DE3566071D1 - Printed circuit board load-unload system and method - Google Patents
Printed circuit board load-unload system and methodInfo
- Publication number
- DE3566071D1 DE3566071D1 DE8585300293T DE3566071T DE3566071D1 DE 3566071 D1 DE3566071 D1 DE 3566071D1 DE 8585300293 T DE8585300293 T DE 8585300293T DE 3566071 T DE3566071 T DE 3566071T DE 3566071 D1 DE3566071 D1 DE 3566071D1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- printed circuit
- board load
- unload system
- unload
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59007922A JPS60153306A (ja) | 1984-01-21 | 1984-01-21 | プリント板給排装置 |
JP59007923A JPS60153307A (ja) | 1984-01-21 | 1984-01-21 | プリント板給排装置 |
JP59007924A JPS60153308A (ja) | 1984-01-21 | 1984-01-21 | プリント板給排装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3566071D1 true DE3566071D1 (en) | 1988-12-08 |
Family
ID=27277799
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8585300293T Expired DE3566071D1 (en) | 1984-01-21 | 1985-01-16 | Printed circuit board load-unload system and method |
Country Status (5)
Country | Link |
---|---|
US (1) | US4725182A (de) |
EP (1) | EP0152183B1 (de) |
KR (1) | KR890004551B1 (de) |
CA (1) | CA1234924A (de) |
DE (1) | DE3566071D1 (de) |
Families Citing this family (59)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1251476A (en) * | 1984-10-29 | 1989-03-21 | Naoyuki Yano | Plate stocker |
JPS61188331A (ja) * | 1985-02-15 | 1986-08-22 | Nippon Texas Instr Kk | 物体取出装置 |
US4869636A (en) * | 1987-06-24 | 1989-09-26 | Reid-Ashman Manufacturing, Inc. | Handler for IC packages |
JPH02210223A (ja) * | 1988-10-26 | 1990-08-21 | Kurabo Ind Ltd | 調液方法、調液装置及び容器送り装置 |
US5094584A (en) * | 1989-04-06 | 1992-03-10 | Hewlett-Packard Company | Method and apparatus for automatically changing printed circuit board test fixtures |
US5104277A (en) * | 1989-04-06 | 1992-04-14 | Hewlett-Packard Company | Method and apparatus for automatically changing printed circuit board test fixtures |
KR930006593B1 (ko) * | 1990-10-20 | 1993-07-21 | 현대 전자 산업 주식회사 | 반도체 리드 프레임 로우더용 헤드 유니트 |
WO1992017047A1 (fr) * | 1991-03-18 | 1992-10-01 | Fujitsu Limited | Systeme et procede pour la production de cartes a circuits imprimes |
US5160567A (en) * | 1991-04-15 | 1992-11-03 | Allied-Signal Inc. | System and method for manufacturing copper clad glass epoxy laminates |
DE9317228U1 (de) * | 1993-11-10 | 1994-03-10 | Kuttler Handhabungstechnik GmbH, 78083 Dauchingen | Vorrichtung zum Handhaben von Leiterplatten |
US5470795A (en) * | 1994-02-25 | 1995-11-28 | Shushurin; Vladimir V. | Method of connecting terminals of a plastic-encapsulated power transistor to a printed-circuit board |
US5562382A (en) * | 1994-07-18 | 1996-10-08 | Kaijo Corporation | Substrate transport apparatus and substrate transport path adjustment method |
US6942738B1 (en) * | 1996-07-15 | 2005-09-13 | Semitool, Inc. | Automated semiconductor processing system |
KR100434458B1 (ko) * | 1996-11-29 | 2004-11-06 | 삼성전자주식회사 | 다기종혼류프린트보드어셈블리생산시스템의엘리베이터 |
JP3354063B2 (ja) * | 1996-11-29 | 2002-12-09 | 株式会社新川 | リードフレーム供給方法及び供給装置 |
US5829942A (en) * | 1997-02-10 | 1998-11-03 | Automation Technologies Industries | Apparatus for loading and unloading circuit boards along a conveyor system |
US6736148B2 (en) | 1997-05-05 | 2004-05-18 | Semitool, Inc. | Automated semiconductor processing system |
DE69825365T2 (de) * | 1997-06-05 | 2005-07-21 | Hitachi High-Tech Instruments Co., Ltd. | Einrichtung zur Montage von elektronischen Bauteilen und Speisevorrichtung dafür |
FR2775098B1 (fr) * | 1998-02-16 | 2000-05-12 | Leroux Gilles Sa | Machine de personnalisation lineaire |
US6062799A (en) * | 1998-06-23 | 2000-05-16 | Samsung Electronics Co., Ltd. | Apparatus and method for automatically loading or unloading printed circuit boards for semiconductor modules |
US6250454B1 (en) | 1999-06-23 | 2001-06-26 | Danville Automation Holdings, Llc | Storage buffer for a multi lane conveyor |
DE29911985U1 (de) * | 1999-07-09 | 2000-01-13 | Kuttler, Hans-Jürgen, 78083 Dauchingen | Anlage zum Handhaben von Leiterplatten |
JP2001157935A (ja) * | 1999-12-02 | 2001-06-12 | Sumitomo Wiring Syst Ltd | 昇降式台車搬送装置 |
US6643917B1 (en) * | 2000-01-19 | 2003-11-11 | Delaware Capital Formation | Redundant system for assembly of electronic components to substrates |
EP1332349A4 (de) * | 2000-07-07 | 2008-12-17 | Semitool Inc | Automatisiertes verarbeitungssystem |
SE521841C2 (sv) * | 2001-04-27 | 2003-12-09 | Mydata Automation Ab | Metod för hantering av kort i en komponentmonteringsmaskin och komponentmonteringsmaskin för utförande av metoden |
US20040148767A1 (en) * | 2001-05-23 | 2004-08-05 | Mohammad Mehdianpour | Assembly system and method for assembling components on substrates |
US20040143963A1 (en) * | 2001-05-23 | 2004-07-29 | Mohammad Mehdianpour | Assembly system and method for assembling components on substrates |
KR100437967B1 (ko) * | 2001-06-22 | 2004-06-26 | 미래산업 주식회사 | 트레이 피더용 스택커 |
DE10225430A1 (de) * | 2002-06-07 | 2003-12-24 | Siemens Ag | Bestücksystem und Verfahren zum Bestücken von Substraten mit Bauelementen |
US20050077217A1 (en) * | 2003-03-28 | 2005-04-14 | Hillerich Thomas A. | Carrier for mail and/or the like thin objects |
US20060000752A1 (en) * | 2003-03-28 | 2006-01-05 | Northrop Grumman Corporation | Stack correction system and method |
US7195236B2 (en) * | 2003-03-28 | 2007-03-27 | Northrop Grumman Corporation | Automated induction systems and methods for mail and/or other objects |
EP1636121A4 (de) * | 2003-05-13 | 2007-11-14 | Northrop Grumman Corp | Verbessertes vorverarbeitungssystem für objektzuführvorrichtung |
US20060099065A1 (en) * | 2004-08-27 | 2006-05-11 | Northrop Grumman Corporation | Preparation operator flex-station for carrier preparation |
EP1794073B1 (de) * | 2004-09-24 | 2014-03-05 | Northrop Grumman Systems Corporation | Kippschutzvorrichtung für post und/oder ähnliches |
JP4904722B2 (ja) * | 2005-06-02 | 2012-03-28 | 株式会社Ihi | 基板搬送装置 |
WO2007100686A2 (en) * | 2006-02-24 | 2007-09-07 | Northrop Grumman Systems Corporation | Automated flats divider |
FR2898880B1 (fr) * | 2006-03-22 | 2008-05-30 | Datacard Corp | Machine lineaire de traitement d'objets portables et procede de traitement d'objets portables |
US8132317B2 (en) * | 2007-06-11 | 2012-03-13 | Research In Motion Limited | Apparatus for manufacture of electronic assemblies |
JP2009056656A (ja) * | 2007-08-30 | 2009-03-19 | Mimaki Engineering Co Ltd | 印刷装置 |
JP5196918B2 (ja) * | 2007-08-30 | 2013-05-15 | 株式会社ミマキエンジニアリング | 印刷装置の製造方法 |
US7766171B2 (en) | 2008-02-28 | 2010-08-03 | Northrop Grumman Systems Corporation | Rigid storage tray for flat and letter mail |
US8555784B2 (en) | 2008-11-19 | 2013-10-15 | Illinois Tool Works Inc. | Method of processing electronic substrates using vertically separated pass through conveyor system |
WO2011058643A1 (ja) * | 2009-11-13 | 2011-05-19 | 株式会社データンク | フラッシュメモリ用マガジン |
KR101619466B1 (ko) * | 2010-03-26 | 2016-05-11 | 삼성전자주식회사 | 반도체 소자 실장 장치 |
JP5440483B2 (ja) | 2010-12-09 | 2014-03-12 | パナソニック株式会社 | 電子部品実装システムおよび電子部品実装方法 |
JP5323137B2 (ja) * | 2011-06-14 | 2013-10-23 | ヤマハ発動機株式会社 | 段取り方法、部品実装方法および部品実装システム |
KR101923531B1 (ko) | 2011-12-23 | 2018-11-30 | 삼성전자주식회사 | 반도체 칩 본딩 장치 |
US9285416B2 (en) * | 2012-04-02 | 2016-03-15 | Samsung Electronics Co., Ltd. | Apparatus and method for manufacturing substrates |
US10271437B2 (en) | 2014-08-14 | 2019-04-23 | The United States Of America As Represented By The Secretary Of The Army | Motion-based reconfigurable microelectronics system |
CN106335730A (zh) * | 2015-07-17 | 2017-01-18 | 辽宁聚龙海目星智能物流科技有限公司 | 一种内流转式立体仓库 |
CN105346747A (zh) * | 2015-11-30 | 2016-02-24 | 苏州康贝尔电子设备有限公司 | 一种双收板机 |
WO2019040629A1 (en) | 2017-08-22 | 2019-02-28 | Universal Instruments Corporation | IMPROVED CIRCUIT BOARD TRANSPORT |
DE102019211603B4 (de) * | 2019-08-01 | 2021-05-20 | Asys Automatisierungssysteme Gmbh | Substratmagazin, Substratmagazinsystem und Substratbestückungsanlage |
DE102019217033B4 (de) * | 2019-11-05 | 2022-06-30 | Asys Automatisierungssysteme Gmbh | Be- und Entladeeinrichtung für ein Substratmagazin, Substratmagazinsystem |
WO2021087795A1 (zh) * | 2019-11-06 | 2021-05-14 | 苏州得奥自动化科技有限公司 | 一种注塑薄板件的自动装箱机 |
DE102022129638B3 (de) | 2022-11-09 | 2024-05-02 | Asys Automatisierungssysteme Gmbh | Entladeeinrichtung für ein Substratmagazin, Substratmagazinsystem |
US20240192261A1 (en) * | 2022-12-08 | 2024-06-13 | Wolfspeed, Inc. | Multiple transport level tester system |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1068833A (en) * | 1963-04-19 | 1967-05-17 | Donald Mayer King | Improvements in or relating to storage systems |
US3902615A (en) * | 1973-03-12 | 1975-09-02 | Computervision Corp | Automatic wafer loading and pre-alignment system |
US3850316A (en) * | 1974-01-28 | 1974-11-26 | Columbia Machine | Apparatus for loading and unloading vertically stacked racks |
US3945505A (en) * | 1974-07-08 | 1976-03-23 | Motorola, Inc. | Indexing apparatus |
US4030622A (en) * | 1975-05-23 | 1977-06-21 | Pass-Port Systems, Inc. | Wafer transport system |
US4367915A (en) * | 1978-06-29 | 1983-01-11 | Georges Michael P | Automatic microscope slide |
GB2049616B (en) * | 1979-05-22 | 1982-12-22 | Marconi Co Ltd | Manipulator mechanisms |
DE2937061C2 (de) * | 1979-09-13 | 1981-11-12 | Pfaff Industriemaschinen Gmbh, 6750 Kaiserslautern | Handhabungsgerät mit einer Greifvorrichtung |
US4293249A (en) * | 1980-03-03 | 1981-10-06 | Texas Instruments Incorporated | Material handling system and method for manufacturing line |
US4449625A (en) * | 1980-10-01 | 1984-05-22 | Hauni-Werke Korber & Co. Kg. | Apparatus for transporting trays for cigarettes or the like |
JPS5836810A (ja) * | 1981-08-28 | 1983-03-03 | Toshiba Corp | 紙葉類群の搬送装置 |
US4550239A (en) * | 1981-10-05 | 1985-10-29 | Tokyo Denshi Kagaku Kabushiki Kaisha | Automatic plasma processing device and heat treatment device |
DE3201086A1 (de) * | 1982-01-15 | 1983-07-28 | Siemens AG, 1000 Berlin und 8000 München | Fertigungseinrichtung zur bearbeitung von kleinbauteilen, insbesondere von elektrischen bauelementen |
US4558983A (en) * | 1983-10-24 | 1985-12-17 | Usm Corporation | Automatic board handling mechanism |
DE3344483A1 (de) * | 1983-12-06 | 1985-06-20 | Siemens AG, 1000 Berlin und 8000 München | Einrichtung zum be- und entladen von bearbeitungseinrichtungen fuer leiterplatten, insbesondere bauelemente-bestueckeinrichtungen |
-
1985
- 1985-01-15 CA CA000472116A patent/CA1234924A/en not_active Expired
- 1985-01-16 DE DE8585300293T patent/DE3566071D1/de not_active Expired
- 1985-01-16 EP EP85300293A patent/EP0152183B1/de not_active Expired
- 1985-01-17 KR KR1019850000266A patent/KR890004551B1/ko not_active IP Right Cessation
-
1987
- 1987-06-08 US US07/057,647 patent/US4725182A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR890004551B1 (ko) | 1989-11-13 |
EP0152183A1 (de) | 1985-08-21 |
KR850006303A (ko) | 1985-10-02 |
US4725182A (en) | 1988-02-16 |
CA1234924A (en) | 1988-04-05 |
EP0152183B1 (de) | 1988-11-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |