JPH0255106U - - Google Patents
Info
- Publication number
- JPH0255106U JPH0255106U JP13437888U JP13437888U JPH0255106U JP H0255106 U JPH0255106 U JP H0255106U JP 13437888 U JP13437888 U JP 13437888U JP 13437888 U JP13437888 U JP 13437888U JP H0255106 U JPH0255106 U JP H0255106U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- flat plate
- surface mount
- inspecting
- jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007689 inspection Methods 0.000 claims description 3
- 238000005452 bending Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 1
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第1図a,bは、本考案の一適用例であるPL
CCのリード曲がり検査装置の概要図であり、a
は上面図、bは側面図である。第2図は、前記適
用例における、透明平板に描き込んだ検査規準を
示す図。
……基準平面、……透明ガラス板、……
鏡、……X―Yステージ、……光源、……
実体顕微鏡、……リード浮き許容範囲、……
リード曲がり許容範囲、……PLCC。
Figures 1a and 1b show a PL that is an application example of the present invention.
It is a schematic diagram of a CC lead bending inspection device, and a
is a top view, and b is a side view. FIG. 2 is a diagram showing inspection criteria drawn on a transparent flat plate in the application example. ...Reference plane, ...Transparent glass plate, ...
Mirror, ... X-Y stage, ... light source, ...
Stereo microscope, ... lead floating tolerance range, ...
Lead bending tolerance range...PLCC.
Claims (1)
ード形状及びリード寸法を検査する治具において
、平板に検査規準を描き込んだ透明平板を固定し
、リードに近接させたことを特徴とする表面実装
部品のリード形状及びリード寸法検査用治具。 A surface mount jig for inspecting the lead shape and lead dimensions of a surface mount component by placing a surface mount component on a flat plate, characterized in that a transparent flat plate with inspection standards drawn on the flat plate is fixed and brought close to the leads. A jig for inspecting the lead shape and lead dimensions of parts.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988134378U JPH0729638Y2 (en) | 1988-10-14 | 1988-10-14 | Jig for surface mount component inspection |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988134378U JPH0729638Y2 (en) | 1988-10-14 | 1988-10-14 | Jig for surface mount component inspection |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0255106U true JPH0255106U (en) | 1990-04-20 |
JPH0729638Y2 JPH0729638Y2 (en) | 1995-07-05 |
Family
ID=31393083
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988134378U Expired - Lifetime JPH0729638Y2 (en) | 1988-10-14 | 1988-10-14 | Jig for surface mount component inspection |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0729638Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107328373A (en) * | 2017-08-18 | 2017-11-07 | 深圳市伙伴科技有限公司 | Pin planeness detection system and method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59176155U (en) * | 1983-05-12 | 1984-11-24 | ロ−ム株式会社 | Inspection tools for electronic parts |
JPS6276529A (en) * | 1985-09-27 | 1987-04-08 | Fuji Kikai Seizo Kk | Method for detecting bending of lead wire in flat-pack type ic |
JPS62274205A (en) * | 1986-05-23 | 1987-11-28 | Hitachi Tokyo Electron Co Ltd | Method and device for inspecting lead flatness |
-
1988
- 1988-10-14 JP JP1988134378U patent/JPH0729638Y2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59176155U (en) * | 1983-05-12 | 1984-11-24 | ロ−ム株式会社 | Inspection tools for electronic parts |
JPS6276529A (en) * | 1985-09-27 | 1987-04-08 | Fuji Kikai Seizo Kk | Method for detecting bending of lead wire in flat-pack type ic |
JPS62274205A (en) * | 1986-05-23 | 1987-11-28 | Hitachi Tokyo Electron Co Ltd | Method and device for inspecting lead flatness |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107328373A (en) * | 2017-08-18 | 2017-11-07 | 深圳市伙伴科技有限公司 | Pin planeness detection system and method |
Also Published As
Publication number | Publication date |
---|---|
JPH0729638Y2 (en) | 1995-07-05 |
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