DE3525301A1 - Reaktionsharz - Google Patents
ReaktionsharzInfo
- Publication number
- DE3525301A1 DE3525301A1 DE19853525301 DE3525301A DE3525301A1 DE 3525301 A1 DE3525301 A1 DE 3525301A1 DE 19853525301 DE19853525301 DE 19853525301 DE 3525301 A DE3525301 A DE 3525301A DE 3525301 A1 DE3525301 A1 DE 3525301A1
- Authority
- DE
- Germany
- Prior art keywords
- reaction resin
- nitride
- atoms
- filler
- boron nitride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 28
- 239000011347 resin Substances 0.000 title claims abstract description 28
- 239000000945 filler Substances 0.000 claims abstract description 22
- 229910052582 BN Inorganic materials 0.000 claims abstract description 17
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 17
- 125000004433 nitrogen atom Chemical group N* 0.000 claims abstract description 9
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229920000728 polyester Polymers 0.000 claims abstract description 7
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 7
- 239000004945 silicone rubber Substances 0.000 claims abstract description 7
- 229920001567 vinyl ester resin Polymers 0.000 claims abstract description 7
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 16
- 239000004593 Epoxy Substances 0.000 claims description 6
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 5
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 claims description 4
- 125000004429 atom Chemical group 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 229910017083 AlN Inorganic materials 0.000 abstract 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 150000002118 epoxides Chemical class 0.000 abstract 1
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 7
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 7
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- 239000004848 polyfunctional curative Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 3
- 231100000331 toxic Toxicity 0.000 description 3
- 230000002588 toxic effect Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000009827 uniform distribution Methods 0.000 description 2
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19853525301 DE3525301A1 (de) | 1985-07-16 | 1985-07-16 | Reaktionsharz |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19853525301 DE3525301A1 (de) | 1985-07-16 | 1985-07-16 | Reaktionsharz |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3525301A1 true DE3525301A1 (de) | 1987-01-22 |
| DE3525301C2 DE3525301C2 (enExample) | 1990-06-28 |
Family
ID=6275859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19853525301 Granted DE3525301A1 (de) | 1985-07-16 | 1985-07-16 | Reaktionsharz |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE3525301A1 (enExample) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0421193A1 (de) * | 1989-10-02 | 1991-04-10 | Hoechst Aktiengesellschaft | Gut wärmeleitender Verbundwerkstoff |
| DE3934393A1 (de) * | 1989-10-14 | 1991-04-18 | Krauss Marmorheizung Gmbh | Verkleidungs-platte aus stein mit heizleiter |
| EP0531656A3 (en) * | 1991-09-11 | 1993-04-21 | Mitsubishi Denki Kabushiki Kaisha | Low-shrinkage unsaturated wet type polyester resin (b.m.c.) formulation composition having high thermal conductivity and molded circuit breaker and parts formed therefrom |
| US5232970A (en) * | 1990-08-31 | 1993-08-03 | The Dow Chemical Company | Ceramic-filled thermally-conductive-composites containing fusible semi-crystalline polyamide and/or polybenzocyclobutenes for use in microelectronic applications |
| EP0794227A3 (en) * | 1996-03-05 | 1999-12-29 | Advanced Ceramics Corporation | Enhanced boron nitride composition and polymer based high thermal conductivity molding compound |
| EP2447050A1 (en) * | 2010-10-28 | 2012-05-02 | Hamilton Sundstrand Space Systems International, Inc. | Method of making a reinforced resin structure |
| CN107663376A (zh) * | 2016-09-19 | 2018-02-06 | 上海良亿电子科技有限公司 | 一种密封材料及其制备方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107674426A (zh) * | 2016-09-19 | 2018-02-09 | 上海良亿电子科技有限公司 | 一种密封材料及其制备方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3562101A (en) * | 1969-02-19 | 1971-02-09 | Union Carbide Corp | Boron nitride filled paper |
| US4265775A (en) * | 1979-08-16 | 1981-05-05 | International Business Machines Corporation | Non-bleeding thixotropic thermally conductive material |
| US4292225A (en) * | 1980-01-04 | 1981-09-29 | Ford Motor Company | Highly filled thermally conductive elastomers IV |
| DE3323628A1 (de) * | 1983-02-14 | 1985-01-03 | Siemens AG, 1000 Berlin und 8000 München | Optokoppler |
| EP0157931A1 (de) * | 1984-03-29 | 1985-10-16 | Siemens Aktiengesellschaft | Verfahren zur Herstellung von Polyimidazol- und Polyimidazopyrrolon-Vorstufen |
-
1985
- 1985-07-16 DE DE19853525301 patent/DE3525301A1/de active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3562101A (en) * | 1969-02-19 | 1971-02-09 | Union Carbide Corp | Boron nitride filled paper |
| US4265775A (en) * | 1979-08-16 | 1981-05-05 | International Business Machines Corporation | Non-bleeding thixotropic thermally conductive material |
| US4292225A (en) * | 1980-01-04 | 1981-09-29 | Ford Motor Company | Highly filled thermally conductive elastomers IV |
| DE3323628A1 (de) * | 1983-02-14 | 1985-01-03 | Siemens AG, 1000 Berlin und 8000 München | Optokoppler |
| EP0157931A1 (de) * | 1984-03-29 | 1985-10-16 | Siemens Aktiengesellschaft | Verfahren zur Herstellung von Polyimidazol- und Polyimidazopyrrolon-Vorstufen |
Non-Patent Citations (9)
| Title |
|---|
| CA, 102, 79757 * |
| Central Patent Index, 1974, Ref. Nr. 63752V/36 * |
| Central Patent Index, 1975, Ref. Nr. 77851W/47 * |
| Central Patent Index, 1980, Ref. Nr. 34327C/19 * |
| Central Patent Index, 1981, Ref. Nr. 16555D10 * |
| Central Patent Index, 1982, Ref. Nr. 82891E39 * |
| Central Patent Index, 1984, Ref. Nr. 84/066344/11 * |
| Central Patent Index, 1985, Ref. Nr. 85/046907/08 * |
| Central Patent Index, 1985, Ref. Nr. 85/150699/25 * |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0421193A1 (de) * | 1989-10-02 | 1991-04-10 | Hoechst Aktiengesellschaft | Gut wärmeleitender Verbundwerkstoff |
| DE3934393A1 (de) * | 1989-10-14 | 1991-04-18 | Krauss Marmorheizung Gmbh | Verkleidungs-platte aus stein mit heizleiter |
| US5232970A (en) * | 1990-08-31 | 1993-08-03 | The Dow Chemical Company | Ceramic-filled thermally-conductive-composites containing fusible semi-crystalline polyamide and/or polybenzocyclobutenes for use in microelectronic applications |
| EP0531656A3 (en) * | 1991-09-11 | 1993-04-21 | Mitsubishi Denki Kabushiki Kaisha | Low-shrinkage unsaturated wet type polyester resin (b.m.c.) formulation composition having high thermal conductivity and molded circuit breaker and parts formed therefrom |
| US5283542A (en) * | 1991-09-11 | 1994-02-01 | Mitsubishi Denki Kabushiki Kaisha | Low-shrinkage unsaturated wet type polyester resin (B.M.C.) formulation composition having high thermal conductivity and molded circuit breaker and parts formed therefrom |
| EP0794227A3 (en) * | 1996-03-05 | 1999-12-29 | Advanced Ceramics Corporation | Enhanced boron nitride composition and polymer based high thermal conductivity molding compound |
| EP2447050A1 (en) * | 2010-10-28 | 2012-05-02 | Hamilton Sundstrand Space Systems International, Inc. | Method of making a reinforced resin structure |
| US8916075B2 (en) | 2010-10-28 | 2014-12-23 | Hamilton Sundstrand Space Systems International, Inc. | Method of making a reinforced resin structure |
| CN107663376A (zh) * | 2016-09-19 | 2018-02-06 | 上海良亿电子科技有限公司 | 一种密封材料及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3525301C2 (enExample) | 1990-06-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8127 | New person/name/address of the applicant |
Owner name: BRANDAU, EGBERT, DIPL.-CHEM. DR., 8755 ALZENAU, DE |
|
| 8110 | Request for examination paragraph 44 | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |