DE3482990D1 - Einbelichtungsverfahren fuer die herstellung von gedruckten schaltungen. - Google Patents
Einbelichtungsverfahren fuer die herstellung von gedruckten schaltungen.Info
- Publication number
- DE3482990D1 DE3482990D1 DE8484114367T DE3482990T DE3482990D1 DE 3482990 D1 DE3482990 D1 DE 3482990D1 DE 8484114367 T DE8484114367 T DE 8484114367T DE 3482990 T DE3482990 T DE 3482990T DE 3482990 D1 DE3482990 D1 DE 3482990D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- printed circuits
- imposition method
- imposition
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0505—Double exposure of the same photosensitive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0525—Patterning by phototackifying or by photopatterning adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0577—Double layer of resist having the same pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/556,877 US4469777A (en) | 1983-12-01 | 1983-12-01 | Single exposure process for preparing printed circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3482990D1 true DE3482990D1 (de) | 1990-09-20 |
Family
ID=24223191
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8484114367T Expired - Lifetime DE3482990D1 (de) | 1983-12-01 | 1984-11-28 | Einbelichtungsverfahren fuer die herstellung von gedruckten schaltungen. |
Country Status (7)
Country | Link |
---|---|
US (1) | US4469777A (de) |
EP (1) | EP0144063B1 (de) |
JP (1) | JPS60136292A (de) |
AU (1) | AU551316B2 (de) |
BR (1) | BR8406046A (de) |
CA (1) | CA1219378A (de) |
DE (1) | DE3482990D1 (de) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4775611A (en) * | 1983-11-10 | 1988-10-04 | Sullivan Donald F | Additive printed circuit boards with flat surface and indented primary wiring conductors |
US4566186A (en) * | 1984-06-29 | 1986-01-28 | Tektronix, Inc. | Multilayer interconnect circuitry using photoimageable dielectric |
US4567062A (en) * | 1984-10-26 | 1986-01-28 | E. I. Du Pont De Nemours And Company | Process for photoformed plastic multistrate using two layer film |
US4631111A (en) * | 1984-11-27 | 1986-12-23 | E. I. Du Pont De Nemours And Company | Dichromic process for preparation of conductive circuit |
US4572764A (en) * | 1984-12-13 | 1986-02-25 | E. I. Du Pont De Nemours And Company | Preparation of photoformed plastic multistrate by via formation first |
US4615763A (en) * | 1985-01-02 | 1986-10-07 | International Business Machines Corporation | Roughening surface of a substrate |
US4915983A (en) * | 1985-06-10 | 1990-04-10 | The Foxboro Company | Multilayer circuit board fabrication process |
US5254435A (en) * | 1985-06-10 | 1993-10-19 | The Foxboro Company | Method of patterning resist |
US4666818A (en) * | 1985-06-10 | 1987-05-19 | The Foxboro Company | Method of patterning resist for printed wiring board |
US5302494A (en) * | 1985-06-10 | 1994-04-12 | The Foxboro Company | Multilayer circuit board having microporous layers and process for making same |
US5246817A (en) * | 1985-08-02 | 1993-09-21 | Shipley Company, Inc. | Method for manufacture of multilayer circuit board |
US4902610A (en) * | 1985-08-02 | 1990-02-20 | Shipley Company Inc. | Method for manufacture of multilayer circuit board |
US5334488A (en) * | 1985-08-02 | 1994-08-02 | Shipley Company Inc. | Method for manufacture of multilayer circuit board |
US4716093A (en) * | 1986-03-17 | 1987-12-29 | E. I. Du Pont De Nemours And Company | Solvent developable photoresist composition and process of use |
JPS6364394A (ja) * | 1986-09-05 | 1988-03-22 | 株式会社日立製作所 | プリント配線板の製造方法 |
US4707394A (en) * | 1986-09-19 | 1987-11-17 | Firan Corporation | Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby |
US4797508A (en) * | 1986-09-19 | 1989-01-10 | Firan Corporation | Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby |
US4937172A (en) * | 1986-12-02 | 1990-06-26 | E. I. Du Pont De Nemours And Company | Photopolymerizable composition having superior adhesion, articles and processes |
EP0270945B1 (de) * | 1986-12-02 | 1993-04-21 | E.I. Du Pont De Nemours And Company | Photosensible Zusammensetzung mit verbesserter Haftung, Gegenstände und Verfahren |
US4911785A (en) * | 1987-02-04 | 1990-03-27 | Andus Corporation | The method of forming a thin film artwork compounds |
US5011569A (en) * | 1987-02-04 | 1991-04-30 | Andus Corporation | Thin film artwork compounds |
US4897338A (en) * | 1987-08-03 | 1990-01-30 | Allied-Signal Inc. | Method for the manufacture of multilayer printed circuit boards |
JPH01120092A (ja) * | 1987-11-02 | 1989-05-12 | Fujitsu Ltd | 薄膜絶縁層の形成方法 |
US4999136A (en) * | 1988-08-23 | 1991-03-12 | Westinghouse Electric Corp. | Ultraviolet curable conductive resin |
JPH0740496B2 (ja) * | 1989-03-01 | 1995-05-01 | シャープ株式会社 | 電極上への導電性粒子の配置方法 |
US5068714A (en) * | 1989-04-05 | 1991-11-26 | Robert Bosch Gmbh | Method of electrically and mechanically connecting a semiconductor to a substrate using an electrically conductive tacky adhesive and the device so made |
WO1991006137A1 (en) * | 1989-10-13 | 1991-05-02 | The Foxboro Company | Application specific tape automated bonding |
US5260168A (en) * | 1989-10-13 | 1993-11-09 | The Foxboro Company | Application specific tape automated bonding |
JPH04113790U (ja) * | 1991-03-22 | 1992-10-06 | 三菱重工業株式会社 | 無菌水供給装置 |
US5368884A (en) * | 1991-11-06 | 1994-11-29 | Nippon Paint Co., Ltd. | Method of forming solder mask |
JPH0828583B2 (ja) * | 1992-12-23 | 1996-03-21 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 多層プリント回路基板およびその製作方法、およびボール・ディスペンサ |
JP3121213B2 (ja) * | 1994-07-27 | 2000-12-25 | 株式会社日立製作所 | 感光性樹脂組成物 |
US6906423B1 (en) | 2001-06-05 | 2005-06-14 | Kabushiki Kaisha Toshiba | Mask used for exposing a porous substrate |
EP1265468B1 (de) * | 2001-06-05 | 2011-12-28 | Kabushiki Kaisha Toshiba | Verfahren zur Herstellung eines Verbundbauteils |
JP2003255562A (ja) * | 2002-03-04 | 2003-09-10 | Sharp Corp | パターン形成方法及びその方法を用いた表示装置 |
GB0508189D0 (en) * | 2005-04-22 | 2005-06-01 | Eastman Kodak Co | Method of forming flexible electronic circuits |
JP5469830B2 (ja) * | 2008-08-08 | 2014-04-16 | 太陽ホールディングス株式会社 | パターンの形成方法、及び該方法に用いる感光性組成物 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3350498A (en) * | 1965-01-04 | 1967-10-31 | Intellux Inc | Multilayer circuit and method of making the same |
US3436468A (en) * | 1965-05-28 | 1969-04-01 | Texas Instruments Inc | Plastic bodies having regions of altered chemical structure and method of making same |
US3965277A (en) * | 1972-05-09 | 1976-06-22 | Massachusetts Institute Of Technology | Photoformed plated interconnection of embedded integrated circuit chips |
US4234626A (en) * | 1978-02-01 | 1980-11-18 | E. I. Du Pont De Nemours And Company | Producing printed circuits by conjoining metal powder images |
DE2963050D1 (en) * | 1978-02-17 | 1982-07-29 | Du Pont | Use of photosensitive stratum to create through-hole connections in circuit boards |
US4413051A (en) * | 1981-05-04 | 1983-11-01 | Dynamics Research Corporation | Method for providing high resolution, highly defined, thick film patterns |
-
1983
- 1983-12-01 US US06/556,877 patent/US4469777A/en not_active Expired - Lifetime
-
1984
- 1984-11-28 EP EP84114367A patent/EP0144063B1/de not_active Expired - Lifetime
- 1984-11-28 BR BR8406046A patent/BR8406046A/pt unknown
- 1984-11-28 DE DE8484114367T patent/DE3482990D1/de not_active Expired - Lifetime
- 1984-11-29 CA CA000468941A patent/CA1219378A/en not_active Expired
- 1984-11-30 JP JP59252052A patent/JPS60136292A/ja active Granted
- 1984-11-30 AU AU36067/84A patent/AU551316B2/en not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
AU3606784A (en) | 1985-06-06 |
US4469777A (en) | 1984-09-04 |
EP0144063A2 (de) | 1985-06-12 |
CA1219378A (en) | 1987-03-17 |
JPS60136292A (ja) | 1985-07-19 |
EP0144063A3 (en) | 1987-05-20 |
JPH038120B2 (de) | 1991-02-05 |
BR8406046A (pt) | 1985-09-03 |
EP0144063B1 (de) | 1990-08-16 |
AU551316B2 (en) | 1986-04-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |