JPH03273139A - Inspection device for mounted board - Google Patents

Abstract

PURPOSE:To recognize a connection state even when electronic components are superposed on the board by providing an inspection base where the board having electronic components mounted is placed, a lighting device which lights the board form beside and above, and a camera. CONSTITUTION:This device consists of the inspection base 3 where the board 2 which has the electronic components 1 mounted is placed, the side lighting device 4 and upper lighting device 5 which lights the board 2 and electronic components 1 form above, and an image pickup device 6 and a display part 8 which are positioned on the opposite side from the side lighting device 4 across the board 2. Then the electronic components 1 and board 2 are lighted from beside and above and the image pickup device 6 which is installed on the other side picks up their image. In addition to the sideward lighting, they are lighted from above, so shadows except shadows of the electronic components 1 are eliminated and the shadows of the electronic components 1 can accurately by recognized. Consequently, even when the electronic components mount on the mount board are superposed on the optical axis, an the connection state of the electronic components and board 2 can be image-picked up clearly.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a mounting board inspection device for inspecting the bonding state between an electronic component and its mounting board.

BACKGROUND OF THE INVENTION Conventionally, a mounting board inspection device for inspecting the bonding state between an electronic component and its mounting board has a test stand 1 as shown in FIG.
A substrate 13 mounted with electronic components 12 placed on the substrate 1 , a lighting device 14 that illuminates these from the side, and electronic components 12
It is composed of a camera 15 that takes an image of the board 13 on which is mounted. The joint between the electronic component 12 and the board 13 that is illuminated by the light emitted from the illumination device 14 is imaged by the camera 15, and this image information is converted into a binarized image by the image processing unit 16. The joint between the electronic component 12 and the board 13 The display unit 17 allows you to recognize the condition and whether foreign matter is mixed in the joint.
It is displayed on the screen for inspection.

Problems to be Solved by the Invention However, in the above-mentioned conventional mounting board inspection apparatus, the fourth
As shown in the figure, an electronic component 1 to be inspected is placed on a board 13.
If the second-class lenses overlap on the optical axis of the camera 15 lens, the shadows of the electronic components 12 in the front and rear will overlap,
There was a problem in that an image of the bonded state between the electronic component 12 and the substrate 13 could not be accurately recognized and inspection could not be performed.

The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide an excellent mounting board inspection device that can recognize the bonding state even when electronic components are overlapped on the board.

Means for Solving the Problems In order to achieve the above object, the present invention provides an inspection table on which a board on which electronic components are mounted, a lighting device that illuminates the board from the side and above, and an imaging device comprising a camera. It consists of a display section.

Therefore, according to the present invention, it is possible to clearly recognize and inspect only the image of the electronic component to be inspected by illuminating the electronic component on the board from the side with the illumination device and also by illuminating from above the electronic component. I can do it.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIG. As shown in the figure, this embodiment includes an inspection table 3 on which a board 2 on which an electronic component 1 is mounted, and a partial illumination device 4.
and an upper lighting device 5 that illuminates the board and electronic components from above.
, an imaging device 6 located on the opposite side of the side illumination device 4 with the mounting board in between, and a display fs8 connected to the imaging device 6. An imaging device 6 that illuminates 2 and installed it on the other side.
The image is taken by In addition to illumination from the side, it is also illuminated from above, so as shown in Figure 2, shadows other than the electronic component 1 being inspected are erased, making it possible to accurately recognize the shadow of the electronic component 1. .

Note that the joint between the electronic component 1 and the board 2 is usually connected to the imaging device 6.
The imaging device 6 captures an image and displays it on the display unit 8 for inspection.
By connecting the image processing section 7 between the display section 8 and the display section 8 to convert the image information into a binary image and displaying the joint on the display section 8, recognition and inspection can be performed with even higher precision. Furthermore, when inspecting by directly displaying on the display section 8, a scale can be added to the screen to facilitate the inspection.

Furthermore, in order to inspect the mounted board, it is possible to improve the accuracy of image recognition by using two or more imaging devices 6, and it is possible to move the imaging device 6 to another location without fixing it to take images. You can also do it.

Effects of the Invention As described above, according to the mounted board inspection apparatus of the present invention, by combining illumination from the side and illumination from above, the electronic components mounted on the mounted board are aligned with the optical axis of the camera. Even if the electronic components and the board overlap, it is possible to capture a clear image of the bonding state between the electronic component and the board, and it is possible to accurately inspect the mounting state of the electronic component on the board.

[Brief explanation of drawings]

FIG. 1 is a perspective view of the main parts showing the configuration of a mounting board inspection apparatus according to an embodiment of the present invention, and FIG. 2 is a front view of the screen of a display section showing a binarized image of a joint obtained in this embodiment. , FIG. 3 is a perspective view of main parts showing the configuration of a conventional mounting board inspection device,
FIG. 4 is a front view of the screen of the display section showing a binarized image of the joint section obtained by the conventional mounting board inspection apparatus. 1... Electronic components, 2... Board, 3...
...Inspection table, 4...Side illumination device, 5...
...Top illumination device, 6...Imaging device, 7.
. . . Image processing section, 8 . . . Display section.

Claims (2)

[Claims] (1) An inspection device for a mounted board that includes an inspection table on which a board on which electronic components are mounted is placed, a side lighting device and a top lighting device that illuminate the board, an imaging device including a camera, and a display section. (2) The mounting board inspection device according to claim 1, further comprising an image processing section connected between the imaging device comprising a camera and the display section.