GB2519991B - Optical inspection of soldered components - Google Patents

Optical inspection of soldered components

Info

Publication number
GB2519991B
GB2519991B GB1319453.5A GB201319453A GB2519991B GB 2519991 B GB2519991 B GB 2519991B GB 201319453 A GB201319453 A GB 201319453A GB 2519991 B GB2519991 B GB 2519991B
Authority
GB
United Kingdom
Prior art keywords
optical inspection
soldered components
soldered
components
inspection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB1319453.5A
Other versions
GB201319453D0 (en
GB2519991A (en
Inventor
Hall David
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DAVE HALL ENTPR Ltd
Original Assignee
DAVE HALL ENTPR Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DAVE HALL ENTPR Ltd filed Critical DAVE HALL ENTPR Ltd
Priority to GB1319453.5A priority Critical patent/GB2519991B/en
Publication of GB201319453D0 publication Critical patent/GB201319453D0/en
Publication of GB2519991A publication Critical patent/GB2519991A/en
Application granted granted Critical
Publication of GB2519991B publication Critical patent/GB2519991B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0817—Monitoring of soldering processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/168—Wrong mounting prevention
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Landscapes

  • Engineering & Computer Science (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Immunology (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
GB1319453.5A 2013-11-04 2013-11-04 Optical inspection of soldered components Expired - Fee Related GB2519991B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1319453.5A GB2519991B (en) 2013-11-04 2013-11-04 Optical inspection of soldered components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1319453.5A GB2519991B (en) 2013-11-04 2013-11-04 Optical inspection of soldered components

Publications (3)

Publication Number Publication Date
GB201319453D0 GB201319453D0 (en) 2013-12-18
GB2519991A GB2519991A (en) 2015-05-13
GB2519991B true GB2519991B (en) 2016-10-12

Family

ID=49767631

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1319453.5A Expired - Fee Related GB2519991B (en) 2013-11-04 2013-11-04 Optical inspection of soldered components

Country Status (1)

Country Link
GB (1) GB2519991B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105081497A (en) * 2015-07-17 2015-11-25 伟创力电子技术(苏州)有限公司 Preparation method for producing BGA plant balls in batches on basis of SMT process
CN108088847A (en) * 2017-12-13 2018-05-29 天津津航计算技术研究所 A kind of device for fast detecting of bga chip welding quality

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0162683A2 (en) * 1984-05-22 1985-11-27 Fujitsu Limited A method for observing an object in a small gap and an apparatus for the same
JPH03199947A (en) * 1989-12-27 1991-08-30 Hitachi Ltd Inspection of soldered part and apparatus therefor, and inspection of electronic component mounting state
JPH03273139A (en) * 1990-03-23 1991-12-04 Matsushita Electric Ind Co Ltd Inspection device for mounted board
JPH0447255A (en) * 1990-06-15 1992-02-17 Hitachi Ltd Inspecting apparatus for minute connection of electronic component
JPH05206239A (en) * 1992-01-23 1993-08-13 Sony Corp Visual inspection system
DE10244054A1 (en) * 2002-09-21 2003-10-09 Eads Deutschland Gmbh Device for optical inspection of hidden soldered joints between an electric/electronic component on a board's surface and the board itself has devices for illuminating, deviation and image capture.

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0162683A2 (en) * 1984-05-22 1985-11-27 Fujitsu Limited A method for observing an object in a small gap and an apparatus for the same
JPH03199947A (en) * 1989-12-27 1991-08-30 Hitachi Ltd Inspection of soldered part and apparatus therefor, and inspection of electronic component mounting state
JPH03273139A (en) * 1990-03-23 1991-12-04 Matsushita Electric Ind Co Ltd Inspection device for mounted board
JPH0447255A (en) * 1990-06-15 1992-02-17 Hitachi Ltd Inspecting apparatus for minute connection of electronic component
JPH05206239A (en) * 1992-01-23 1993-08-13 Sony Corp Visual inspection system
DE10244054A1 (en) * 2002-09-21 2003-10-09 Eads Deutschland Gmbh Device for optical inspection of hidden soldered joints between an electric/electronic component on a board's surface and the board itself has devices for illuminating, deviation and image capture.

Also Published As

Publication number Publication date
GB201319453D0 (en) 2013-12-18
GB2519991A (en) 2015-05-13

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20201104