DE3510933C2 - Handhabungsvorrichtung für Plättchen - Google Patents

Handhabungsvorrichtung für Plättchen

Info

Publication number
DE3510933C2
DE3510933C2 DE3510933A DE3510933A DE3510933C2 DE 3510933 C2 DE3510933 C2 DE 3510933C2 DE 3510933 A DE3510933 A DE 3510933A DE 3510933 A DE3510933 A DE 3510933A DE 3510933 C2 DE3510933 C2 DE 3510933C2
Authority
DE
Germany
Prior art keywords
plate
handling device
chamber
plate carrier
vacuum chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3510933A
Other languages
German (de)
English (en)
Other versions
DE3510933A1 (de
Inventor
Lira Guillermo L Toro
Earl M Jensen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanometrics Inc
Original Assignee
Nanometrics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanometrics Inc filed Critical Nanometrics Inc
Publication of DE3510933A1 publication Critical patent/DE3510933A1/de
Application granted granted Critical
Publication of DE3510933C2 publication Critical patent/DE3510933C2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Specific Conveyance Elements (AREA)
  • Sampling And Sample Adjustment (AREA)
DE3510933A 1984-03-26 1985-03-26 Handhabungsvorrichtung für Plättchen Expired - Fee Related DE3510933C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/593,287 US4604020A (en) 1984-03-26 1984-03-26 Integrated circuit wafer handling system

Publications (2)

Publication Number Publication Date
DE3510933A1 DE3510933A1 (de) 1985-11-14
DE3510933C2 true DE3510933C2 (de) 1995-08-24

Family

ID=24374164

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3510933A Expired - Fee Related DE3510933C2 (de) 1984-03-26 1985-03-26 Handhabungsvorrichtung für Plättchen

Country Status (4)

Country Link
US (1) US4604020A (https=)
JP (1) JPS60227438A (https=)
DE (1) DE3510933C2 (https=)
GB (1) GB2156451B (https=)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0787084B2 (ja) * 1985-02-06 1995-09-20 株式会社日立製作所 真空装置の試料交換機構
US4966519A (en) * 1985-10-24 1990-10-30 Texas Instruments Incorporated Integrated circuit processing system
US5102495A (en) * 1986-04-18 1992-04-07 General Signal Corporation Method providing multiple-processing of substrates
US5308431A (en) * 1986-04-18 1994-05-03 General Signal Corporation System providing multiple processing of substrates
US6103055A (en) * 1986-04-18 2000-08-15 Applied Materials, Inc. System for processing substrates
CA1331163C (en) * 1986-04-18 1994-08-02 Applied Materials, Inc. Multiple-processing and contamination-free plasma etching system
US4699555A (en) * 1986-05-08 1987-10-13 Micrion Limited Partnership Module positioning apparatus
US5076205A (en) * 1989-01-06 1991-12-31 General Signal Corporation Modular vapor processor system
EP0384524A3 (en) * 1989-02-24 1991-10-23 North American Philips Corporation Wafer transfer system
US5098245A (en) * 1989-02-24 1992-03-24 U.S. Philips Corporation High speed wafer handler
KR0170391B1 (ko) * 1989-06-16 1999-03-30 다카시마 히로시 피처리체 처리장치 및 처리방법
US5248371A (en) * 1992-08-13 1993-09-28 General Signal Corporation Hollow-anode glow discharge apparatus
JP3021359U (ja) * 1995-03-28 1996-02-20 有限会社ユニ 鞄
US5833426A (en) * 1996-12-11 1998-11-10 Applied Materials, Inc. Magnetically coupled wafer extraction platform
TW450933B (en) * 1998-11-28 2001-08-21 Mirae Corp A carrier handling apparatus of a module IC handler
US6271606B1 (en) * 1999-12-23 2001-08-07 Nikon Corporation Driving motors attached to a stage that are magnetically coupled through a chamber
US6977014B1 (en) 2000-06-02 2005-12-20 Novellus Systems, Inc. Architecture for high throughput semiconductor processing applications
US6712907B1 (en) * 2000-06-23 2004-03-30 Novellus Systems, Inc. Magnetically coupled linear servo-drive mechanism
US6860965B1 (en) 2000-06-23 2005-03-01 Novellus Systems, Inc. High throughput architecture for semiconductor processing
US6444935B1 (en) * 2000-10-18 2002-09-03 Electro Scientific Industries, Inc. High speed track shutter system for semi-conductor inspection
JP2002261147A (ja) * 2001-03-02 2002-09-13 Seiko Instruments Inc 真空装置および搬送装置
CN1996552B (zh) * 2001-08-31 2012-09-05 克罗辛自动化公司 晶片机
US7893313B2 (en) * 2001-12-18 2011-02-22 Artley John W Reusable incontinence product with insolubilized polyethylene glycol and DMDHEU
USD530352S1 (en) * 2005-02-25 2006-10-17 Harmotec Co., Ltd. Bernoulli effect air nozzle for silicone wafer pickup tool
US20140064888A1 (en) * 2012-09-06 2014-03-06 Texas Instruments Incorporated Appartaus for handling an electronic device and related methodology
CN112928049B (zh) * 2021-01-31 2022-08-05 红蜂维尔(山东)自动化技术有限公司 一种晶片压覆装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US654134A (en) * 1900-05-17 1900-07-24 Abner G Clark Sawbuck.
US3202406A (en) * 1960-07-27 1965-08-24 Clevite Corp Furnace apparatus and conveyor therefor
US3968885A (en) * 1973-06-29 1976-07-13 International Business Machines Corporation Method and apparatus for handling workpieces
US3993018A (en) * 1975-11-12 1976-11-23 International Business Machines Corporation Centrifugal support for workpieces
US4392435A (en) * 1979-08-03 1983-07-12 United Kingdom Atomic Energy Authority Transport apparatus
US4306731A (en) * 1979-12-21 1981-12-22 Varian Associates, Inc. Wafer support assembly
JPS57194531A (en) * 1981-05-26 1982-11-30 Toshiba Corp Electron beam transfer device
US4465416A (en) * 1982-05-17 1984-08-14 The Perkin-Elmer Corporation Wafer handling mechanism
JPS59222922A (ja) * 1983-06-01 1984-12-14 Nippon Telegr & Teleph Corp <Ntt> 気相成長装置
US4500407A (en) * 1983-07-19 1985-02-19 Varian Associates, Inc. Disk or wafer handling and coating system

Also Published As

Publication number Publication date
GB2156451A (en) 1985-10-09
GB2156451B (en) 1987-08-05
GB8506310D0 (en) 1985-04-11
DE3510933A1 (de) 1985-11-14
JPH0240216B2 (https=) 1990-09-10
JPS60227438A (ja) 1985-11-12
US4604020A (en) 1986-08-05

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Legal Events

Date Code Title Description
8128 New person/name/address of the agent

Representative=s name: DIEHL, H., DIPL.-PHYS. DR.RER.NAT., PAT.-ANW., 800

8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee