DE3530736A1 - Leitermaterial auf kupferbasis fuer anschluesse von halbleitervorrichtungen - Google Patents

Leitermaterial auf kupferbasis fuer anschluesse von halbleitervorrichtungen

Info

Publication number
DE3530736A1
DE3530736A1 DE19853530736 DE3530736A DE3530736A1 DE 3530736 A1 DE3530736 A1 DE 3530736A1 DE 19853530736 DE19853530736 DE 19853530736 DE 3530736 A DE3530736 A DE 3530736A DE 3530736 A1 DE3530736 A1 DE 3530736A1
Authority
DE
Germany
Prior art keywords
copper
semiconductor devices
conductor material
weight
percent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19853530736
Other languages
German (de)
English (en)
Other versions
DE3530736C2 (enExample
Inventor
Shunichi Aizuwakamatsu Fukushima Chiba
Rensei Aizuwakamatsu Fukushima Futatsuka
Tadao Yukawa Fukushima Sakakibara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Shindoh Co Ltd
Original Assignee
Mitsubishi Shindoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Shindoh Co Ltd filed Critical Mitsubishi Shindoh Co Ltd
Publication of DE3530736A1 publication Critical patent/DE3530736A1/de
Application granted granted Critical
Publication of DE3530736C2 publication Critical patent/DE3530736C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01565—Thermally treating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]

Landscapes

  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DE19853530736 1984-08-31 1985-08-28 Leitermaterial auf kupferbasis fuer anschluesse von halbleitervorrichtungen Granted DE3530736A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59183594A JPS6160846A (ja) 1984-08-31 1984-08-31 半導体装置用銅合金リ−ド材

Publications (2)

Publication Number Publication Date
DE3530736A1 true DE3530736A1 (de) 1986-03-06
DE3530736C2 DE3530736C2 (enExample) 1987-09-24

Family

ID=16138548

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19853530736 Granted DE3530736A1 (de) 1984-08-31 1985-08-28 Leitermaterial auf kupferbasis fuer anschluesse von halbleitervorrichtungen

Country Status (3)

Country Link
US (1) US4750029A (enExample)
JP (1) JPS6160846A (enExample)
DE (1) DE3530736A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4750029A (en) * 1984-08-31 1988-06-07 Mitsubishi Shindoh Co., Ltd. Copper base lead material for leads of semiconductor devices

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6396947A (ja) * 1986-10-13 1988-04-27 Mitsubishi Electric Corp 半導体装置用リ−ドフレ−ム
JP2511289B2 (ja) * 1988-03-30 1996-06-26 株式会社日立製作所 半導体装置
JPH0793400B2 (ja) * 1990-03-06 1995-10-09 株式会社東芝 半導体装置
US5508001A (en) * 1992-11-13 1996-04-16 Mitsubishi Sindoh Co., Ltd. Copper based alloy for electrical and electronic parts excellent in hot workability and blankability
US6455937B1 (en) 1998-03-20 2002-09-24 James A. Cunningham Arrangement and method for improved downward scaling of higher conductivity metal-based interconnects
US6241831B1 (en) * 1999-06-07 2001-06-05 Waterbury Rolling Mills, Inc. Copper alloy
US6521532B1 (en) 1999-07-22 2003-02-18 James A. Cunningham Method for making integrated circuit including interconnects with enhanced electromigration resistance
US6551872B1 (en) 1999-07-22 2003-04-22 James A. Cunningham Method for making integrated circuit including interconnects with enhanced electromigration resistance using doped seed layer and integrated circuits produced thereby
US6441492B1 (en) 1999-09-10 2002-08-27 James A. Cunningham Diffusion barriers for copper interconnect systems
DE102015219183B4 (de) * 2015-10-05 2019-06-06 Infineon Technologies Ag Leistungshalbleiterbauelement, Halbleitermodul, Verfahren zum Verarbeiten eines Leistungshalbleiterbauelements

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2171697A (en) * 1939-03-09 1939-09-05 Mallory & Co Inc P R Alloy

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5853057A (ja) * 1981-09-24 1983-03-29 Hitachi Ltd スタイラスカ−トリツジの動特性自動測定装置
GB2123032B (en) * 1982-06-28 1985-10-02 Bicc Plc Copper-base alloys
JPS6160846A (ja) * 1984-08-31 1986-03-28 Tamagawa Kikai Kinzoku Kk 半導体装置用銅合金リ−ド材

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2171697A (en) * 1939-03-09 1939-09-05 Mallory & Co Inc P R Alloy

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4750029A (en) * 1984-08-31 1988-06-07 Mitsubishi Shindoh Co., Ltd. Copper base lead material for leads of semiconductor devices

Also Published As

Publication number Publication date
DE3530736C2 (enExample) 1987-09-24
JPS6160846A (ja) 1986-03-28
US4750029A (en) 1988-06-07
JPS6254852B2 (enExample) 1987-11-17

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8127 New person/name/address of the applicant

Owner name: MITSUBISHI SHINDOH CO., LTD., TOKIO/TOKYO, JP

D2 Grant after examination
8364 No opposition during term of opposition