JPH0477652A - Soldering inspection apparatus - Google Patents
Soldering inspection apparatusInfo
- Publication number
- JPH0477652A JPH0477652A JP2190846A JP19084690A JPH0477652A JP H0477652 A JPH0477652 A JP H0477652A JP 2190846 A JP2190846 A JP 2190846A JP 19084690 A JP19084690 A JP 19084690A JP H0477652 A JPH0477652 A JP H0477652A
- Authority
- JP
- Japan
- Prior art keywords
- inspected
- light source
- perimeter
- oblique direction
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 title claims abstract description 11
- 238000005476 soldering Methods 0.000 title abstract description 6
- 238000003384 imaging method Methods 0.000 claims description 3
- 238000005286 illumination Methods 0.000 claims description 2
- 230000007547 defect Effects 0.000 claims 1
- 238000009792 diffusion process Methods 0.000 abstract description 2
- 238000010276 construction Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
- 239000005338 frosted glass Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は、拡大表示されたプリント基板に半田付けされ
た電子部品の半田付は部を目視により検査する装置に関
する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to an apparatus for visually inspecting soldering parts of electronic components soldered to a printed circuit board enlarged.
（従来の技術）
従来、半田付は検査は、被検査部を点光源によって照ら
し、直に目視すること、または、自動検査装置により検
査していた。(Prior Art) Conventionally, soldering has been inspected by illuminating the part to be inspected with a point light source and visually observing it directly, or by using an automatic inspection device.
（発明が解決しようとする課題）
しかしながら、近年のプリント基板の高密度化に伴い、
上記の被検査部を直に目視する検査方法では、限界にき
ていて正しく検査できない。また、点光源によって一方
向から被検査部を照明し検査するのは、半田面が曲面で
ありほぼ正反射面（鏡面）でもあるため光が反射し難し
い。また、自動検査装置は満足できる性能ではなく、か
つ、高価である。(Problem to be solved by the invention) However, with the recent increase in the density of printed circuit boards,
The above-mentioned inspection method of directly visualizing the inspected part has reached its limit and cannot be inspected correctly. Furthermore, it is difficult to inspect the part to be inspected by illuminating it from one direction with a point light source because the solder surface is a curved surface and is also a substantially specular reflecting surface (mirror surface), which causes light to be reflected. Furthermore, automatic inspection equipment has unsatisfactory performance and is expensive.
本発明は上記実情に鑑みなされたもので、被検査部を、
周囲より多方向からむら無く均一に照明し、斜め方向よ
り撮像することで、被検査部を立体的に拡大表示する安
価な半田付は検査装置を提供することを目的とする。The present invention was made in view of the above circumstances, and the inspected part is
It is an object of the present invention to provide an inexpensive soldering inspection device that enlarges and displays a portion to be inspected in three dimensions by uniformly illuminating the area from multiple directions and capturing an image from an oblique direction.
［発明の構成］
（課題を解決するための手段及び作用）本発明に係る半
田付は検査装置は、光源を中心に配置し、その周囲に光
源からの光を被検査部に向けて反射する反射板と、その
反射光のむらを減少させるための拡散板とを設けた照明
部と、被検査部を斜め方向から撮像する撮像部と、撮像
された被検査部の立体像を拡大表示するモニターから構
成したもので、これにより簡単な構造にて被検査部を、
均一に照明し拡大表示した立体像が得られ、安価で信頼
性の高い検査装置を提供できる。[Structure of the Invention] (Means and Effects for Solving the Problems) The soldering inspection device according to the present invention has a light source placed at the center and reflects light from the light source toward the part to be inspected around the light source. An illumination unit equipped with a reflector and a diffuser for reducing the unevenness of the reflected light, an imaging unit that captures an image of the inspected area from an oblique direction, and a monitor that enlarges and displays the captured three-dimensional image of the inspected area. With this, the part to be inspected can be inspected with a simple structure.
A uniformly illuminated and enlarged stereoscopic image can be obtained, and an inexpensive and highly reliable inspection device can be provided.
（実施例）
以下図面を参照して本発明の詳細な説明する。第１図は
本発明の一実施例を示したもので、図中、５は被検査部
である。１はカメラであり、被検査部５を斜め方向より
撮像する。２は反射板であり、光源からの光を被検査部
５に向けて反射する。３は光源である。４はすりガラス
でできた拡散板であり反射板２て反射された反射光のむ
らを均一にする。６はモニターであり立体的に撮像され
た被検査部５を拡大表示しそれを目視検査する。７は電
子部品が半田付けされるプリント基板である。(Example) The present invention will be described in detail below with reference to the drawings. FIG. 1 shows an embodiment of the present invention, and in the figure, 5 is a portion to be inspected. Reference numeral 1 denotes a camera, which takes an image of the inspected part 5 from an oblique direction. Reference numeral 2 denotes a reflecting plate, which reflects the light from the light source toward the portion to be inspected 5 . 3 is a light source. Reference numeral 4 denotes a diffuser plate made of frosted glass, which evens out the unevenness of the light reflected by the reflector plate 2. Reference numeral 6 denotes a monitor which enlarges and displays the three-dimensionally imaged inspected part 5 and visually inspects it. 7 is a printed circuit board to which electronic components are soldered.
本発明の詳細な説明する。光源３を中心に配置し、その
周囲に光源３からの光を被検査部５に向けて反射する反
射板２と、その反射光のむらを減少させるための拡散板
４とを設けることにより、プリント基板７上の被検査部
５をその周囲より多方向からむらなく均一に照明する。The present invention will be described in detail. By arranging the light source 3 at the center, and providing around it a reflecting plate 2 that reflects the light from the light source 3 toward the inspected part 5, and a diffusing plate 4 that reduces the unevenness of the reflected light, printing is possible. A part to be inspected 5 on a substrate 7 is evenly and uniformly illuminated from multiple directions from its surroundings.
上記手段によって照明された被検査部５をカメラ１で斜
め方向から撮像することで被検査部５の立体的な像が得
られ、その立体像をモニター６で拡大表示し目視検査す
る。By taking an image of the inspected section 5 illuminated by the above means from an oblique direction with the camera 1, a three-dimensional image of the inspected section 5 is obtained, and the three-dimensional image is enlarged and displayed on a monitor 6 for visual inspection.
［発明の効果］
本発明は以上説明したように、簡単な構造にて、多方向
からむらなく均一に照明した被検査部を拡大表示した立
体像が得られ、安価で信頼性の高い検査装置を提供でき
る。[Effects of the Invention] As described above, the present invention provides an inexpensive and highly reliable inspection device that has a simple structure, can obtain an enlarged 3D image of a portion to be inspected that is evenly and uniformly illuminated from multiple directions. can be provided.
第１図は本発明の一実施例に於ける半ＩＴＩ付は装置全
体の構成を示す側面図である。
１・・・カメラ、２・・・反射板、
３・・光源、４・・・拡散板、
５−・・被検査部、６・・・モニター
７・・・プリント基板。
りFIG. 1 is a side view showing the overall configuration of a semi-ITI device in one embodiment of the present invention. DESCRIPTION OF SYMBOLS 1...Camera, 2...Reflector, 3...Light source, 4...Diffusion plate, 5-...Test part, 6...Monitor 7...Printed circuit board. the law of nature
Claims (1)
（被検査部）の不具合を検査する装置において、被検査
部を周囲より多方向からむら無く均一に照明する照明手
段と、上記照明手段により照明された被検査部を斜め方
向より撮像する撮像手段と、その撮像手段により撮像さ
れた被検査部を拡大表示する手段とを具備し、被検査部
を目視検査することを特徴とする検査装置。In an apparatus for inspecting defects in a soldered part (part to be inspected) of an electronic component soldered to a printed circuit board, the part to be inspected is uniformly illuminated from multiple directions from the surroundings, and the illumination means is illuminated by the lighting means. What is claimed is: 1. An inspection apparatus for visually inspecting a part to be inspected, comprising: an imaging means for taking an image of the part to be inspected from an oblique direction; and a means for enlarging and displaying the part to be inspected imaged by the imaging means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2190846A JPH0477652A (en) | 1990-07-20 | 1990-07-20 | Soldering inspection apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2190846A JPH0477652A (en) | 1990-07-20 | 1990-07-20 | Soldering inspection apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0477652A true JPH0477652A (en) | 1992-03-11 |
Family
ID=16264749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2190846A Pending JPH0477652A (en) | 1990-07-20 | 1990-07-20 | Soldering inspection apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0477652A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010237034A (en) * | 2009-03-31 | 2010-10-21 | Sony Corp | Illumination device for visual inspection, and visual inspection device |
| WO2011055432A1 (en) * | 2009-11-04 | 2011-05-12 | ダックエンジニアリング株式会社 | Work piece inspection device |
-
1990
- 1990-07-20 JP JP2190846A patent/JPH0477652A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010237034A (en) * | 2009-03-31 | 2010-10-21 | Sony Corp | Illumination device for visual inspection, and visual inspection device |
| WO2011055432A1 (en) * | 2009-11-04 | 2011-05-12 | ダックエンジニアリング株式会社 | Work piece inspection device |
| CN102597751A (en) * | 2009-11-04 | 2012-07-18 | Dac工程株式会社 | Work piece inspection device |
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