GB2519991B - Optical inspection of soldered components - Google Patents
Optical inspection of soldered componentsInfo
- Publication number
- GB2519991B GB2519991B GB1319453.5A GB201319453A GB2519991B GB 2519991 B GB2519991 B GB 2519991B GB 201319453 A GB201319453 A GB 201319453A GB 2519991 B GB2519991 B GB 2519991B
- Authority
- GB
- United Kingdom
- Prior art keywords
- optical inspection
- soldered components
- soldered
- components
- inspection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0817—Monitoring of soldering processes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/168—Wrong mounting prevention
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
Landscapes
- Engineering & Computer Science (AREA)
- Biochemistry (AREA)
- Analytical Chemistry (AREA)
- Pathology (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Immunology (AREA)
- General Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1319453.5A GB2519991B (en) | 2013-11-04 | 2013-11-04 | Optical inspection of soldered components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1319453.5A GB2519991B (en) | 2013-11-04 | 2013-11-04 | Optical inspection of soldered components |
Publications (3)
Publication Number | Publication Date |
---|---|
GB201319453D0 GB201319453D0 (en) | 2013-12-18 |
GB2519991A GB2519991A (en) | 2015-05-13 |
GB2519991B true GB2519991B (en) | 2016-10-12 |
Family
ID=49767631
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1319453.5A Expired - Fee Related GB2519991B (en) | 2013-11-04 | 2013-11-04 | Optical inspection of soldered components |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2519991B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105081497A (en) * | 2015-07-17 | 2015-11-25 | 伟创力电子技术(苏州)有限公司 | Preparation method for producing BGA plant balls in batches on basis of SMT process |
CN108088847A (en) * | 2017-12-13 | 2018-05-29 | 天津津航计算技术研究所 | A kind of device for fast detecting of bga chip welding quality |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0162683A2 (en) * | 1984-05-22 | 1985-11-27 | Fujitsu Limited | A method for observing an object in a small gap and an apparatus for the same |
JPH03199947A (en) * | 1989-12-27 | 1991-08-30 | Hitachi Ltd | Inspection of soldered part and apparatus therefor, and inspection of electronic component mounting state |
JPH03273139A (en) * | 1990-03-23 | 1991-12-04 | Matsushita Electric Ind Co Ltd | Inspection device for mounted board |
JPH0447255A (en) * | 1990-06-15 | 1992-02-17 | Hitachi Ltd | Inspecting apparatus for minute connection of electronic component |
JPH05206239A (en) * | 1992-01-23 | 1993-08-13 | Sony Corp | Visual inspection system |
DE10244054A1 (en) * | 2002-09-21 | 2003-10-09 | Eads Deutschland Gmbh | Device for optical inspection of hidden soldered joints between an electric/electronic component on a board's surface and the board itself has devices for illuminating, deviation and image capture. |
-
2013
- 2013-11-04 GB GB1319453.5A patent/GB2519991B/en not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0162683A2 (en) * | 1984-05-22 | 1985-11-27 | Fujitsu Limited | A method for observing an object in a small gap and an apparatus for the same |
JPH03199947A (en) * | 1989-12-27 | 1991-08-30 | Hitachi Ltd | Inspection of soldered part and apparatus therefor, and inspection of electronic component mounting state |
JPH03273139A (en) * | 1990-03-23 | 1991-12-04 | Matsushita Electric Ind Co Ltd | Inspection device for mounted board |
JPH0447255A (en) * | 1990-06-15 | 1992-02-17 | Hitachi Ltd | Inspecting apparatus for minute connection of electronic component |
JPH05206239A (en) * | 1992-01-23 | 1993-08-13 | Sony Corp | Visual inspection system |
DE10244054A1 (en) * | 2002-09-21 | 2003-10-09 | Eads Deutschland Gmbh | Device for optical inspection of hidden soldered joints between an electric/electronic component on a board's surface and the board itself has devices for illuminating, deviation and image capture. |
Also Published As
Publication number | Publication date |
---|---|
GB201319453D0 (en) | 2013-12-18 |
GB2519991A (en) | 2015-05-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20201104 |