DE3525537A1 - Einspannvorrichtung zum schwalloeten von grossformat-leiterplatten bzw. flachbaugruppen - Google Patents

Einspannvorrichtung zum schwalloeten von grossformat-leiterplatten bzw. flachbaugruppen

Info

Publication number
DE3525537A1
DE3525537A1 DE19853525537 DE3525537A DE3525537A1 DE 3525537 A1 DE3525537 A1 DE 3525537A1 DE 19853525537 DE19853525537 DE 19853525537 DE 3525537 A DE3525537 A DE 3525537A DE 3525537 A1 DE3525537 A1 DE 3525537A1
Authority
DE
Germany
Prior art keywords
circuit boards
frame
clamping device
light metal
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19853525537
Other languages
German (de)
English (en)
Other versions
DE3525537C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Diethard Roediger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ROEDIGER, DIETHARD, 8930 SCHWABMUENCHEN, DE
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Priority to DE19853525537 priority Critical patent/DE3525537A1/de
Publication of DE3525537A1 publication Critical patent/DE3525537A1/de
Application granted granted Critical
Publication of DE3525537C2 publication Critical patent/DE3525537C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069—Holders for printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
DE19853525537 1985-07-17 1985-07-17 Einspannvorrichtung zum schwalloeten von grossformat-leiterplatten bzw. flachbaugruppen Granted DE3525537A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19853525537 DE3525537A1 (de) 1985-07-17 1985-07-17 Einspannvorrichtung zum schwalloeten von grossformat-leiterplatten bzw. flachbaugruppen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19853525537 DE3525537A1 (de) 1985-07-17 1985-07-17 Einspannvorrichtung zum schwalloeten von grossformat-leiterplatten bzw. flachbaugruppen

Publications (2)

Publication Number Publication Date
DE3525537A1 true DE3525537A1 (de) 1987-01-29
DE3525537C2 DE3525537C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-06-04

Family

ID=6276011

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19853525537 Granted DE3525537A1 (de) 1985-07-17 1985-07-17 Einspannvorrichtung zum schwalloeten von grossformat-leiterplatten bzw. flachbaugruppen

Country Status (1)

Country Link
DE (1) DE3525537A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008044315A1 (de) 2007-12-13 2009-06-18 Kenan Lennartz Haltevorrichtung für Bauteile auf einer Leiterplatte während eines Lötvorganges

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3778883A (en) * 1972-06-02 1973-12-18 Honeywell Inf Systems Process of mass soldering electrical components to circuit boards having runs formed from insulated magnet wire

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3778883A (en) * 1972-06-02 1973-12-18 Honeywell Inf Systems Process of mass soldering electrical components to circuit boards having runs formed from insulated magnet wire

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008044315A1 (de) 2007-12-13 2009-06-18 Kenan Lennartz Haltevorrichtung für Bauteile auf einer Leiterplatte während eines Lötvorganges

Also Published As

Publication number Publication date
DE3525537C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-06-04

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: ROEDIGER, DIETHARD, 8930 SCHWABMUENCHEN, DE

8320 Willingness to grant licenses declared (paragraph 23)
8339 Ceased/non-payment of the annual fee