DE3570557D1 - Trench transistor - Google Patents
Trench transistorInfo
- Publication number
- DE3570557D1 DE3570557D1 DE8585905997T DE3570557T DE3570557D1 DE 3570557 D1 DE3570557 D1 DE 3570557D1 DE 8585905997 T DE8585905997 T DE 8585905997T DE 3570557 T DE3570557 T DE 3570557T DE 3570557 D1 DE3570557 D1 DE 3570557D1
- Authority
- DE
- Germany
- Prior art keywords
- trench transistor
- trench
- transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66613—Lateral single gate silicon transistors with a gate recessing step, e.g. using local oxidation
- H01L29/66621—Lateral single gate silicon transistors with a gate recessing step, e.g. using local oxidation using etching to form a recess at the gate location
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66787—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Electrodes Of Semiconductors (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US67530584A | 1984-11-27 | 1984-11-27 | |
PCT/US1985/002244 WO1986003341A1 (en) | 1984-11-27 | 1985-11-13 | Trench transistor |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3570557D1 true DE3570557D1 (en) | 1989-06-29 |
Family
ID=24709896
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8585905997T Expired DE3570557D1 (en) | 1984-11-27 | 1985-11-13 | Trench transistor |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP0203146B1 (de) |
JP (1) | JPH0626251B2 (de) |
KR (1) | KR940005451B1 (de) |
CA (1) | CA1236932A (de) |
DE (1) | DE3570557D1 (de) |
ES (2) | ES8800512A1 (de) |
IE (1) | IE56967B1 (de) |
WO (1) | WO1986003341A1 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01151268A (ja) * | 1987-12-08 | 1989-06-14 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
US5281547A (en) * | 1989-05-12 | 1994-01-25 | Oki Electric Industry Co., Ltd. | Method for manufacturing a field effect transistor |
JP2661792B2 (ja) * | 1989-05-12 | 1997-10-08 | 沖電気工業株式会社 | 電界効果トランジスタの製造方法 |
JP2994670B2 (ja) | 1989-12-02 | 1999-12-27 | 忠弘 大見 | 半導体装置及びその製造方法 |
JP2790362B2 (ja) * | 1990-06-04 | 1998-08-27 | キヤノン株式会社 | 半導体装置 |
FR2720191B1 (fr) * | 1994-05-18 | 1996-10-18 | Michel Haond | Transistor à effet de champ à grille isolée, et procédé de fabrication correspondant. |
DE19743342C2 (de) * | 1997-09-30 | 2002-02-28 | Infineon Technologies Ag | Feldeffekttransistor hoher Packungsdichte und Verfahren zu seiner Herstellung |
FR2791810B1 (fr) * | 1999-03-31 | 2001-06-22 | France Telecom | Procede de fabrication d'une heterostructure planaire |
EP1091413A3 (de) * | 1999-10-06 | 2005-01-12 | Lsi Logic Corporation | Vollständig verarmter und invertierter CMOSFET mit vertikalem Kanal und dualem Gate |
US7282401B2 (en) | 2005-07-08 | 2007-10-16 | Micron Technology, Inc. | Method and apparatus for a self-aligned recessed access device (RAD) transistor gate |
US7867851B2 (en) * | 2005-08-30 | 2011-01-11 | Micron Technology, Inc. | Methods of forming field effect transistors on substrates |
US7700441B2 (en) * | 2006-02-02 | 2010-04-20 | Micron Technology, Inc. | Methods of forming field effect transistors, methods of forming field effect transistor gates, methods of forming integrated circuitry comprising a transistor gate array and circuitry peripheral to the gate array, and methods of forming integrated circuitry comprising a transistor gate array including first gates and second grounded isolation gates |
US7602001B2 (en) | 2006-07-17 | 2009-10-13 | Micron Technology, Inc. | Capacitorless one transistor DRAM cell, integrated circuitry comprising an array of capacitorless one transistor DRAM cells, and method of forming lines of capacitorless one transistor DRAM cells |
US7923373B2 (en) | 2007-06-04 | 2011-04-12 | Micron Technology, Inc. | Pitch multiplication using self-assembling materials |
JP5258230B2 (ja) | 2007-08-28 | 2013-08-07 | セイコーインスツル株式会社 | 半導体装置の製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS506287A (de) * | 1973-05-18 | 1975-01-22 | ||
JPS5499574A (en) * | 1978-01-24 | 1979-08-06 | Pioneer Electronic Corp | Method of fabricating field effect transistor |
US4296429A (en) * | 1978-08-09 | 1981-10-20 | Harris Corporation | VMOS Transistor and method of fabrication |
US4407058A (en) * | 1981-05-22 | 1983-10-04 | International Business Machines Corporation | Method of making dense vertical FET's |
US4419811A (en) * | 1982-04-26 | 1983-12-13 | Acrian, Inc. | Method of fabricating mesa MOSFET using overhang mask |
US4503598A (en) * | 1982-05-20 | 1985-03-12 | Fairchild Camera & Instrument Corporation | Method of fabricating power MOSFET structure utilizing self-aligned diffusion and etching techniques |
-
1985
- 1985-11-13 JP JP60505312A patent/JPH0626251B2/ja not_active Expired - Lifetime
- 1985-11-13 EP EP85905997A patent/EP0203146B1/de not_active Expired
- 1985-11-13 KR KR1019860700502A patent/KR940005451B1/ko not_active IP Right Cessation
- 1985-11-13 DE DE8585905997T patent/DE3570557D1/de not_active Expired
- 1985-11-13 WO PCT/US1985/002244 patent/WO1986003341A1/en active IP Right Grant
- 1985-11-26 ES ES549295A patent/ES8800512A1/es not_active Expired
- 1985-11-26 IE IE2964/85A patent/IE56967B1/en not_active IP Right Cessation
- 1985-11-26 CA CA000496248A patent/CA1236932A/en not_active Expired
-
1987
- 1987-06-11 ES ES557586A patent/ES8800789A1/es not_active Expired
Also Published As
Publication number | Publication date |
---|---|
EP0203146A1 (de) | 1986-12-03 |
CA1236932A (en) | 1988-05-17 |
IE56967B1 (en) | 1992-02-12 |
JPH0626251B2 (ja) | 1994-04-06 |
IE852964L (en) | 1986-05-27 |
JPS62500831A (ja) | 1987-04-02 |
ES8800789A1 (es) | 1987-12-01 |
ES8800512A1 (es) | 1987-11-16 |
EP0203146B1 (de) | 1989-05-24 |
KR940005451B1 (ko) | 1994-06-18 |
ES557586A0 (es) | 1987-12-01 |
ES549295A0 (es) | 1987-11-16 |
KR880700473A (ko) | 1988-03-15 |
WO1986003341A1 (en) | 1986-06-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8339 | Ceased/non-payment of the annual fee |