DE3531631C2 - - Google Patents
Info
- Publication number
- DE3531631C2 DE3531631C2 DE3531631A DE3531631A DE3531631C2 DE 3531631 C2 DE3531631 C2 DE 3531631C2 DE 3531631 A DE3531631 A DE 3531631A DE 3531631 A DE3531631 A DE 3531631A DE 3531631 C2 DE3531631 C2 DE 3531631C2
- Authority
- DE
- Germany
- Prior art keywords
- layer
- zone
- junction
- oxide layer
- diffusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 37
- 229910052710 silicon Inorganic materials 0.000 claims description 37
- 239000010703 silicon Substances 0.000 claims description 37
- 235000012431 wafers Nutrition 0.000 claims description 34
- 238000009792 diffusion process Methods 0.000 claims description 29
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 26
- 229910052698 phosphorus Inorganic materials 0.000 claims description 24
- 239000011574 phosphorus Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 18
- 230000005684 electric field Effects 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 229910052733 gallium Inorganic materials 0.000 claims description 13
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 12
- 230000003647 oxidation Effects 0.000 claims description 12
- 238000007254 oxidation reaction Methods 0.000 claims description 12
- 239000001301 oxygen Substances 0.000 claims description 12
- 229910052760 oxygen Inorganic materials 0.000 claims description 12
- 125000004429 atom Chemical group 0.000 claims description 11
- 230000007704 transition Effects 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 10
- 239000010931 gold Substances 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 125000004437 phosphorous atom Chemical group 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 6
- 238000005468 ion implantation Methods 0.000 claims description 6
- 230000035515 penetration Effects 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 5
- 229910052796 boron Inorganic materials 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 4
- JAJIPIAHCFBEPI-UHFFFAOYSA-N 9,10-dioxoanthracene-1-sulfonic acid Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2S(=O)(=O)O JAJIPIAHCFBEPI-UHFFFAOYSA-N 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000012266 salt solution Substances 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims 5
- 239000000126 substance Substances 0.000 claims 2
- 230000000903 blocking effect Effects 0.000 description 24
- 239000013078 crystal Substances 0.000 description 11
- 239000002800 charge carrier Substances 0.000 description 8
- 238000000227 grinding Methods 0.000 description 6
- 230000002441 reversible effect Effects 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 230000000873 masking effect Effects 0.000 description 5
- 230000006378 damage Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000010453 quartz Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 238000000407 epitaxy Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000007858 starting material Substances 0.000 description 3
- 230000008961 swelling Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000006735 deficit Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- RLOWWWKZYUNIDI-UHFFFAOYSA-N phosphinic chloride Chemical compound ClP=O RLOWWWKZYUNIDI-UHFFFAOYSA-N 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000005496 tempering Methods 0.000 description 2
- VYDNCCLNAHRIST-UHFFFAOYSA-N 13827-38-8 Chemical compound O1P(=O)(O2)O[Si]31OP2(=O)O3 VYDNCCLNAHRIST-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 230000009760 functional impairment Effects 0.000 description 1
- 150000002258 gallium Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 150000003017 phosphorus Chemical class 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D18/00—Thyristors
- H10D18/241—Asymmetrical thyristors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/60—Impurity distributions or concentrations
Landscapes
- Thyristors (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19853531631 DE3531631A1 (de) | 1985-09-05 | 1985-09-05 | Asymmetrischer thyristor und verfahren zu seiner herstellung |
| DE3650586T DE3650586D1 (de) | 1985-09-05 | 1986-08-11 | Asymmetrischer Thyristor und Verfahren zu seiner Herstellung |
| EP86111060A EP0214485B1 (de) | 1985-09-05 | 1986-08-11 | Asymmetrischer Thyristor und Verfahren zu seiner Herstellung |
| US06/903,632 US4775883A (en) | 1985-09-05 | 1986-09-04 | Asymmetrical thyristor and method for producing same |
| JP61209412A JPS6260259A (ja) | 1985-09-05 | 1986-09-05 | 非対称サイリスタ及びその製法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19853531631 DE3531631A1 (de) | 1985-09-05 | 1985-09-05 | Asymmetrischer thyristor und verfahren zu seiner herstellung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3531631A1 DE3531631A1 (de) | 1987-03-05 |
| DE3531631C2 true DE3531631C2 (enrdf_load_stackoverflow) | 1990-04-19 |
Family
ID=6280145
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19853531631 Granted DE3531631A1 (de) | 1985-09-05 | 1985-09-05 | Asymmetrischer thyristor und verfahren zu seiner herstellung |
| DE3650586T Expired - Lifetime DE3650586D1 (de) | 1985-09-05 | 1986-08-11 | Asymmetrischer Thyristor und Verfahren zu seiner Herstellung |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE3650586T Expired - Lifetime DE3650586D1 (de) | 1985-09-05 | 1986-08-11 | Asymmetrischer Thyristor und Verfahren zu seiner Herstellung |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4775883A (enrdf_load_stackoverflow) |
| EP (1) | EP0214485B1 (enrdf_load_stackoverflow) |
| JP (1) | JPS6260259A (enrdf_load_stackoverflow) |
| DE (2) | DE3531631A1 (enrdf_load_stackoverflow) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01269197A (ja) * | 1988-04-21 | 1989-10-26 | Tokyo Electric Co Ltd | 電子キャッシュレジスタ |
| DE4013626C1 (en) * | 1990-04-27 | 1991-05-29 | Eupec Europaeische Gesellschaft Fuer Leistungshalbleiter Mbh & Co Kg, 4788 Warstein, De | Semiconductor component - with weakly-doped N(-) and more highly-doped N partial zones |
| JP3638873B2 (ja) * | 1998-07-17 | 2005-04-13 | インフィネオン テクノロジース アクチエンゲゼルシャフト | ストップゾーンを有するエミッタ領域を備えたパワー半導体素子 |
| JP3706026B2 (ja) | 1998-07-17 | 2005-10-12 | インフィネオン テクノロジース アクチエンゲゼルシャフト | 高い逆方向電圧用のパワー半導体素子 |
| JP4129106B2 (ja) * | 1999-10-27 | 2008-08-06 | 三菱電機株式会社 | 半導体装置 |
| US8192555B2 (en) * | 2002-12-31 | 2012-06-05 | Micron Technology, Inc. | Non-chemical, non-optical edge bead removal process |
| DE102008049678B4 (de) * | 2008-09-30 | 2020-06-10 | Infineon Technologies Bipolar Gmbh & Co. Kg | Asymmetrisch sperrender Thyristor und Verfahren zur Herstellung eines asymmetrisch sperrenden Thyristors |
| DE102011002479A1 (de) * | 2011-01-05 | 2012-07-05 | Infineon Technologies Bipolar Gmbh & Co. Kg | Verfahren zur Herstellung eines Halbleiterbauelements mit integriertem Lateralwiderstand |
| DE102013216195B4 (de) | 2013-08-14 | 2015-10-29 | Infineon Technologies Ag | Verfahren zur Nachdotierung einer Halbleiterscheibe |
| US9577045B2 (en) | 2014-08-04 | 2017-02-21 | Fairchild Semiconductor Corporation | Silicon carbide power bipolar devices with deep acceptor doping |
| DE102018102234B4 (de) | 2018-02-01 | 2021-05-06 | Infineon Technologies Bipolar Gmbh & Co. Kg | Kurzschluss-Halbleiterbauelement |
| DE102019124695A1 (de) | 2019-08-01 | 2021-02-04 | Infineon Technologies Bipolar Gmbh & Co. Kg | Kurzschluss-Halbleiterbauelement und Verfahren zu dessen Betrieb |
| CN114759087A (zh) * | 2022-04-21 | 2022-07-15 | 西安派瑞功率半导体变流技术股份有限公司 | 一种具有强穿通的非对称快速晶闸管 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53110386A (en) * | 1977-03-08 | 1978-09-27 | Toshiba Corp | Semiconductor device |
| JPS542077A (en) * | 1977-06-08 | 1979-01-09 | Hitachi Ltd | Semiconductor switching element |
| JPS5436192A (en) * | 1977-08-26 | 1979-03-16 | Mitsubishi Electric Corp | Manufacture for semiconductor |
| US4356503A (en) * | 1978-06-14 | 1982-10-26 | General Electric Company | Latching transistor |
| JPS5516497A (en) * | 1978-06-14 | 1980-02-05 | Gen Electric | Gate turnnoff semiconductor switching device |
| JPS5578571A (en) * | 1978-12-08 | 1980-06-13 | Hitachi Ltd | Manufacture of semiconductor device |
| DE3037316C2 (de) * | 1979-10-03 | 1982-12-23 | Tokyo Shibaura Denki K.K., Kawasaki, Kanagawa | Verfahren zur Herstellung von Leistungsthyristoren |
| EP0074133B1 (de) * | 1981-08-25 | 1987-01-28 | BBC Aktiengesellschaft Brown, Boveri & Cie. | Thyristor |
| FR2514558A1 (fr) * | 1981-10-13 | 1983-04-15 | Silicium Semiconducteur Ssc | Procede de fabrication de thyristor asymetrique a diode de conduction inverse par diffusion au phosphure de gallium |
| JPS58207674A (ja) * | 1982-05-29 | 1983-12-03 | Toshiba Corp | サイリスタの製造方法 |
| JPS5913322A (ja) * | 1982-07-15 | 1984-01-24 | Hitachi Ltd | 半導体装置の製造方法 |
| FR2535901A1 (fr) * | 1982-11-10 | 1984-05-11 | Silicium Semiconducteur Ssc | Thyristor asymetrique a forte tenue en tension inverse |
| EP0144876B1 (de) * | 1983-12-07 | 1988-03-09 | BBC Brown Boveri AG | Halbleiterbauelement |
-
1985
- 1985-09-05 DE DE19853531631 patent/DE3531631A1/de active Granted
-
1986
- 1986-08-11 EP EP86111060A patent/EP0214485B1/de not_active Expired - Lifetime
- 1986-08-11 DE DE3650586T patent/DE3650586D1/de not_active Expired - Lifetime
- 1986-09-04 US US06/903,632 patent/US4775883A/en not_active Expired - Lifetime
- 1986-09-05 JP JP61209412A patent/JPS6260259A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE3531631A1 (de) | 1987-03-05 |
| EP0214485A2 (de) | 1987-03-18 |
| EP0214485B1 (de) | 1996-12-18 |
| US4775883A (en) | 1988-10-04 |
| JPS6260259A (ja) | 1987-03-16 |
| DE3650586D1 (de) | 1997-01-30 |
| EP0214485A3 (de) | 1988-03-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| D2 | Grant after examination | ||
| 8327 | Change in the person/name/address of the patent owner |
Owner name: EUPEC EUROPAEISCHE GESELLSCHAFT FUER LEISTUNGSHALB |
|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |