DE3472421D1 - Etchant composition - Google Patents

Etchant composition

Info

Publication number
DE3472421D1
DE3472421D1 DE8484109546T DE3472421T DE3472421D1 DE 3472421 D1 DE3472421 D1 DE 3472421D1 DE 8484109546 T DE8484109546 T DE 8484109546T DE 3472421 T DE3472421 T DE 3472421T DE 3472421 D1 DE3472421 D1 DE 3472421D1
Authority
DE
Germany
Prior art keywords
etchant composition
etchant
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8484109546T
Other languages
English (en)
Inventor
Enjo Naonori
Tamura Koji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daikin Industries Ltd
Original Assignee
Daikin Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daikin Industries Ltd filed Critical Daikin Industries Ltd
Application granted granted Critical
Publication of DE3472421D1 publication Critical patent/DE3472421D1/de
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Detergent Compositions (AREA)
DE8484109546T 1983-08-10 1984-08-10 Etchant composition Expired DE3472421D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58147213A JPS6039176A (ja) 1983-08-10 1983-08-10 エッチング剤組成物

Publications (1)

Publication Number Publication Date
DE3472421D1 true DE3472421D1 (en) 1988-08-04

Family

ID=15425124

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484109546T Expired DE3472421D1 (en) 1983-08-10 1984-08-10 Etchant composition

Country Status (5)

Country Link
US (1) US4582624A (de)
EP (1) EP0133584B1 (de)
JP (1) JPS6039176A (de)
KR (1) KR900000739B1 (de)
DE (1) DE3472421D1 (de)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4517106A (en) * 1984-04-26 1985-05-14 Allied Corporation Soluble surfactant additives for ammonium fluoride/hydrofluoric acid oxide etchant solutions
US4620934A (en) * 1984-04-26 1986-11-04 Allied Corporation Soluble fluorinated cycloalkane sulfonate surfactant additives for NH4
US4863563A (en) * 1987-01-27 1989-09-05 Olin Corporation Etching solutions containing ammonium fluoride and a nonionic alkyl amine glycidol adduct and method of etching
US4761245A (en) * 1987-01-27 1988-08-02 Olin Corporation Etching solutions containing ammonium fluoride and an alkylphenol polyglycidol ether surfactant
US4761244A (en) * 1987-01-27 1988-08-02 Olin Corporation Etching solutions containing ammonium fluoride and an alkyl polyaccharide surfactant
WO1989011517A1 (en) * 1988-05-16 1989-11-30 Olin Corporation Etching solutions containing anionic sulfate esters of alkylphenol polyglycidol ethers
EP0405886B1 (de) * 1989-06-26 1996-11-27 Hashimoto Chemical Industries Co., Ltd. Oberflächenbehandlungsmittel für Präzisionsoberflächenbehandlung
JPH0353083A (ja) * 1989-07-20 1991-03-07 Morita Kagaku Kogyo Kk 半導体素子の金属汚染を防止する方法
US5258131A (en) * 1990-04-13 1993-11-02 Austen-Chase Industries Inc. Products for treating asbestos
KR0170794B1 (ko) * 1993-02-04 1999-03-30 이노우에 노리유키 습윤성이 우수한 반도체용 웨트에칭 조성물
US5320709A (en) * 1993-02-24 1994-06-14 Advanced Chemical Systems International Incorporated Method for selective removal of organometallic and organosilicon residues and damaged oxides using anhydrous ammonium fluoride solution
US5348627A (en) * 1993-05-12 1994-09-20 Georgia Tech Reserach Corporation Process and system for the photoelectrochemical etching of silicon in an anhydrous environment
WO1994027314A1 (en) * 1993-05-13 1994-11-24 Interuniversitair Microelektronica Centrum Method for semiconductor processing using mixtures of hf and carboxylic acid
JPH07216392A (ja) * 1994-01-26 1995-08-15 Daikin Ind Ltd 洗浄剤及び洗浄方法
US5804034A (en) * 1994-03-21 1998-09-08 Texas Instruments Incorporated Method for manufacturing semiconductor device
JP2914555B2 (ja) * 1994-08-30 1999-07-05 信越半導体株式会社 半導体シリコンウェーハの洗浄方法
TW294831B (de) * 1995-04-26 1997-01-01 Handotai Energy Kenkyusho Kk
KR0175009B1 (ko) * 1995-07-28 1999-04-01 김광호 식각용액 및 이를 이용한 반도체 장치의 식각방법
US5635022A (en) * 1996-02-06 1997-06-03 Micron Technology, Inc. Silicon oxide removal in semiconductor processing
JP3188843B2 (ja) * 1996-08-28 2001-07-16 ステラケミファ株式会社 微細加工表面処理剤及び微細加工表面処理方法
US5753032A (en) * 1996-09-27 1998-05-19 W. R. Grace & Co.-Conn. Composition and method to remove asbestos
US5753034A (en) * 1996-09-27 1998-05-19 W. R. Grace & Co. -Conn. Composition and method to remove asbestos
US5741358A (en) * 1996-09-27 1998-04-21 W. R. Grace & Co.-Conn. Corrosion inhibiting composition for treating asbestos containing materials
US5743841A (en) * 1996-09-27 1998-04-28 W. R. Grace & Co.-Conn. Foam composition for treating asbestos-containing materials and method of using same
US5753031A (en) * 1996-09-27 1998-05-19 W. R. Grace & Co.-Conn. Composition and method to remove asbestos
US5753033A (en) * 1996-09-27 1998-05-19 W. R. Grace & Co.-Conn. Composition and method to remove asbestos
US5753035A (en) * 1996-09-27 1998-05-19 W. R. Grace & Co.-Conn. Composition and method to remove asbestos
US6896826B2 (en) * 1997-01-09 2005-05-24 Advanced Technology Materials, Inc. Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
KR100238234B1 (ko) * 1997-03-20 2000-01-15 윤종용 반도체소자용 인-시튜 세정장치 및 그를 이용한 반도체 소자의 세정방법
DE19805525C2 (de) * 1998-02-11 2002-06-13 Sez Semiconduct Equip Zubehoer Verfahren zum Naßätzen von Halbleiterscheiben zum Erzeugen eines definierten Randbereichs durch Unterätzen
US6310018B1 (en) * 2000-03-31 2001-10-30 3M Innovative Properties Company Fluorinated solvent compositions containing hydrogen fluoride
RU2003112232A (ru) * 2000-09-27 2004-09-20 Асахи Гласс Компани, Лимитед (Jp) Способ получения ацилфторида и соли карбоновой кислоты
US6620743B2 (en) 2001-03-26 2003-09-16 Asm America, Inc. Stable, oxide-free silicon surface preparation
ITMI20020178A1 (it) 2002-02-01 2003-08-01 Ausimont Spa Uso di additivi fluorurati nell'etching o polishing di circuiti integrati
US6849200B2 (en) * 2002-07-23 2005-02-01 Advanced Technology Materials, Inc. Composition and process for wet stripping removal of sacrificial anti-reflective material
US6890452B2 (en) * 2002-11-08 2005-05-10 3M Innovative Properties Company Fluorinated surfactants for aqueous acid etch solutions
US7169323B2 (en) * 2002-11-08 2007-01-30 3M Innovative Properties Company Fluorinated surfactants for buffered acid etch solutions
WO2005045895A2 (en) * 2003-10-28 2005-05-19 Sachem, Inc. Cleaning solutions and etchants and methods for using same
US7479460B2 (en) * 2005-08-23 2009-01-20 Asm America, Inc. Silicon surface preparation
US7319284B2 (en) * 2005-09-02 2008-01-15 Precision Instrument Development Center National Applied Research Laboratories Surface acoustic wave device and method for fabricating the same
US8153019B2 (en) 2007-08-06 2012-04-10 Micron Technology, Inc. Methods for substantially equalizing rates at which material is removed over an area of a structure or film that includes recesses or crevices
US20120295447A1 (en) * 2010-11-24 2012-11-22 Air Products And Chemicals, Inc. Compositions and Methods for Texturing of Silicon Wafers
BR112015006028B1 (pt) 2012-09-20 2021-03-09 Swissinso Holding Inc unidade de envidraçamento laminada, sistema de energia solar e teto solar ou fachada de construção
US11745473B2 (en) 2012-09-20 2023-09-05 Kromatix SA Laminated glazing with coloured reflection and high solar transmittance, and solar energy systems employing the same
CN114761519B (zh) 2021-05-20 2023-06-30 斯泰拉化工公司 微细加工处理剂、和微细加工处理方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4055458A (en) * 1975-08-07 1977-10-25 Bayer Aktiengesellschaft Etching glass with HF and fluorine-containing surfactant
JPS5884974A (ja) * 1981-11-13 1983-05-21 Daikin Ind Ltd エツチング剤組成物
JPS5887974A (ja) * 1981-11-19 1983-05-25 Taiko Denki Seisakusho:Kk 映像信号抽出方式

Also Published As

Publication number Publication date
JPS6219509B2 (de) 1987-04-28
KR850001915A (ko) 1985-04-10
KR900000739B1 (ko) 1990-02-10
JPS6039176A (ja) 1985-02-28
US4582624A (en) 1986-04-15
EP0133584B1 (de) 1988-06-29
EP0133584A1 (de) 1985-02-27

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Legal Events

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