DE3537551C2 - - Google Patents

Info

Publication number
DE3537551C2
DE3537551C2 DE3537551A DE3537551A DE3537551C2 DE 3537551 C2 DE3537551 C2 DE 3537551C2 DE 3537551 A DE3537551 A DE 3537551A DE 3537551 A DE3537551 A DE 3537551A DE 3537551 C2 DE3537551 C2 DE 3537551C2
Authority
DE
Germany
Prior art keywords
bond
capillary
bonding
wire
elongated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE3537551A
Other languages
German (de)
English (en)
Other versions
DE3537551A1 (de
Inventor
Werner Deubzer
Farhad Les Brenets Ch Farassat
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Newfrey LLC
Original Assignee
Delvotec Sa Les Brenets Ch
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delvotec Sa Les Brenets Ch filed Critical Delvotec Sa Les Brenets Ch
Priority to DE19853537551 priority Critical patent/DE3537551A1/de
Publication of DE3537551A1 publication Critical patent/DE3537551A1/de
Application granted granted Critical
Publication of DE3537551C2 publication Critical patent/DE3537551C2/de
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01076—Osmium [Os]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
DE19853537551 1985-10-22 1985-10-22 Bondkapillare sowie verfahren zum bonden unter verwendung einer derartigen bondkapillare Granted DE3537551A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19853537551 DE3537551A1 (de) 1985-10-22 1985-10-22 Bondkapillare sowie verfahren zum bonden unter verwendung einer derartigen bondkapillare

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19853537551 DE3537551A1 (de) 1985-10-22 1985-10-22 Bondkapillare sowie verfahren zum bonden unter verwendung einer derartigen bondkapillare

Publications (2)

Publication Number Publication Date
DE3537551A1 DE3537551A1 (de) 1987-04-23
DE3537551C2 true DE3537551C2 (cg-RX-API-DMAC7.html) 1987-07-16

Family

ID=6284173

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19853537551 Granted DE3537551A1 (de) 1985-10-22 1985-10-22 Bondkapillare sowie verfahren zum bonden unter verwendung einer derartigen bondkapillare

Country Status (1)

Country Link
DE (1) DE3537551A1 (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3744099C1 (en) * 1987-12-24 1989-02-23 Ant Nachrichtentech Bonding head
US8020746B2 (en) 2006-09-05 2011-09-20 Technische Universitaet Berlin Method and device for controlling the generation of ultrasonic wire bonds

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1281812C2 (de) * 1961-08-30 1973-04-26 Western Electric Co Vorrichtung zum anschweissen von duennen draehten an halbleiterbauteile mit hilfe der presschweissung (kalt- und warmschweissung), mit einer zufuhr fuer den draht an einem, den pressdruck auf den draht uebertragenden schweisskopf, der an seinem schweissende zur aufnahme des drahtes profiliert ist
US3357090A (en) * 1963-05-23 1967-12-12 Transitron Electronic Corp Vibratory welding tip and method of welding
US3459355A (en) * 1967-10-11 1969-08-05 Gen Motors Corp Ultrasonic welder for thin wires
FR2412943A1 (fr) * 1977-12-20 1979-07-20 Thomson Csf Procede de realisation de connexions d'un dispositif semi-conducteur sur embase, appareil pour la mise en oeuvre du procede, et dispositif semi-conducteur obtenu par ce procede
PL132515B1 (en) * 1980-07-24 1985-03-30 Przemyslowy Inst Elektroniki Apparatus for fast realization of wire connections between structure and case of semiconductor elements and integrated circuits using thermocompression method
JPS5963737A (ja) * 1982-10-04 1984-04-11 Hitachi Ltd 布線の接続方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3744099C1 (en) * 1987-12-24 1989-02-23 Ant Nachrichtentech Bonding head
US8020746B2 (en) 2006-09-05 2011-09-20 Technische Universitaet Berlin Method and device for controlling the generation of ultrasonic wire bonds

