014-10-16 2015-01-07 北京星航机电装备有限公司 钎焊金属蜂窝结构面芯脱焊缺陷体视光学显微检测方法
CN106289855A (zh) * 2016-08-26 2017-01-04 北京星航机电装备有限公司 钎焊金属蜂窝结构焊接质量金相检测方法
CN110174406B (zh) * 2019-05-15 2021-05-14 山西大学 一种太阳能电池片图像采集结构
CN113029079A (zh) * 2021-02-04 2021-06-25 深圳市金致卓科技有限公司 一种pcb板的钻孔深度检测装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL260910A (de) * 1960-02-06
FR2238166B1 (de) * 1973-07-17 1977-12-23 Sopelem
US4028728A (en) * 1976-04-02 1977-06-07 Western Electric Company, Inc. Method of and video system for identifying different light-reflective surface areas on articles
US4268169A (en) * 1979-04-16 1981-05-19 Charles Stenning Flaw detection probe for cylindrical bores
US4389669A (en) * 1981-02-27 1983-06-21 Ilc Data Device Corporation Opto-video inspection system
US4473842A (en) * 1981-07-06 1984-09-25 Tokyo Shibaura Denki Kabushiki Kaisha Apparatus and method for examining printed circuit board provided with electronic parts

Also Published As

Publication number Publication date
EP0162683A3 (en) 1987-12-09
JPS60247106A (ja) 1985-12-06
KR850008404A (ko) 1985-12-16
EP0162683B1 (de) 1990-03-21
US4686565A (en) 1987-08-11
KR900000653B1 (en) 1990-02-02
EP0162683A2 (de) 1985-11-27
JPH0310041B2 (de) 1991-02-12

Similar Documents

Publication Publication Date Title
DE3576737D1 (de) Verfahren zum beobachten eines objektes in einem schmalen spalt und geraet dafuer.
AT381682B (de) Verfahren und vorrichtung zum spleissen einer materialbahn
DE3881808D1 (de) Verfahren zum messen eines walzenprofiles und vorrichtung dafuer.
DE3484692D1 (de) Verfahren zur detektion von spannungen und fehlern in einem metallteil.
DE3381655D1 (de) Verfahren und einrichtung zum aufbereiten eines rasteranzeigegeraetes.
AT387359B (de) Verfahren und vorrichtung zum aufbauen eines luftreifens
DE3530057A1 (de) Verfahren und vorrichtung zum transport eines gegenstandes
AT379253B (de) Verfahren und vorrichtung zum eluieren und dosieren eines radioaktiven nukleids
DE3680418D1 (de) Verfahren und vorrichtung zum sandstrahlen eines werkstueckes.
DE3676651D1 (de) Verfahren und vorrichtung zum ermitteln der abmessungen eines laenglichen pruefobjektes.
ATA539881A (de) Verfahren und vorrichtung zum spleissen von zwei fadenenden
AT380648B (de) Verfahren und vorrichtung zum auftragen fliessfaehiger medien
DE3879609D1 (de) Verfahren und vorrichtung zum erkennen von kennzeichnenden unterschieden in einem blattmaterial.
DE3776222D1 (de) Verfahren und vorrichtung zum nachweis eines gegebenen teilchenmaterials.
DE3682535D1 (de) Verfahren und vorrichtung zum messen feiner schwebeteilchen.
DE69019012D1 (de) Verfahren und Vorrichtung zum Stationsadressentest in einem Netzwerk.
DE3579606D1 (de) Verfahren und vorrichtung zum trocknen eines fluessigen materials.
DE3578922D1 (de) Verfahren und vorrichtung zum aufweiten eines rohres.
DE69015735D1 (de) Verfahren und Vorrichtung zum Messen von schmalen Spalten.
DE69121985D1 (de) Verfahren und Vorrichtung zum Messen oder Ausführen von Arbeiten in einem Bohrloch
DE3382336D1 (de) Verfahren und vorrichtung zum messen des gehaltes an substanzen in einem stroemenden medium.
AT386142B (de) Verfahren und vorrichtung zum anbringen eines kennzeichens an einem stahlprodukt
ATA62483A (de) Verfahren und vorrichtung zum extrudieren eines bandprofils
DE3863525D1 (de) Verfahren und vorrichtung zum verpacken eines gegenstandes.
DE3672704D1 (de) Verfahren und einrichtung zum ermitteln eines winkels in einem grossen bereich.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee