JPH0729638Y2 - Jig for surface mount component inspection - Google Patents
Jig for surface mount component inspectionInfo
- Publication number
- JPH0729638Y2 JPH0729638Y2 JP1988134378U JP13437888U JPH0729638Y2 JP H0729638 Y2 JPH0729638 Y2 JP H0729638Y2 JP 1988134378 U JP1988134378 U JP 1988134378U JP 13437888 U JP13437888 U JP 13437888U JP H0729638 Y2 JPH0729638 Y2 JP H0729638Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- inspection
- surface mount
- mount component
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
【考案の詳細な説明】 ［産業上の利用分野］ 本考案は、Ｊ型のリードを有する表面実装部品のリード
形状及びリード寸法検査用治具に関する ［従来の技術］ 従来の表面実装部品のリード形状及びリード寸法検査装
置には、本考案で述べる検査用治具は無く、その検査方
法として （イ）表面実装部品のリードに直接基準ゲージを当て検
査する。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a jig for inspecting the lead shape and the lead dimension of a surface mount component having a J-type lead. [Prior Art] Lead of a conventional surface mount component. The shape and lead size inspection device does not have the inspection jig described in the present invention, and the inspection method is as follows: (a) A reference gauge is directly applied to the leads of the surface mount component for inspection.
（ロ）投影機によりリードを正確に拡大投影し、その投
影像に基準ゲージを重ね検査する。(B) A lead is accurately enlarged and projected by a projector, and a reference gauge is superimposed on the projected image for inspection.
（ハ）CCDカメラを使った画像認識により検査する。(C) Inspect by image recognition using a CCD camera.
のいずれかの方法であった。Was either way.
［考案が解決しようとする課題］ しかし従来の方法では、下記の問題点があった。[Problems to be Solved by the Invention] However, the conventional methods have the following problems.
（イ）の方法では微細な寸法検査の作業能率が悪い。寸
法の読み取り誤差が生じやすい。The method (a) has a poor work efficiency in fine dimension inspection. Dimension reading error is likely to occur.
（ロ）の方法では、正確な拡大率を得る為の投影機のコ
ストが高い。投影機が大きく、作業能率が悪い。In the method (b), the cost of the projector for obtaining an accurate magnification is high. The projector is large and the work efficiency is poor.
（ハ）の方法では、検査装置のコストが高い。In the method of (C), the cost of the inspection device is high.
そこで本考案は、従来のこの様な問題点を解決する為、
より小型で、高精度が得られ、作業能率を上げ、かつ低
コストの検査装置を構成することを目的とする。Therefore, the present invention solves the above-mentioned conventional problems,
It is an object of the present invention to configure an inspection device which is smaller, has higher accuracy, improves work efficiency, and is low in cost.
［課題を解決するための手段］ 本考案の表面実装部品の検査用治具は、Ｊ型のリードを
有する表面実装部品が載置される基準平面と、前記表面
実装部品の第一側面と接する前記表面実装部品の前記リ
ードの前記基準平面からの浮きと前記リードの基準リー
ド位置からの曲がりの許容範囲を示す検査基準が設けら
れた透明板と、前記リードと前記検査基準とからなる被
写体を同時に受像するとともに受像された前記被写体の
像を一定方向に反射する鏡と、前記表面実装部品の前記
第一側面と接触する前記透明板の対称位置となる第二側
面方向に前記表面実装部品を照射するよう配設された光
源と、前記鏡を介して前記被写体像を観察する拡大視装
置と、を有することを特徴とする。[Means for Solving the Problems] An inspection jig for a surface mount component of the present invention is in contact with a reference plane on which a surface mount component having a J-shaped lead is placed and a first side surface of the surface mount component. A transparent plate provided with an inspection standard showing an allowable range of floating of the lead of the surface-mounted component from the reference plane and bending of the lead from the reference lead position; and a subject composed of the lead and the inspection standard. A mirror that simultaneously receives images and reflects the received image of the subject in a certain direction, and the surface mount component in a second side surface direction that is a symmetrical position of the transparent plate that contacts the first side surface of the surface mount component. It is characterized by comprising a light source arranged to illuminate and a magnifying device for observing the subject image through the mirror.
［実施例］ 第１図（ａ），（ｂ）に本考案の実施例を示す。（ａ）
は上面図で、（ｂ）は側面図である。[Embodiment] FIGS. 1 (a) and 1 (b) show an embodiment of the present invention. (A)
Is a top view and (b) is a side view.
この例における表面実装部品は、ICのPLCCパッケージで
あり、PLCCのリード曲がりが、許容範囲内であるかを検
査する装置である。The surface mount component in this example is a PLCC package of the IC, and is an apparatus that inspects whether the lead bending of the PLCC is within an allowable range.
本実施例の装置は、下記により構成される。The device of this embodiment is configured as follows.
PLCCを置く基準平面 リード曲がりの許容範囲を描き込んだ、透明ガラス
板 リード部と許容範囲ゲージとを上部から拡大観察可
能とする為の鏡 をのせたＸ−Ｙステージ リード形状を見やすくする為の光源（バックライ
ト） 実体顕微鏡 第２図に本実施例における透明平板に描き込んだ、検査
規準を示す。The reference plane on which the PLCC is placed The transparent glass plate that draws the allowable range of lead bending, and the XY stage with a mirror for allowing the magnified observation of the lead part and the allowable range gauge from the top. Light Source (Backlight) Stereo Microscope FIG. 2 shows the inspection standard drawn on the transparent flat plate in this embodiment.
この検査規準は、PLCCのリード曲がりが、許容範囲内で
あるかを検査する為、 リードの基準面からの浮き量を検査する許容範囲 リードの横方向の曲がりを検査する許容範囲から成
っている。This inspection standard consists of an allowable range for inspecting the amount of floating from the reference surface of the lead in order to inspect whether the lead bending of the PLCC is within the allowable range.An allowable range for inspecting the lateral bending of the lead. .
以上により構成される検査装置は、の基準平面及び
の透明ガラス板で構成される部分にPLCCのリードを接触
させ、透明ガラスを透過して見えるリードと、リード曲
がり許容範囲ゲージとをの鏡により上部から同時に
の実体顕微鏡により拡大視し、検査するものである。The inspection device configured as above is configured such that the PLCC lead is brought into contact with the reference plane and the portion formed by the transparent glass plate, and the lead visible through the transparent glass and the lead bending allowable range gauge are mirrored. It is to be inspected by enlarging it from the top with a stereo microscope at the same time.
以上本考案の実施例を、ICのPLCCパッケージリード曲が
り検査装置として説明したが、表面実装部品としては、
これに限られることなく、全ての表面実装部品に応用出
来る。また、検査内容としては、リードの浮き、横方向
の曲がりだけでなく、リードの寸法の検査にも応用出来
る。The embodiment of the present invention has been described above as an IC PLCC package lead bending inspection device.
Not limited to this, it can be applied to all surface mount components. Further, the inspection content can be applied not only to the floating of the leads and the bending in the lateral direction, but also to the inspection of the dimensions of the leads.
［考案の効果］ 以上述べた様に本考案によれば、表面実装部品のリード
に、検査規準を描き込んだ透明平板を近接させ、リード
と検査規準とを同時に拡大視検査可能としたことによ
り、 （１）正確な拡大率を必要とする高価な投影機が不要
で、安価な拡大視装置で検査が可能となり、コストダウ
ンすることが出来る。[Advantage of the Invention] As described above, according to the present invention, the transparent flat plate having the inspection standard drawn is brought close to the lead of the surface mount component, and the lead and the inspection standard can be inspected at the same time by the magnified visual inspection. (1) An expensive projector that requires an accurate enlargement ratio is not required, and an inspection can be performed with an inexpensive magnifying-eye device, and the cost can be reduced.
（２）実体顕微鏡等の小型の拡大装置で検査装置が構成
出来、検査作業能率が向上する。(2) The inspection device can be configured with a small enlargement device such as a stereoscopic microscope, and the inspection work efficiency is improved.
（３）CCDカメラを使った高価な画像認識装置によら
ず、肉視で検査が可能であり、高価な設備投資を必要と
しない。(3) The inspection can be performed visually without using an expensive image recognition device that uses a CCD camera, and does not require expensive equipment investment.
第１図（ａ），（ｂ）は、本考案の一適用例であるPLCC
のリード曲がり検査装置の概要図であり、（ａ）は上面
図、（ｂ）は側面図である。 第２図は、前記適用例における、透明平板に描き込んだ
検査規準を示す図。 ……基準平面 ……透明ガラス板 ……鏡 ……Ｘ−Ｙステージ ……光源 ……実体顕微鏡 ……リード浮き許容範囲 ……リード曲がり許容範囲 ……PLCC1 (a) and 1 (b) show a PLCC as an application example of the present invention.
2A and 2B are schematic views of the lead bending inspection apparatus of FIG. FIG. 2 is a view showing inspection standards drawn on a transparent flat plate in the application example. …… Reference plane …… Transparent glass plate …… Mirror …… XY stage …… Light source …… Stereoscopic microscope …… Lead floating tolerance …… Lead bending tolerance …… PLCC
Claims (1)
される基準平面と、前記表面実装部品の第一側面と接す
る前記表面実装部品の前記リードの前記基準平面からの
浮きと前記リードの基準リード位置からの曲がりの許容
範囲を示す検査基準が設けられた透明板と、前記リード
と前記検査基準とからなる被写体を同時に受像するとと
もに受像された前記被写体の像を一定方向に反射する鏡
と、前記表面実装部品の前記第一側面と接触する前記透
明板の対称位置となる第二側面方向に前記表面実装部品
を照射するよう配設された光源と、前記鏡を介して前記
被写体像を観察する拡大視装置と、を有することを特徴
とする表面実装部品の検査用治具。1. A reference plane on which a surface-mounted component having a J-shaped lead is placed, a float of the lead of the surface-mounted component in contact with a first side surface of the surface-mounted component from the reference plane, and the lead. , A transparent plate provided with an inspection standard showing an allowable range of bending from the reference lead position, and an object consisting of the lead and the inspection standard are simultaneously received, and the received image of the object is reflected in a certain direction. A mirror, a light source arranged to irradiate the surface mount component in a direction of a second side surface which is a symmetrical position of the transparent plate in contact with the first side surface of the surface mount component, and the subject through the mirror A magnifying device for observing an image, and a surface mounting component inspection jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988134378U JPH0729638Y2 (en) | 1988-10-14 | 1988-10-14 | Jig for surface mount component inspection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988134378U JPH0729638Y2 (en) | 1988-10-14 | 1988-10-14 | Jig for surface mount component inspection |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0255106U JPH0255106U (en) | 1990-04-20 |
| JPH0729638Y2 true JPH0729638Y2 (en) | 1995-07-05 |
Family
ID=31393083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988134378U Expired - Lifetime JPH0729638Y2 (en) | 1988-10-14 | 1988-10-14 | Jig for surface mount component inspection |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0729638Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107328373A (en) * | 2017-08-18 | 2017-11-07 | 深圳市伙伴科技有限公司 | Pin planeness detection system and method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59176155U (en) * | 1983-05-12 | 1984-11-24 | ロ−ム株式会社 | Inspection tools for electronic parts |
| JPS6276529A (en) * | 1985-09-27 | 1987-04-08 | Fuji Kikai Seizo Kk | Method for detecting bending of lead wire in flat-pack type ic |
| JPS62274205A (en) * | 1986-05-23 | 1987-11-28 | Hitachi Tokyo Electron Co Ltd | Method and device for inspecting lead flatness |
-
1988
- 1988-10-14 JP JP1988134378U patent/JPH0729638Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0255106U (en) | 1990-04-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3995030B2 (en) | Semiconductor package inspection equipment | |
| US5563703A (en) | Lead coplanarity inspection apparatus and method thereof | |
| KR960006968B1 (en) | Semiconductor inspection apparatus and the method | |
| JPH11316112A (en) | System for inspecting integrated circuit with crossing optical axes | |
| JP2001521140A (en) | 3D inspection system | |
| KR960005090B1 (en) | Bonding wire inspection apparatus | |
| JPH0729638Y2 (en) | Jig for surface mount component inspection | |
| JP3288568B2 (en) | Alignment apparatus and method | |
| TW200303410A (en) | Method and apparatus for measuring a line width | |
| JP2003510568A (en) | LCD inspection method and LCD inspection apparatus by pattern comparison | |
| JPH04332806A (en) | Image recognizing apparatus | |
| JP2000113191A (en) | Pattern inspecting device | |
| JP3068636B2 (en) | Pattern inspection method and apparatus | |
| JPH0313945A (en) | Mask for manufacturing semiconductor device, its manufacture, its inspection device and its inspection method | |
| JP2004226106A (en) | Semiconductor appearance inspection device and semiconductor appearance inspection method | |
| JPS62274205A (en) | Method and device for inspecting lead flatness | |
| JP2981510B2 (en) | Lead parts inspection equipment | |
| JP2000121334A (en) | Lead inspecting device | |
| JPH0477652A (en) | Soldering inspection apparatus | |
| JP4802814B2 (en) | Opening pattern inspection device | |
| JP3444228B2 (en) | Semiconductor device lead inspection device | |
| KR100229480B1 (en) | Lead inspection apparatus and calibration method for lead inspection apparatus | |
| TW202314591A (en) | Appearance inspection device and method wherein the appearance inspection device includes a first imaging unit and a second imaging unit | |
| JPH01305344A (en) | Inspecting device for pattern defect | |
| JPH0973059A (en) | Method and apparatus for inspecting liquid crystal display module for projection |