DE3576244D1 - Integrierte speichervorrichtungen. - Google Patents

Integrierte speichervorrichtungen.

Info

Publication number
DE3576244D1
DE3576244D1 DE8585309201T DE3576244T DE3576244D1 DE 3576244 D1 DE3576244 D1 DE 3576244D1 DE 8585309201 T DE8585309201 T DE 8585309201T DE 3576244 T DE3576244 T DE 3576244T DE 3576244 D1 DE3576244 D1 DE 3576244D1
Authority
DE
Germany
Prior art keywords
buried layer
storage devices
integrated storage
memory
memory cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8585309201T
Other languages
English (en)
Inventor
Drew Wanderman
Matthew Weinberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Application granted granted Critical
Publication of DE3576244D1 publication Critical patent/DE3576244D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/74Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B10/00Static random access memory [SRAM] devices
    • H10B10/10SRAM devices comprising bipolar components
DE8585309201T 1984-12-18 1985-12-17 Integrierte speichervorrichtungen. Expired - Lifetime DE3576244D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US68328884A 1984-12-18 1984-12-18

Publications (1)

Publication Number Publication Date
DE3576244D1 true DE3576244D1 (de) 1990-04-05

Family

ID=24743373

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585309201T Expired - Lifetime DE3576244D1 (de) 1984-12-18 1985-12-17 Integrierte speichervorrichtungen.

Country Status (4)

Country Link
EP (1) EP0185544B1 (de)
JP (1) JPS61150266A (de)
AT (1) ATE50665T1 (de)
DE (1) DE3576244D1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0727974B2 (ja) * 1988-04-26 1995-03-29 三菱電機株式会社 半導体記憶装置の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS564263A (en) * 1979-06-25 1981-01-17 Hitachi Ltd Semiconductor memory
JPS5953711B2 (ja) * 1980-03-25 1984-12-26 日本電気株式会社 メモリセル

Also Published As

Publication number Publication date
JPS61150266A (ja) 1986-07-08
EP0185544A1 (de) 1986-06-25
ATE50665T1 (de) 1990-03-15
EP0185544B1 (de) 1990-02-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee