JP2004226106A - Semiconductor appearance inspection device and semiconductor appearance inspection method - Google Patents

Semiconductor appearance inspection device and semiconductor appearance inspection method Download PDF

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Publication number
JP2004226106A
JP2004226106A JP2003011187A JP2003011187A JP2004226106A JP 2004226106 A JP2004226106 A JP 2004226106A JP 2003011187 A JP2003011187 A JP 2003011187A JP 2003011187 A JP2003011187 A JP 2003011187A JP 2004226106 A JP2004226106 A JP 2004226106A
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Japan
Prior art keywords
semiconductor
appearance inspection
inspection
inspection apparatus
frame
Prior art date
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JP2003011187A
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Japanese (ja)
Inventor
Kanehisa Yamamoto
兼久 山本
Fumiaki Sato
佐藤　　文昭
Koichi Suzuki
浩一 鈴木
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Renesas Technology Corp
Mitsubishi Electric Engineering Co Ltd
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Renesas Technology Corp
Mitsubishi Electric Engineering Co Ltd
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Application filed by Renesas Technology Corp, Mitsubishi Electric Engineering Co Ltd filed Critical Renesas Technology Corp
Priority to JP2003011187A priority Critical patent/JP2004226106A/en
Publication of JP2004226106A publication Critical patent/JP2004226106A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor appearance inspection device capable of performing appearance inspection automatically without depending on manual labor, even when different wiring materials are mixed. <P>SOLUTION: This appearance inspection device 1 is provided with an XY table 5 for positioning a frame 2 in the horizontal direction by being driven by an X-axis motor 3 and a Y-axis motor 4 and being moved in the horizontal direction, and a YZ table 6 for positioning the frame 2 in the vertical direction by being loaded on the XY table 5 and being moved in the direction at a narrow angle with respect to the horizontal plane. The device 1 is also provided with a Z-axis motor 7 for performing motion in the X-axis direction and driving the YZ table 6, and table deformation plate 8 for generating deformation in the Y-axis direction in the YZ table 6 by driving the Z-axis motor 7. The device 1 is also provided with an illumination means for irradiating the frame 2 with illumination light, a camera 12 for imaging the frame 2, and a movable lens 13 moved in the vertical direction for performing height measurement. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、半導体製造プロセスにおける組立工程のワイヤボンド後の外観検査を行うための半導体外観検査装置及びこれを用いた半導体外観検査方法に関するものである。
【０００２】
【従来の技術】
一般に、半導体装置の製造・組立プロセスにおいて、各工程では、製品の品質を確認し、あるいは不良品を排除するため、外観検査を実施している。具体的には、例えば、正常にボンディングが行われているか否かを検査するために、半導体素子上のボンディングワイヤの形状や高さの検査が行われる。しかしながら、従来の外観検査では、人による目視検査に頼るところが大きいので、人件費等による製造コストの増大や、不良品の見逃しによる客先でのクレームの発生などといった問題を引き起こすことがある。
【０００３】
また、近年、半導体装置においては、その高密度化や大規模化に伴い、信号線の取り出しを行うリードの多ピン化や小ピッチ化が進んでいる。このため、半導体チップとパッケージ・リードとの電気的導通を行うボンディングワイヤの本数が多くなり、ワイヤピッチ間隔が狭くなる傾向がある。したがって、正常にボンディングが行われているかの検査の正確性が要求される。そこで、簡便かつ信頼度の高い３次元形状の検査を行うために、かかる検査は、従来の目視検査から半導体外観検査装置を用いる自動検査に移行しつつある（例えば、特許文献１〜７参照）。
【０００４】
【特許文献１】
特開平７−３７９５５号公報（［０００２］、図１０）
【特許文献２】
特開平７−２８８２７３号公報（［００２４］、図１）
【特許文献３】
特開平１１−８３４５６号公報（［００１１］、図１）
【特許文献４】
特開平１０−１９９９１５号公報（［００１４］、図１）
【特許文献５】
特開平６−１０２０２４号公報（［００１６］、図２）
【特許文献６】
特開平４−２７７６４５号公報（［０００３］、図１）
【特許文献７】
特許第３２８７２６３号明細書（［００１４］、図１）
【０００５】
【発明が解決しようとする課題】
しかしながら、従来の半導体外観検査装置ないし半導体外観検査方法では、ワイヤボンド後の外観検査の自動化は、小電力のＩＣの製造分野における金線（Ａｕワイヤ：２０〜４０μ程度）の接合形状やワイヤ高さの測定・検査についてはほぼ達成されているものの、大電力のパワーモジュールの製造分野におけるアルミ線（Ａ１：数百μｍ）の外観検査については、未だ作業者による目視検査が行われている。
【０００６】
このように、パワーモジュールの外観検査の自動化が十分に達成されない要因としては、例えば、ＩＣの混成により数十μｍの細線と、これに比べてかなり太い数百μｍの太線とを混成していることや、ウェッジ接合方式への対応がなされていないことなどがあげられる。
【０００７】
高さの検査については、例えば特許文献７にも開示されているように、検査対象物の光学的な像を得るための第１のレンズに加えて、移動可能な第２の可動レンズを設け、第２の可動レンズを移動させて検査対象物を撮像し、焦点の一致度から検査対象物の高さの計測を行うようにした半導体外観検査装置が知られている。しかし、この半導体外観検査装置では、計測の精度と構造上の制約とにより、例えば細線（金線）に対応できるようにすると、太線の高さの計測は、計測範囲を超えるため不可能になるといった問題がある。
【０００８】
本発明は、上記従来の問題を解決するためになされたものであって、異なる配線材が混成されている場合でも、外観検査を人手に頼らず自動的に行うことができ、検査時間を短縮して検査コストを低減することができる半導体外観検査装置ないし半導体外観検査方法を提供することを解決すべき課題とする。
【０００９】
【課題を解決するための手段】
上記課題を解決するためになされた本発明にかかる半導体外観検査装置は、検査対象物に対して移動する可動レンズを有し該検査対象物を撮像する撮像手段（カメラ）と、検査対象物を伴って水平方向に移動する第１のテーブルと、第１のテーブルに搭載され、検査対象物の高さを変化させる第２のテーブルとを備えていることを特徴とするものである。
【００１０】
【発明の実施の形態】
以下、添付の図面を参照しつつ、本発明の実施の形態を具体的に説明する。本発明の実施の形態にかかる半導体外観検査装置（ワイヤボンディング外観検査装置）は、いずれも、水平方向に移動することができるように構成された第１のテーブルと、第１のテーブルに搭載されその上面テーブルが上下方向に移動することができるように構成された第２のテーブルと、第２のテーブルの上面テーブル上に載置された検査対象物のボンディングワイヤの所定の検査項目を撮像する撮像手段と、撮像手段の撮像結果を基準値と比較し、前記所定の検査項目に関する合否を判断する合否判断手段とを備えていることを基本的特徴とする。
【００１１】
実施の形態１．
図１及び図２は、それぞれ、本発明にかかる半導体外観検査装置（以下、略して「外観検査装置」という。）の立面図及び平面図である。図１及び図２に示すように、この外観検査装置１は、検査対象物である、配線材により配線されたＩＣ等のチップが組み付けられたフレーム２の外観検査を行うようになっている。
【００１２】
この外観検査装置１には、フレーム２を搭載（後記のＹＺテーブル６を介して）した状態で、Ｘ軸モータ３及びＹ軸モータ４により駆動されて水平方向に移動し、フレーム２の水平方向の位置決めを行うＸＹテーブル５（第１のテーブル）と、ＸＹテーブル５に搭載され水平面と狭小な角度をなす方向に移動してフレーム２の上下方向（高さ方向）の位置決めを行うＹＺテーブル６（第２のテーブル）とが設けられている。なお、以下では、Ｘ軸モータ３及びＹ軸モータ４の駆動方向（水平方向）を、それぞれ「Ｘ軸方向」及び「Ｙ軸方向」という。
【００１３】
また、外観検査装置１には、ＸＹテーブル５に搭載されＸ軸モータ３と同じ方向（Ｘ軸方向）の運動を行いＹＺテーブル６の駆動を行うＺ軸モータ７と、Ｚ軸モータ７の駆動によりＹＺテーブル６にＹ軸方向（水平方向）の変位を発生させるテーブル変位板８とが設けられている。さらに、外観検査装置１には、検査対象物であるフレーム２の上方に位置しフレーム２に照明光を照射する照明手段１１と、フレーム２の撮像を行うカメラ１２（撮像手段）と、高さ計測を行うために上下方向に移動する可動レンズ１３とが設けられている。
【００１４】
ここで、ＹＺテーブル６には、真空配管９を通して供給される真空によりフレーム２を吸着・固定するフレーム吸着手段が設けられている。具体的には、ＹＺテーブル６には、検査対象物であるフレーム２の下側に位置する複数個のフレーム吸着用穴が設けられ、かつＹＺテーブル６内には図示していない外部の真空ポンプ（真空手段）から真空配管９を通して真空が供給されるようになっている。かくして、フレーム２は、ＹＺテーブル６内の真空によりＹＺテーブル６に吸着・固定される。これにより、フレーム２のたわみや、移動時におけるフレーム２のずれを抑制することができ、安定した高精度な測定及び検査が可能となる。
【００１５】
以下、図３に示すフローチャートに従って、適宜図１及び図２を参照しつつ、この外観検査装置１を用いた半導体装置の外観検査方法（半導体外観検査方法）を説明する。なお、図３に示すフローチャートは、外観検査を行う場合の検査対象物であるフレーム２の位置決めと計測及び検査とを行うためのものである
【００１６】
図３に示すように、この外観検査方法においては、まず、検査対象物であるフレーム２をＹＺテーブル６上の所定（任意）の位置に配置し、ＸＹテーブル５の水平方向（Ｘ軸方向及びＹ軸方向）の移動により、フレーム２を所定の位置に位置決めする。具体的には、Ｘ軸モータ３でＸＹテーブル５をＸ軸方向に移動させ、ＸＹテーブル５ひいてはフレーム２をＸ軸方向について所定の位置に位置決めする（ステップＳ１）。さらに、Ｙ軸モータ４でＸＹテーブル５をＹ軸方向に移動させ、ＸＹテーブル５ひいてはフレーム２をＹ軸方向について所定の位置に位置決めする（ステップＳ２）。
【００１７】
この後、フレーム２の外観検査を行う（ステップＳ４）。具体的には、照明手段１１によりフレーム２に照明光を照射し、カメラ１２によりフレーム２の画像を撮像する。そして、ＩＣチップ等に接続された金線等の配線材の接合部の形状（幅、大きさ等）や位置の計測を行い、かつ所定の基準と比較して良否判定等の検査を行う。同様に、配線材の高さについても計測及び検査を行う。
【００１８】
この配線材の高さの計測及び検査は、例えば特許文献７に開示されているように、フレーム２の光学的な像を得るための可動レンズ１３を移動させてフレーム２を撮像し、焦点の一致度から配線材（フレーム２）の高さの計測を行うといった普通の方法で行われる。そして、全フレーム２について計測及び検査が完了したか否かを判定し（ステップＳ５）、完了していなければ（ＮＯ）、ステップＳ１〜Ｓ４を繰り返す。完了していれば（ＹＥＳ）、計測及び検査を終了する。
【００１９】
上記の計測及び検査の途中で、配線材の高さが、可動レンズ１３の移動により計測することができる範囲を超えていれば、ＹＺテーブル６の移動によりフレーム２の高さを変更して撮像可能な高さにし、フレーム２をＺ軸方向（上下方向）について位置決めする（ステップＳ３）。この場合、水平面と狭小な角度θをなす方向に移動することができるＹＺテーブル６には、Ｘ軸方向の駆動を行うＺ軸モータ７により、テーブル変位板８を介してＹ軸方向（水平方向）の力が加えられる。そして、ＹＺテーブル６を水平面と角度θをなす方向に移動させることによりＺ軸方向に移動させ、検査対象物であるフレーム２の高さを変更する。なお、Ｘ軸方向、Ｙ軸方向、Ｚ軸方向の位置決めを同時に行えば、ロスタイムの発生を最小限に抑えることができ、外観検査を短時間で行うことができる。
【００２０】
ＹＺテーブル６は、その駆動方向（Ｙ軸方向）と垂直な方向（Ｘ軸方向）に伸びる直線を横軸とするｓｉｎ曲線に基づく変位により駆動される。つまり、テーブル変位板８の変位曲線は、ＹＺテーブル６を移動させる際の移動時及び停止時に変曲点が生じないｓｉｎ曲線とされている。これにより、ＹＺテーブル６の移動時及び停止時に、振動のない安定した位置決め制御を行うことができ、高速かつ高精度で計測及び検査を行うことができる。
【００２１】
ここで、ＹＺテーブル６のＹ軸方向の移動量をＹとすれば、Ｚ軸方向の高さＺは、次の式１であらわされる。
【数１】
Ｚ＝Ｙ＊ｓｉｎθ…………………………………………………………式１
また、例えば、Ｚ軸モータ７によるテーブル変位板８のＸ軸方向の移動量をＸとし、Ｘ軸方向と垂直なＹ軸方向の移動量をＹとしたとき、Ｘ軸方向の任意の移動量ｘと、これに対するＹ軸方向の移動量ｙ及びＺ軸方向の移動量ｚとの関係は、次の式２、式３であらわされる。
【数２】
ｙ＝Ｋ＊ｘ……………………………………………………………式２
ただし、Ｋ＝Ｙ／Ｘ
【数３】
ｚ＝ｙ＊ｓｉｎθ…………………………………………………………式３
【００２２】
テーブル変位板８の変位曲線がｓｉｎ曲線である場合、Ｙ軸方向の移動量ｙは、次の式４であらわされる。
ｙ＝Ｙ＊（ｓｉｎ（（ｘ／Ｘ−０．５）＊π）＋１）／２………………………式４
なお、ＹＺテーブル６でのＹ軸方向の移動分は、ＸＹテーブル５で逆方向の移動を行うことにより、高さを変更した場合の水平方向の位置の補正を行うことができる。
【００２３】
よって、テーブル変位板８の移動量を制御することにより、ＹＺテーブル６の高さを任意に設定することができる。これにより、検査対象物であるフレーム２の形状や配線材の形状及び／又は高さが異なる場合でも、きめ細かな高さ設定を行うことができ、高精度な測定及び検査を行うことができる。
【００２４】
外観検査装置１をこのような構造とすることにより、空間を有効に活用することができ、検査対象物の適用範囲を拡大することができ、かつ外観検査装置１の大型化を抑制することができ、あるいは相対的に小型の外観検査装置１を得ることができる。また、外観検査を完全に自動化することができ、検査能力を向上させることができる。
【００２５】
実施の形態２．
以下、本発明の実施の形態２を説明する。ただし、実施の形態２にかかる外観検査装置ないしこれを用いた外観検査方法の基本的な構成は、実施の形態１にかかる外観検査装置ないし外観検査方法と共通であるので、説明の重複を避けるため、以下では主として実施の形態１と異なる点を説明する。なお、後記の実施の形態３、４についても同様である。
【００２６】
実施の形態２では、図４に示すようなフレーム２を検査対象物として計測・検査を行う。
図４に示すように、実施の形態２では、フレーム２は、ＩＣチップ１５とパワーチップ１６と細線１７（配線材）と太線１８（配線材）とを備えている。このフレーム２において、パワーチップ１６が組み付けられた部分（パワーチップ部）ではフレーム２の一部が他の部分（以下、「本体部」という。）より低くなった、高さ方向の段差を伴った構造を有している。そして、ＩＣチップ１５はフレーム２の本体部に取り付けられ、パワーチップ１６はフレームの低くなった部分（以下、「段差部」という。）に取り付けられている。
【００２７】
ここで、ＩＣチップ１５は細線１７によりフレーム２（本体部）に接続され、パワーチップ１６は太線１８によりフレーム２（本体部）又は段差部に取り付けられた他のパワーチップ１６に接続されている。図４から明らかなとおり、高さ方向の計測・検査範囲は、ＩＣチップ１５に接続された細線１７ではＡで示す範囲であり、パワーチップ１６に接続された太線１８ではＢで示す範囲である。
【００２８】
このような検査対象物（フレーム２）の場合、ＩＣチップ１５に接続された細線１７の計測・検査は、図１に示す外観検査装置１あるいは従来の外観検査装置において、可動レンズ１３の移動（調節）のみで実施することができる。しかし、パワーチップ１６に接続された太線１８では、高さ方向の計測・検査範囲が、可動レンズ１３で調節可能な範囲を超えてしまう。そこで、ＹＺテーブル６によりフレーム２の高さを変更した上で、可動レンズ１３を移動させて（調節して）高さの測定・検査を行うようにしている。このとき、ＹＺテーブル６で変位させた高さの補正を行う。
【００２９】
ここで、ＩＣチップ１５に接続された細線１７としては、例えば、直径が２０〜４０μｍ程度の細い金線が用いられる。また、パワーチップ１６に接続された太線１８としては、例えば、直径が２００〜４００μｍ程度の太いアルミ線が用いられる。なお、太線１８がアルミ線の場合、その接合は一般にウェッジ接合である。
そこで、図５に示すように、この外観検査装置１では、ウェッジ接合部の形状を特徴づける特性値として、幅Ｗと、長さＬ１と、長さＬ２と、角度ψとを設定し、これらの測定を行い、外観検査を行うようにしている。
【００３０】
実施の形態２にかかる外観検査装置ないしこれを用いた検査方法によれば、以上のような構成により、１台の外観検査装置１で金線である細線１７やアルミ線である太線１８の２種類の検査が可能となる。これにより、検査の多様化が図られ、従来は人の目視で行われていた外観検査の自動化が実現される。
【００３１】
実施の形態３．
以下、本発明の実施の形態３にかかる外観検査装置ないしこれを用いた検査方法を説明する。ウェッジ接合部の形状の測定及び検査を行う場合、カメラ１２（撮像手段）で検査対象物であるフレーム２を撮像してウェッジの画像を得た後、ウェッジの輪郭抽出を行う。
【００３２】
図６に示すように、実施の形態３では、輪郭部の画素座標に基づいて最小二乗法で４次近似曲線を求めて輪郭抽出を行い、幅部の最も太い部分で幅Ｗを決定し、最も細い部分に基づいて接合部の長さＬ１を決定するようにしている。実施の形態３にかかる外観検査装置ないしこれを用いた検査方法によれば、上記機能を備えているので、画像ノイズ等を排除して輪郭を安定して抽出することができ、高精度な検出が可能となり、計測・検査の安定化を図ることができる。
【００３３】
実施の形態４．
以下、本発明の実施の形態４にかかる外観検査装置ないしこれを用いた検査方法を説明する。実施の形態４では、Ｚ軸モータ７は、サーボモータ又はステッピングモータである。また、前記のとおり、任意の高さ制御を行う必要がなく２値の高さを得るのみであれば、モータに代えてシリンダ等の機器を使用してもよい。テーブル変位板８については、曲線や直線等の任意の形状の変位曲線を備えたものを使用してもよい。また、直接Ｚ軸モータ７でＹＺテーブル６を駆動する場合は、テーブル変位板８は設けなくてもよい。さらに、ＹＺテーブル６は、角度θをもつ構造でなくともよく、例えばＺ軸モータ７で直接Ｚ軸方向の高さを変える構造であってもよい。実施の形態４によっても、基本的には、実施の形態１〜３と同様の効果が得られる。
【００３４】
以上、本発明の実施の形態１〜４によれば、検査対象物及び検査の内容を、使用の目的に合わせて好ましく選択すれば、コストを低減することができる。また、前記したように外観検査装置１の適用範囲を拡大して自動化を実現することができる。以上のような構成により、従来人の目視で行われていた外観検査の適用範囲が拡大し、外観検査の自動化、能力向上による生産性向上、人件費削減及び不良品の流出等による不良対策（クレーム対策）費削減によるコスト低減などといった種々の効果が得られる。
【００３５】
【発明の効果】
本発明によれば、第１のテーブルに搭載され検査対象物の高さを変化させる第２のテーブルとを備えているので、外観検査を人手に頼らず自動的に行うことができ、検査時間を短縮して検査コストを低減することができる。
【図面の簡単な説明】
【図１】本発明にかかる外観検査装置の立面図である。
【図２】図１に示す外観検査装置の平面図である。
【図３】本発明にかかる外観検査方法のフローチャートである。
【図４】本発明にかかる外観検査装置ないし外観検査方法で外観検査が行われるフレームの立面図である。
【図５】フレームの太線のウェッジ接合部の形状を示す図である。
【図６】ウェッジ接合部の画像の輪郭部を示す図である。
【符号の説明】
１ 外観検査装置、 ２ フレーム、 ３ Ｘ軸モータ、 ４ Ｙ軸モータ、５ ＸＹテーブル、 ６ ＹＺテーブル、 ７ Ｚ軸モータ、 ８ テーブル変位板、 ９ 真空配管、 １０ フレーム吸着手段、 １１ 照明手段、 １２ カメラ、 １３ 可動レンズ、 １５ ＩＣチップ、 １６ パワーチップ、 １７ 細線、 １８ 太線。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor visual inspection apparatus for performing visual inspection after wire bonding in an assembly process in a semiconductor manufacturing process and a semiconductor visual inspection method using the same.
[0002]
[Prior art]
In general, in each process of manufacturing and assembling a semiconductor device, an appearance inspection is performed in order to confirm the quality of a product or eliminate defective products. Specifically, for example, in order to inspect whether bonding is normally performed, the shape and height of the bonding wire on the semiconductor element are inspected. However, since the conventional appearance inspection relies heavily on human visual inspection, it may cause problems such as an increase in manufacturing costs due to labor costs and the occurrence of complaints at customers due to overlooking of defective products.
[0003]
In recent years, in semiconductor devices, as the density and scale of semiconductor devices increase, the number of leads for taking out signal lines has been increased and the pitch has been reduced. For this reason, the number of bonding wires for conducting electrical continuity between the semiconductor chip and the package leads increases, and the wire pitch interval tends to be narrowed. Therefore, the accuracy of the inspection of whether the bonding is normally performed is required. Therefore, in order to perform a simple and highly reliable inspection of a three-dimensional shape, the inspection is shifting from a conventional visual inspection to an automatic inspection using a semiconductor appearance inspection apparatus (for example, see Patent Documents 1 to 7). .
[0004]
[Patent Document 1]
Japanese Unexamined Patent Publication No. 7-37955 ([0002], FIG. 10)
[Patent Document 2]
Japanese Patent Laid-Open No. 7-288273 ([0024], FIG. 1)
[Patent Document 3]
Japanese Patent Laid-Open No. 11-83456 ([0011], FIG. 1)
[Patent Document 4]
JP-A-10-199915 ([0014], FIG. 1)
[Patent Document 5]
JP-A-6-102024 ([0016], FIG. 2)
[Patent Document 6]
JP-A-4-277645 ([0003], FIG. 1)
[Patent Document 7]
Japanese Patent No. 3287263 ([0014], FIG. 1)
[0005]
[Problems to be solved by the invention]
However, in the conventional semiconductor visual inspection apparatus or semiconductor visual inspection method, automation of visual inspection after wire bonding is performed by using a bonding shape or wire height of a gold wire (Au wire: about 20 to 40 μm) in the field of manufacturing a low-power IC. Although the measurement / inspection is almost achieved, the visual inspection of the aluminum wire (A1: several hundred μm) in the field of manufacturing a high-power power module is still performed by an operator.
[0006]
In this way, as a factor that the automation of the appearance inspection of the power module is not sufficiently achieved, for example, a thin line of several tens of μm is mixed with a thick line of several hundreds of μm that is considerably thicker than that due to the hybrid of ICs. And the lack of support for the wedge bonding method.
[0007]
For the height inspection, for example, as disclosed in Patent Document 7, a movable second movable lens is provided in addition to the first lens for obtaining an optical image of the inspection object. A semiconductor visual inspection apparatus is known in which a second movable lens is moved to image an inspection object, and the height of the inspection object is measured from the degree of coincidence of focus. However, in this semiconductor appearance inspection apparatus, if it is possible to cope with, for example, a thin line (gold line) due to measurement accuracy and structural restrictions, the measurement of the height of the thick line becomes impossible because it exceeds the measurement range. There is a problem.
[0008]
The present invention has been made to solve the above-described conventional problems, and even when different wiring materials are mixed, the appearance inspection can be automatically performed without relying on human hands, and the inspection time is shortened. Thus, it is an object to be solved to provide a semiconductor appearance inspection apparatus or a semiconductor appearance inspection method capable of reducing the inspection cost.
[0009]
[Means for Solving the Problems]
A semiconductor appearance inspection apparatus according to the present invention, which has been made to solve the above-described problems, includes an imaging means (camera) that has a movable lens that moves with respect to an inspection object and images the inspection object, and an inspection object. Along with this, there is provided a first table that moves in the horizontal direction, and a second table that is mounted on the first table and changes the height of the inspection object.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be specifically described with reference to the accompanying drawings. A semiconductor visual inspection apparatus (wire bonding visual inspection apparatus) according to an embodiment of the present invention is mounted on a first table configured to be able to move in the horizontal direction and the first table. The second table configured so that the upper surface table can move in the vertical direction, and a predetermined inspection item of the bonding wire of the inspection object placed on the upper surface table of the second table are imaged. Basic features include imaging means and acceptance / rejection judging means for comparing the imaging result of the imaging means with a reference value and judging acceptance / rejection for the predetermined inspection item.
[0011]
Embodiment 1 FIG.
1 and 2 are an elevation view and a plan view, respectively, of a semiconductor appearance inspection apparatus (hereinafter referred to as “appearance inspection apparatus” for short) according to the present invention. As shown in FIGS. 1 and 2, the appearance inspection apparatus 1 performs an appearance inspection of a frame 2 in which chips such as ICs wired by a wiring material are assembled.
[0012]
The appearance inspection apparatus 1 is moved in the horizontal direction by being driven by the X-axis motor 3 and the Y-axis motor 4 in a state where the frame 2 is mounted (via a YZ table 6 described later). An XY table 5 (first table) for positioning the frame 2 and a YZ table 6 mounted on the XY table 5 for positioning in a vertical direction (height direction) by moving in a direction that forms a narrow angle with the horizontal plane. (Second table) is provided. Hereinafter, the driving directions (horizontal directions) of the X-axis motor 3 and the Y-axis motor 4 are referred to as “X-axis direction” and “Y-axis direction”, respectively.
[0013]
Further, in the appearance inspection apparatus 1, a Z-axis motor 7 mounted on the XY table 5 and moving in the same direction (X-axis direction) as the X-axis motor 3 to drive the YZ table 6, and driving of the Z-axis motor 7 Thus, a table displacement plate 8 for generating displacement in the Y-axis direction (horizontal direction) on the YZ table 6 is provided. Further, the appearance inspection apparatus 1 includes an illuminating unit 11 that is positioned above the frame 2 that is an inspection target and that irradiates the frame 2 with illumination light, a camera 12 that captures the frame 2 (imaging unit), and a height. In order to perform measurement, a movable lens 13 that moves in the vertical direction is provided.
[0014]
Here, the YZ table 6 is provided with a frame suction means for sucking and fixing the frame 2 by a vacuum supplied through the vacuum pipe 9. Specifically, the YZ table 6 is provided with a plurality of frame suction holes located below the frame 2 that is the object to be inspected, and an external vacuum pump (not shown) is provided in the YZ table 6. A vacuum is supplied from the (vacuum means) through the vacuum pipe 9. Thus, the frame 2 is attracted and fixed to the YZ table 6 by the vacuum in the YZ table 6. Thereby, the deflection of the frame 2 and the displacement of the frame 2 during movement can be suppressed, and stable and highly accurate measurement and inspection can be performed.
[0015]
A semiconductor device appearance inspection method (semiconductor appearance inspection method) using the appearance inspection apparatus 1 will be described below with reference to FIGS. 1 and 2 as appropriate according to the flowchart shown in FIG. Note that the flowchart shown in FIG. 3 is for positioning, measuring, and inspecting the frame 2 that is the inspection object in the appearance inspection.
As shown in FIG. 3, in this appearance inspection method, first, the frame 2 as an inspection object is arranged at a predetermined (arbitrary) position on the YZ table 6, and the horizontal direction of the XY table 5 (X-axis direction and The frame 2 is positioned at a predetermined position by movement in the Y-axis direction). Specifically, the XY table 5 is moved in the X-axis direction by the X-axis motor 3, and the XY table 5 and consequently the frame 2 are positioned at a predetermined position in the X-axis direction (step S1). Further, the XY table 5 is moved in the Y-axis direction by the Y-axis motor 4, and the XY table 5 and consequently the frame 2 are positioned at a predetermined position in the Y-axis direction (step S2).
[0017]
Thereafter, an appearance inspection of the frame 2 is performed (step S4). Specifically, the illumination unit 11 irradiates the frame 2 with illumination light, and the camera 12 captures an image of the frame 2. Then, the shape (width, size, etc.) and position of the joint portion of the wiring material such as a gold wire connected to the IC chip or the like is measured, and an inspection such as pass / fail judgment is performed in comparison with a predetermined standard. Similarly, the wiring material height is measured and inspected.
[0018]
For example, as disclosed in Patent Document 7, the height of the wiring material is measured by moving the movable lens 13 for obtaining an optical image of the frame 2 to image the frame 2, and It is performed by an ordinary method such as measuring the height of the wiring material (frame 2) from the degree of coincidence. Then, it is determined whether measurement and inspection have been completed for all frames 2 (step S5). If not completed (NO), steps S1 to S4 are repeated. If completed (YES), the measurement and inspection are terminated.
[0019]
If the height of the wiring material exceeds the range that can be measured by moving the movable lens 13 during the above measurement and inspection, the height of the frame 2 is changed by moving the YZ table 6 and imaged. At a possible height, the frame 2 is positioned in the Z-axis direction (vertical direction) (step S3). In this case, the YZ table 6 that can move in a direction that forms a narrow angle θ with the horizontal plane is moved in the Y-axis direction (horizontal direction) via the table displacement plate 8 by the Z-axis motor 7 that drives in the X-axis direction. ) Power is applied. Then, the YZ table 6 is moved in the Z-axis direction by moving it in a direction that forms an angle θ with the horizontal plane, and the height of the frame 2 that is the inspection object is changed. If positioning in the X-axis direction, the Y-axis direction, and the Z-axis direction is performed at the same time, loss time can be minimized and an appearance inspection can be performed in a short time.
[0020]
The YZ table 6 is driven by displacement based on a sine curve having a horizontal axis as a straight line extending in a direction (X-axis direction) perpendicular to the drive direction (Y-axis direction). That is, the displacement curve of the table displacement plate 8 is a sin curve that does not generate an inflection point when moving and when the YZ table 6 is moved. Thus, stable positioning control without vibration can be performed when the YZ table 6 is moved and stopped, and measurement and inspection can be performed at high speed and with high accuracy.
[0021]
Here, if the amount of movement of the YZ table 6 in the Y-axis direction is Y, the height Z in the Z-axis direction is expressed by the following equation 1.
[Expression 1]
Z = Y * sinθ ………………………………………………………… Formula 1
Further, for example, when the movement amount in the X-axis direction of the table displacement plate 8 by the Z-axis motor 7 is X and the movement amount in the Y-axis direction perpendicular to the X-axis direction is Y, an arbitrary movement amount in the X-axis direction The relationship between x and the amount of movement y in the Y-axis direction and the amount of movement z in the Z-axis direction is expressed by the following expressions 2 and 3.
[Expression 2]
y = K * x ……………………………………………………………… Formula 2
However, K = Y / X
[Equation 3]
z = y * sinθ ………………………………………………………… Formula 3
[0022]
When the displacement curve of the table displacement plate 8 is a sin curve, the amount of movement y in the Y-axis direction is expressed by the following equation 4.
y = Y * (sin ((x / X−0.5) * π) +1) / 2...
The movement in the Y-axis direction on the YZ table 6 can be corrected in the horizontal direction when the height is changed by moving in the reverse direction on the XY table 5.
[0023]
Therefore, the height of the YZ table 6 can be arbitrarily set by controlling the amount of movement of the table displacement plate 8. Thereby, even when the shape of the frame 2 that is the inspection object and the shape and / or height of the wiring material are different, fine height setting can be performed, and highly accurate measurement and inspection can be performed.
[0024]
By making the appearance inspection apparatus 1 with such a structure, space can be used effectively, the application range of the inspection object can be expanded, and the increase in the size of the appearance inspection apparatus 1 can be suppressed. Or a relatively small appearance inspection apparatus 1 can be obtained. Further, the appearance inspection can be completely automated, and the inspection ability can be improved.
[0025]
Embodiment 2. FIG.
The second embodiment of the present invention will be described below. However, the basic configuration of the visual inspection apparatus according to the second embodiment or the visual inspection method using the same is the same as that of the visual inspection apparatus or the visual inspection method according to the first embodiment, and therefore, redundant description is avoided. Therefore, differences from the first embodiment will be mainly described below. The same applies to Embodiments 3 and 4 described later.
[0026]
In the second embodiment, measurement / inspection is performed using a frame 2 as shown in FIG. 4 as an inspection object.
As shown in FIG. 4, in the second embodiment, the frame 2 includes an IC chip 15, a power chip 16, a thin wire 17 (wiring material), and a thick wire 18 (wiring material). In the frame 2, the portion where the power chip 16 is assembled (power chip portion) is accompanied by a step in the height direction in which a part of the frame 2 is lower than the other portion (hereinafter referred to as “main body portion”). Have a structure. The IC chip 15 is attached to the main body portion of the frame 2, and the power chip 16 is attached to a lower portion of the frame (hereinafter referred to as “stepped portion”).
[0027]
Here, the IC chip 15 is connected to the frame 2 (main body part) by a thin line 17, and the power chip 16 is connected to the frame 2 (main body part) or another power chip 16 attached to the step part by a thick line 18. . As is clear from FIG. 4, the measurement / inspection range in the height direction is a range indicated by A in the thin line 17 connected to the IC chip 15, and a range indicated by B in the thick line 18 connected to the power chip 16. .
[0028]
In the case of such an inspection object (frame 2), the measurement / inspection of the thin wire 17 connected to the IC chip 15 is performed by the movement of the movable lens 13 (see FIG. 1) or the conventional appearance inspection apparatus. Adjustment) only. However, in the thick line 18 connected to the power chip 16, the measurement / inspection range in the height direction exceeds the range adjustable by the movable lens 13. Therefore, after changing the height of the frame 2 using the YZ table 6, the movable lens 13 is moved (adjusted) to measure and inspect the height. At this time, the height displaced by the YZ table 6 is corrected.
[0029]
Here, as the thin wire 17 connected to the IC chip 15, for example, a thin gold wire having a diameter of about 20 to 40 μm is used. Moreover, as the thick wire 18 connected to the power chip 16, for example, a thick aluminum wire having a diameter of about 200 to 400 μm is used. In addition, when the thick line 18 is an aluminum wire, the joining is generally wedge joining.
Therefore, as shown in FIG. 5, in this appearance inspection apparatus 1, the width W, the length L1, the length L2, and the angle ψ are set as characteristic values that characterize the shape of the wedge joint portion. The appearance is inspected.
[0030]
According to the appearance inspection apparatus or the inspection method using the same according to the second embodiment, the thin wire 17 that is a gold wire and the thick line 18 that is an aluminum wire are used in one appearance inspection apparatus 1 with the above configuration. Different types of inspections are possible. As a result, diversification of inspections is achieved, and automation of appearance inspections that have been conventionally performed by human eyes is realized.
[0031]
Embodiment 3 FIG.
Hereinafter, an appearance inspection apparatus according to a third embodiment of the present invention or an inspection method using the same will be described. When measuring and inspecting the shape of the wedge joint, the camera 12 (imaging means) captures the frame 2 as an inspection object to obtain an image of the wedge, and then extracts the contour of the wedge.
[0032]
As shown in FIG. 6, in the third embodiment, a quartic approximation curve is obtained by the least square method based on the pixel coordinates of the contour portion, contour extraction is performed, and the width W is determined at the thickest portion of the width portion. The length L1 of the joint is determined based on the thinnest part. According to the appearance inspection apparatus or the inspection method using the same according to the third embodiment, since the above function is provided, it is possible to stably extract the contour by eliminating image noise and the like, and highly accurate detection. Measurement and inspection can be stabilized.
[0033]
Embodiment 4 FIG.
Hereinafter, an appearance inspection apparatus according to Embodiment 4 of the present invention or an inspection method using the same will be described. In the fourth embodiment, the Z-axis motor 7 is a servo motor or a stepping motor. Further, as described above, if it is not necessary to perform arbitrary height control and only a binary height is obtained, a device such as a cylinder may be used instead of the motor. The table displacement plate 8 may be provided with a displacement curve having an arbitrary shape such as a curve or a straight line. Further, when the YZ table 6 is directly driven by the Z-axis motor 7, the table displacement plate 8 may not be provided. Further, the YZ table 6 may not have a structure having the angle θ, and may have a structure in which the height in the Z-axis direction is directly changed by the Z-axis motor 7, for example. Also according to the fourth embodiment, basically the same effects as in the first to third embodiments can be obtained.
[0034]
As described above, according to the first to fourth embodiments of the present invention, the cost can be reduced if the inspection object and the content of the inspection are preferably selected according to the purpose of use. Further, as described above, the application range of the appearance inspection apparatus 1 can be expanded to realize automation. With the configuration described above, the scope of application of visual inspection that has been performed by human eyes has been expanded, and automation of visual inspection, productivity improvement through improved capabilities, labor cost reduction, and measures against defects due to outflow of defective products ( Various measures such as cost reduction by cost reduction can be obtained.
[0035]
【The invention's effect】
According to the present invention, since the second table mounted on the first table and changing the height of the inspection object is provided, the appearance inspection can be automatically performed without relying on human hands, and the inspection time can be increased. This can shorten the inspection cost.
[Brief description of the drawings]
FIG. 1 is an elevation view of an appearance inspection apparatus according to the present invention.
FIG. 2 is a plan view of the appearance inspection apparatus shown in FIG.
FIG. 3 is a flowchart of an appearance inspection method according to the present invention.
FIG. 4 is an elevation view of a frame in which an appearance inspection is performed by the appearance inspection apparatus or the appearance inspection method according to the present invention.
FIG. 5 is a diagram showing a shape of a wedge joint portion of a thick line of a frame.
FIG. 6 is a diagram illustrating a contour portion of an image of a wedge joint portion.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Appearance inspection apparatus, 2 Frame, 3 X axis motor, 4 Y axis motor, 5 XY table, 6 YZ table, 7 Z axis motor, 8 Table displacement plate, 9 Vacuum piping, 10 Frame adsorption means, 11 Illumination means, 12 Camera, 13 movable lens, 15 IC chip, 16 power chip, 17 thin line, 18 thick line.

Claims (10)

検査対象物に対して移動する可動レンズを有し、該検査対象物を撮像する撮像手段と、
検査対象物を伴って水平方向に移動する第１のテーブルと、
第１のテーブルに搭載され、検査対象物の高さを変化させる第２のテーブルとを備えていることを特徴とする半導体外観検査装置。An imaging unit having a movable lens that moves relative to the inspection object, and that images the inspection object;
A first table that moves in a horizontal direction with the inspection object;
A semiconductor visual inspection apparatus, comprising: a second table mounted on the first table and changing the height of the inspection object. 第２のテーブルが、水平方向の運動を行う駆動手段により水平方向に駆動されて水平面と狭小な角度をなす方向に移動することを特徴とする請求項１に記載の半導体外観検査装置。2. The semiconductor appearance inspection apparatus according to claim 1, wherein the second table is driven in a horizontal direction by a driving means for performing a horizontal movement and moves in a direction that forms a narrow angle with a horizontal plane. 第２のテーブルが、水平面内において上記駆動方向と垂直な方向に伸びる直線を横軸とするｓｉｎ曲線に基づく変位により駆動されることを特徴とする請求項２に記載の半導体外観検査装置。3. The semiconductor appearance inspection apparatus according to claim 2, wherein the second table is driven by a displacement based on a sin curve having a horizontal axis as a straight line extending in a direction perpendicular to the driving direction in a horizontal plane. 第２のテーブルが、検査対象物を任意の高さに配置することができるようになっていることを特徴とする請求項１〜３のいずれか１つに記載の半導体外観検査装置。The semiconductor visual inspection apparatus according to any one of claims 1 to 3, wherein the second table is configured such that the inspection object can be arranged at an arbitrary height. 第２のテーブルが、その上に搭載された検査対象物を吸着固定する手段を備えていることを特徴とする請求項１〜３のいずれか１つに記載の半導体外観検査装置。The semiconductor visual inspection apparatus according to any one of claims 1 to 3, wherein the second table includes means for sucking and fixing an inspection object mounted thereon. 細線及び太線の２種類の配線材の接合部の形状及び高さの測定及び検査を行うようになっていることを特徴とする請求項１に記載の半導体外観検査装置。2. The semiconductor appearance inspection apparatus according to claim 1, wherein measurement and inspection of the shape and height of the joint portion of two kinds of wiring materials, thin wire and thick wire, are performed. 太線のウェッジ接合部の形状の測定及び検査を行うようになっていることを特徴とする請求項６に記載の半導体外観検査装置。7. The semiconductor appearance inspection apparatus according to claim 6, wherein the shape and measurement of the wedge joint portion of a thick line is performed. 撮像手段によって撮像された太線のウェッジ接合部の画像の形状の輪郭抽出に最小二乗法による四次曲線近似を用いることを特徴とする請求項７に記載の半導体外観検査装置。8. The semiconductor appearance inspection apparatus according to claim 7, wherein a quadratic curve approximation by a least square method is used for extracting a contour of a shape of an image of a thick wedge joint imaged by an imaging means. 水平方向に移動することができるように構成された第１のテーブルと、
第１のテーブルに搭載され、その上面テーブルが上下方向に移動することができるように構成された第２のテーブルと、
第２のテーブルの上面テーブル上に載置された検査対象物のボンディングワイヤの所定の検査項目を撮像する撮像手段と、
撮像手段の撮像結果を基準値と比較し、前記所定の検査項目に関する合否を判断する合否判断手段とを備えていることを特徴とする半導体外観検査装置。A first table configured to be able to move horizontally;
A second table mounted on the first table and configured so that the upper surface table can move in the vertical direction;
Imaging means for imaging a predetermined inspection item of the bonding wire of the inspection object placed on the upper surface table of the second table;
A semiconductor appearance inspection apparatus, comprising: a pass / fail determination unit that compares an imaging result of the imaging unit with a reference value to determine pass / fail regarding the predetermined inspection item. 請求項１〜９のいずれか１つに記載の半導体外観検査装置を用いて半導体装置の外観を自動的に検査することを特徴とする半導体外観検査方法。A semiconductor appearance inspection method, wherein the appearance of a semiconductor device is automatically inspected using the semiconductor appearance inspection apparatus according to claim 1.
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Publication number Priority date Publication date Assignee Title
JP2012173202A (en) * 2011-02-23 2012-09-10 Joyo Machine Co Ltd Method and apparatus for three-dimensional positioning of wire bond
JP2016021517A (en) * 2014-07-15 2016-02-04 キヤノンマシナリー株式会社 Bonding distance measuring method, bonding strength evaluation method, bonding distance measuring device and bonding strength evaluation device
CN109060835A (en) * 2018-08-24 2018-12-21 奇瑞万达贵州客车股份有限公司 A kind of appearance inspection device of chip

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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JP2016021517A (en) * 2014-07-15 2016-02-04 キヤノンマシナリー株式会社 Bonding distance measuring method, bonding strength evaluation method, bonding distance measuring device and bonding strength evaluation device
CN109060835A (en) * 2018-08-24 2018-12-21 奇瑞万达贵州客车股份有限公司 A kind of appearance inspection device of chip

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