Also Published As

Publication number Publication date
DE3537551A1 (de) 1987-04-23

Similar Documents

Publication Publication Date Title
EP0144915B1 (de) Verfahren zum Anheften eines dünnen elektrisch leitenden Drahtes an elektronischen Bauteilen, insbesondere Halbleiterbauelementen
DE69838935T2 (de) Herstellungsverfahren für halbleiterscheiben, halbleiterbauelemente und chipkarten
DE2858153C2 (de) Verfahren zum Ankleben eines elektrischen Bauteils mit einer flächenförmigen Elektrode an eine Trägerplatte
DE4131413A1 (de) Bondierungsverfahren fuer halbleiterchips
DE19732236A1 (de) Kapillare für ein Drahtbondgerät
DE19717368A1 (de) Drahtbondverfahren, Drahtbondvorrichtung und mit denselben hergestellte Halbleitereinrichtung
US5058798A (en) Method for forming bump on semiconductor elements
EP0867932B1 (de) Verfahren zur Herstellung von Bonddrahtverbindungen
DE2104207C3 (de) Verfahren zum Verbinden eines Kontaktierungsdrahtes
DE3537551C2 (cg-RX-API-DMAC7.html)
DE112021004272T5 (de) Integriertes schaltkreis-bond-pad mit zahnstruktur aus mehreren materialien
DE3780630T2 (de) Verbindung von elektronischen bauteilen untereinander.
DE19646476C2 (de) Verbindungsstruktur
DE102006025868A1 (de) Bonddraht und Bondverbindung mit einem Bonddraht
DE202010000637U1 (de) Bondmaschine mit Spule
EP2133915A1 (de) Halbleiteranordnung mit besonders gestalteten Bondleitungen und Verfahren zum Herstellen einer solchen Anordnung
DE102007013100A1 (de) Verfahren zur Herstellung einer Wedge Wedge Drahtbrücke
DE4123911C1 (cg-RX-API-DMAC7.html)
DE3028570C2 (cg-RX-API-DMAC7.html)
DE19809081A1 (de) Verfahren und Kontaktstelle zur Herstellung einer elektrischen Verbindung
EP0020857B1 (de) Verfahren und Vorrichtung zur Herstellung eines planaren Halbleiterbauelements
DE1540268B2 (de) Verfahren zur herstellung einer thermodruckverbindung zwischen metallen und nicht metallischen stoffen und vorrichtung zur durdurchfuehrung des verfahrens
DE4333956A1 (de) Verfahren zur Anbringung von integrierten Schaltungschips mit TAB-Struktur auf ein Substrat
DE4021031C2 (de) Verfahren zur Herstellung eines Halbleiterbauelementes
DE69608007T2 (de) Verfahren zum Verbinden eines Magnetkopfelements mit einem Trägerbalken

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8363 Opposition against the patent
8327 Change in the person/name/address of the patent owner

Owner name: EMHART INDUSTRIES, INC., FARMINGTON, CONN., US

8328 Change in the person/name/address of the agent

Free format text: POPP, E., DIPL.-ING.DIPL.-WIRTSCH.-ING.DR.RER.POL. SAJDA, W., DIPL.-PHYS., 8000 MUENCHEN BOLTE, E.,DIPL.-ING., 2800 BREMEN REINLAENDER, C., DIPL.-ING. DR.-ING. BOHNENBERGER, J., DIPL.-ING.DR.PHIL.NAT., 8000 MUENCHEN MOELLER, F., DIPL.-ING., PAT.-ANWAELTE, 2800 BREMEN

8365 Fully valid after opposition proceedings
8327 Change in the person/name/address of the patent owner

Owner name: EMHART INC., NEWARK, DEL., US

8328 Change in the person/name/address of the agent

Free format text: PAGENBERG, J., DR.JUR. FROHWITTER, B., DIPL.-ING., RECHTSANWAELTE GEISSLER, B., DIPL.-PHYS.DR.JUR.,PAT.- U. RECHTSANW. BARDEHLE, H., DIPL.-ING. DOST, W., DIPL.-CHEM. DR.RER.NAT. ALTENBURG, U., DIPL.-PHYS., PAT.-ANWAELTE, 8000 MUENCHEN

8327 Change in the person/name/address of the patent owner

Owner name: F & K DELVOTEC BONDTECHNIK GMBH, 82041 OBERHACHING